WO2020003979A1 - Robot hand equipped with pad member - Google Patents

Robot hand equipped with pad member Download PDF

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Publication number
WO2020003979A1
WO2020003979A1 PCT/JP2019/022813 JP2019022813W WO2020003979A1 WO 2020003979 A1 WO2020003979 A1 WO 2020003979A1 JP 2019022813 W JP2019022813 W JP 2019022813W WO 2020003979 A1 WO2020003979 A1 WO 2020003979A1
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WO
WIPO (PCT)
Prior art keywords
pad
main body
robot hand
hand
flange
Prior art date
Application number
PCT/JP2019/022813
Other languages
French (fr)
Japanese (ja)
Inventor
啓暉 渡辺
酒井　哲也
Original Assignee
平田機工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 平田機工株式会社 filed Critical 平田機工株式会社
Publication of WO2020003979A1 publication Critical patent/WO2020003979A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Definitions

  • the present invention relates to a robot hand including a pad member for holding a substrate.
  • a transfer robot that holds and transfers a wafer has been used.
  • This transfer robot has a hand connected to the tip of an arm.
  • the hand holds the back surface of the wafer on its upper surface, and transfers the wafer to a cassette or the like that stores the wafer.
  • the hands of these transfer robots have a holding unit for holding a wafer.
  • the holding portion may be formed by directly shaving a member constituting the hand, or may be mounted on the hand with a pad formed of an elastic material such as natural rubber or synthetic rubber.
  • Patent Document 1 discloses a mounting portion connected to an end of a robot arm through an opening, a root portion following the mounting portion, and integrally connected from the root portion. And a suction pad having a skirt portion.
  • the root has a substantially circular cross section, and its outer periphery gradually increases in diameter and continues to the skirt.
  • the skirt has a substantially circular cross section larger than the root, and the skirt from the starting point to the end of the skirt gradually becomes thinner from the starting point to the end of the skirt and is integrally formed.
  • a through hole extending from the bottom surface of the skirt portion to the opening is provided substantially at the center of a surface of the skirt portion that contacts the workpiece on the inner bottom surface.
  • Patent Document 2 discloses a vacuum suction pad attached to a first mounting hole formed in a transfer arm of a substrate transfer device, connected to a vacuum suction path of the transfer arm, and vacuum-sucking a substrate to the transfer arm. I have.
  • Patent Document 1 reduces the contact portion with the workpiece by increasing the thickness of the skirt portion.
  • the contact area between the suction pad and the work tends to be smaller and smaller, and a response is required.
  • the vacuum suction pad of Patent Document 2 is attached to the mounting hole of the transfer arm via a seal member, and the seal member ensures airtightness. Therefore, when the vacuum suction pad is replaced, the seal member also needs to be replaced, and the replacement of the vacuum suction pad becomes complicated.
  • the present invention has been made in view of the above points, and when a wafer is placed and held on a robot hand, stable holding is enabled, and replacement work such as attachment and removal of a pad member is facilitated. Provide a robot hand that can do it.
  • the robot hand of the present invention A robot hand attached to a robot arm for transferring a substrate and holding the substrate, A hand body, A pad member attached to an opening provided in the hand main body and holding the substrate, The pad member, A pad body attached to the opening and having a through hole in the center thereof, A first ring portion provided on the tip side of the pad member and abutting on the substrate; A first flange portion provided integrally with the first ring portion and the pad body portion and extending toward the outside of the pad body portion.
  • the pad can be inserted into the opening of the hand main body, which is the pad mounting hole, while the pad is deformed so as to be crushed, so that the work of attaching and removing the pad from the opening becomes easy.
  • the pad member A second ring portion provided on the rear end side of the pad member and formed in the same shape as the first ring portion; A second flange portion provided integrally with the second ring portion and the pad body portion and seated on the hand body portion may be further provided.
  • first ring portion and the second ring portion have a symmetrical structure, either the first ring portion or the second ring portion may be the side that comes into contact with the substrate. Furthermore, erroneous installation when attaching the pad to the robot hand can be prevented, and the ease of attaching the pad can be enhanced.
  • the pad member may further include a third flange provided integrally with the pad body at a rear end side thereof and extending toward the outside of the pad body.
  • the pad can be easily attached to the opening of the robot hand.
  • the hand main body may have a passage therein, one end of which is communicated with the opening, and the other end of which is connected to a suction / exhaust unit.
  • the suction / exhaust unit when the cycle time is insufficient without suction, for example, the suction / exhaust unit is separately provided, and the vacuum transfer is performed through the vacuum suction path, so that the transfer can be reliably performed while holding the substrate. Becomes possible.
  • the pad body is a cylindrical member
  • the first flange portion may have a tapered portion that increases in diameter from the first ring portion side to the pad body portion side.
  • the second flange portion may have a tapered portion that increases in diameter from the second ring portion side to the pad body portion side.
  • the pad can be easily attached to the opening of the robot hand.
  • the pad member may be attached to the hand main body by holding the hand main body between the first flange and the second flange.
  • the pad member may be attached to the hand main body by holding the hand main body between the first flange and the third flange.
  • the pad member may be made of a conductive resin obtained by dispersing conductive particles in a resin composition.
  • An outer diameter of the first ring portion may be formed to be smaller than an outer diameter of the pad body.
  • the contact area between the substrate and the contact surface (the first ring portion) of the pad can be reduced, so that adhesion of particles to the substrate due to contact of the pad with the substrate is suppressed. be able to.
  • a robot hand which can stably hold a wafer when the wafer is placed and held on the robot hand, and which can easily perform replacement work such as mounting and removing a pad member. it can.
  • FIG. 4 is a sectional view taken along line IV-IV of FIG. 3. It is a perspective view showing an example of the robot hand concerning the present invention.
  • FIG. 6 is a sectional view taken along line VI-VI of FIG. 5. It is sectional drawing which shows the modification of the pad which concerns on this invention. It is a partial enlarged front view showing a modification of the pad concerning the present invention. It is a partial enlarged front view showing a modification of the pad concerning the present invention. It is a partial enlarged front view showing a modification of the pad concerning the present invention. It is a partial enlarged front view showing a modification of the pad concerning the present invention.
  • a pad 1 (an example of a pad member) according to the embodiment will be described with reference to FIGS.
  • the pad 1 is used, for example, as a component that holds a wafer (an example of a substrate) that is a material for manufacturing a semiconductor device.
  • the pad 1 is used by being attached to a hand (hereinafter, referred to as a robot hand) connected to the tip of an arm (an example of a robot arm) of an industrial robot, for example, a wafer transfer robot for transferring wafers between facilities. Can be done. Details of the robot hand will be described later.
  • the pad 1 is provided at a main body (pad main body) 2 provided at a central portion and at both ends in a height direction (a vertical direction in FIG. 2) of the main body 2.
  • the holding portion 3 in the present embodiment includes a first holding portion 3A provided at one end portion (for example, an upper end portion in FIGS. 2 and 4) of the main body portion 2 and an end portion opposite to the first holding portion 3A. (For example, a lower end portion in FIGS. 2 and 4).
  • the main body 2 and the holding parts 3A, 3B are formed integrally.
  • the main body 2 is a cylindrical member.
  • the height of the main body 2 is set, for example, to be substantially the same as the thickness (the vertical height in FIG. 6) of the hand main body 110 at an opening 101 (see FIG. 6) described later.
  • the height of the main body 2 is, for example, about 1 to 2 mm.
  • the outer diameter R1 of the main body 2 is formed to be the same as or slightly larger than the inner diameter of an opening 101 (see FIG. 6) described later.
  • the outer diameter R1 of the main body 2 is formed slightly larger than the same diameter as the inner diameter of the opening 101.
  • a through hole 5 is formed at the center of the main body 2 and at the center of the holder 3 (3A, 3B) so as to communicate the main body 2 with the holder 3 (3A, 3B).
  • the through hole 5 in this embodiment has a circular cross section and a uniform diameter in the height direction of the pad 1.
  • the holding unit 3 (3A, 3B) has a ring 31 (31A, 31B) that comes into contact with the wafer or the like when the wafer or the like as the target member is held (placed).
  • the ring portion 31 (31A, 31B) is formed in an annular shape at the edge of the through hole 5.
  • the ring 31A and the ring 31B may have substantially the same shape.
  • the ring portion 31A and the ring portion 31B are formed in an annular shape having the same diameter.
  • the outer diameter R2 of the ring 31 (31A, 31B) is formed to be smaller than the outer diameter R1 of the main body 2.
  • the outer diameter R2 of the ring portion 31 (31A, 31B) is formed slightly larger than the diameter R4 of the through hole 5 (see FIG. 4).
  • the ring portion 31 (31A, 31B) is formed to be substantially flat so as to be orthogonal to the height direction of the main body 2. The wafer is held in a state of being in contact with one of the ring portion 31A (an example of a first ring portion) of the first holding portion 3A and the ring portion 31B (an example of the second ring portion) of the second holding portion 3B. Is done.
  • the holding portion 3 (3A, 3B) is provided between the ring portion 31 (31A, 31B) and the main body portion 2 with a flange portion 32 (1) provided integrally with the main body portion 2 and the ring portion 31 (31A, 31B). 32A, 32B).
  • the flange 32 (32A, 32B) includes a tapered portion 33 (33A, 33B) and a seating surface 34 (34A, 34B).
  • the tapered portion 33 (33A, 33B) is formed so as to increase in diameter from the ring portion 31 (31A, 31B) side toward the main body portion 2 side.
  • the seating surface 34 is formed in a portion of the flange 32 (32A, 32B) in contact with the main body 2, and is formed in parallel with a plane orthogonal to the height direction of the main body 2. That is, the outer diameter R3 of the flange 32 (32A, 32B) is formed to be larger than the outer diameter R1 of the main body 2.
  • the seating surface 34 (34A, 34B) is a surface that contacts a part of the robot hand 100 when the pad 1 is attached to the robot hand 100.
  • the holding portions 3 are formed in a truncated cone shape.
  • the first holding portion 3A provided at the upper end of the main body 2 is formed so that the diameter decreases toward the ring portion 31A.
  • the second holding portion 3B provided at the lower end of the main body 2 is formed such that the diameter decreases toward the ring portion 31B.
  • the first holding portion 3A and the second holding portion 3B are formed so as to have a symmetrical structure with the main body 2 therebetween.
  • the bottom view of the pad 1 is the same as the plan view shown in FIG.
  • the rear view and the left and right side views of the pad 1 are the same as the front view shown in FIG.
  • the area of the ring portion 31 (31A, 31B) is formed to be, for example, 0.1 to 1 square millimeter (mm 2 ) or less. If the area of the ring portion 31 (31A, 31B) is less than 0.1 mm 2 , there is a possibility that poor contact with the wafer may occur. On the other hand, if the area of the ring portion 31 (31A, 31B) is larger than 1 mm 2, there is a possibility that particles adhere to the wafer. For example, when the diameter R4 of the through hole 5 is 4 mm, the radial width W of the ring portion 31 (31A, 31B) is formed to be 0.01 mm to 0.065 mm.
  • the area of the ring 31 (31A, 31B) varies depending on the total allowable contact area S between all the pads 1 attached to the robot hand 100 and the wafer, that is, the number of the pads 1. Assuming that the total allowable contact area S between all the pads 1 and the wafer is constant, as the number of the pads 1 increases to one, two, three,... 31A, 31B) are reduced to S, S / 2, S / 3,... In other words, when the allowable total contact area S between all the pads 1 and the wafer is determined and the number of all the pads 1 attached to the robot hand 100 is determined, the ring portion 31 (31A, 31B) Is uniquely determined.
  • the total contact area S is 3 mm 2 or less
  • the total number of pads 1 is three
  • the diameter R4 of the through hole 5 is 4 mm
  • the outer diameter R2 of the ring 31 (31A, 31B) is 4.13 mm.
  • the radial width W of the ring portion 31 (31A, 31B) is 0.065 mm.
  • the area of the ring portions 31 (31A, 31B) is 0.83 mm 2
  • the total area of the ring portion 31 satisfies 2.49 2
  • the total contact area S a (3 mm 2 or less).
  • the total contact area S is 0.5 mm 2 or less
  • the total number of pads 1 is 3
  • the diameter R4 of the through hole 5 is 4 mm
  • the outer diameter R2 of the ring portions 31 (31A, 31B) is 4.02 mm.
  • the radial width W of the ring portion 31 (31A, 31B) is 0.01 mm. In this case, satisfying the ring portion 31 (31A, 31B) area of 0.13 mm 2, the total area of 0.39 mm 2 next to the ring portion 31, the contact total area S (0.5 mm 2 or less).
  • the main body 2 and the holding parts 3 (3A, 3B) constituting the pad 1 are made of a conductive resin obtained by dispersing conductive particles in a resin composition.
  • the main body 2 and the holding parts 3 (3A, 3B) can be made of, for example, a fluororesin such as polytetrafluoroethylene, perfluoroalkoxyalkane, ethylene tetrafluoroethylene copolymer, or the like.
  • a fluororesin such as polytetrafluoroethylene, perfluoroalkoxyalkane, ethylene tetrafluoroethylene copolymer, or the like.
  • As the resin composition all other resins commonly used for pads of robot hands for handling semiconductor wafers can be applied.
  • FIG. 5 is a perspective view showing the robot hand 100 including the pad 1.
  • FIG. 6 is a sectional view of the robot hand 100 taken along the line VI-VI.
  • the robot hand 100 is provided with a plurality (three in this embodiment) of pads 1 for holding a wafer at its tip. Further, the robot hand 100 includes a suction / exhaust unit (not shown), and each pad 1 is connected to the suction / exhaust unit via a passage 102 described later.
  • the pad 1 attached to the robot hand 100 holds the wafer and the like so that the wafer and the like do not shift with respect to the robot hand 100 or drop from the robot hand 100 by vacuum-sucking the wafer.
  • the robot hand 100 is made of, for example, a ceramic material such as alumina.
  • the robot hand 100 has a hand main body 110, an opening 101 for attaching the pad 1, and a passage 102 (a part of the intake / exhaust unit) communicating with the opening 101.
  • the opening 101 is a hole formed in a holding surface 103 (upper surface in FIG. 6) which is a surface of the hand main body 110 on which a wafer or the like is held, and is communicated with the passage 102.
  • the opening 101 in the present embodiment has a circular cross section and a uniform diameter in the thickness direction of the hand main body 110 at the opening 101.
  • the diameter of the opening 101 is formed to be substantially the same as or slightly smaller than the outer diameter R1 of the main body 2.
  • the passage portion 102 is formed by sealing a groove formed on a surface (back surface) 104 of the hand main body 110 opposite to the holding surface 103 with a lid member (seal member) 105.
  • An end (the right end in FIG. 6) of the passage 102 is connected to a suction / exhaust unit (not shown).
  • One of the holding portions 3 (3A or 3B) of the pad 1 is inserted into the opening 101 from the holding surface 103 side of the hand main body 110 while being elastically deformed.
  • the flange portion 32 (32A, 32B) includes the tapered portion 33 (33A, 33B)
  • the holding portion 3 (3A or 3B) is guided into the opening portion 101 while being self-aligned.
  • the largest diameter portion 321 (see FIG. 6) of the flange portion 32 (32A, 32B) is elastically deformed while being folded toward the main body portion 2 and elastically deformed to the original shape after completely passing through the opening 101.
  • the holding portion 3 (3A or 3B) comes into close contact with the lower edge of the opening 101.
  • the flange 32B (tapered portion 33B) of the second holding portion 3B enters the opening 101, and the second holding portion 3B (the ring portion 31B and the flange 32B). ) are arranged in the passage portion 102.
  • the seating surface 34B of the second holding portion 3B arranged in the passage portion 102 abuts (sits) on the inner wall surface of the passage portion 102 (the upper surface of the passage portion 102 in FIG. 6).
  • the main body 2 of the pad 1 is in contact with the inner peripheral surface of the opening 101, and both are in close contact with each other.
  • the first holding portion 3A is not inserted into the opening 101, but is arranged outside the opening 101 (above the holding surface 103 in FIG. 6), and the seating surface 34A of the first holding portion 3A is It is attached in a state where it abuts on 103. That is, the pad 1 is securely attached to the hand main body 110 by holding the hand main body 110 between the flange 32A of the first holding part 3A and the flange 32B of the second holding part 3B.
  • the mounting position of the pad 1 attached to the robot hand 100 is defined by the flange portion 32A of the first holding portion 3A and the flange portion 32B of the second holding portion 3B at an appropriate position.
  • the through hole 5 of the pad 1 and the passage 102 of the robot hand 100 are communicated.
  • the air in the through-hole 5 and the passage portion 102 is evacuated by the operation of the suction / exhaust unit, so that the wafer placed on the robot hand 100 is vacuum-sucked on the ring portion 31A of the pad 1. .
  • the robot hand 100 includes the hand main body 110 and the pad 1 attached to the opening 101 provided in the hand main body 110 and holding a wafer.
  • the pad 1 is attached to the opening 101 and has a through-hole 5 at the center thereof, a main body 2 (an example of a pad main body), rings 31 provided at both ends of the pad 1, a ring 31 and a main body.
  • a flange portion 32 provided integrally with the portion 2 and extending toward the outside of the main body portion 2.
  • the outer diameter R2 of the ring portion 31 is formed to be smaller than the outer diameter R1 of the main body portion 2.
  • the pad 1 can be attached to the robot hand 100 simply by inserting the pad 1 into the opening 101 of the hand main body 110, which is a pad attachment hole, while deforming the pad 1 so as to crush it. For this reason, a special instrument or member is not required when attaching and detaching the pad 1 to and from the opening 101. Therefore, the attachment / detachment operation is easy, and the cost of members associated with the attachment / detachment is zero.
  • the pad 1 is made of a resin composition containing conductive particles, the pad 1 is brought into contact with the wafer to ground the static electricity charged on the wafer. As a result, there is no possibility that a spark will occur between the pad 1 and the wafer. As a result, there is no risk of damage to the wafer, and the yield of the wafer is improved.
  • the ring 31 is provided with a ring 31A (an example of a first ring) provided on the front end side of the pad 1 and a ring provided on the rear end side of the pad 1.
  • the flange portion 32 includes a ring portion 31B (an example of a second ring portion) formed in the same shape as the portion 31A, and the flange portion 32 is provided integrally with the ring portion 31A and the main body portion 32 (first flange portion 32A).
  • a flange portion) and a flange portion 32B (an example of a second flange portion) provided integrally with the ring portion 31B and the main body portion 2.
  • the ring portion 31A and the ring portion 31B have a symmetric structure, either the ring portion 31A or the ring portion 31B may be on the side that comes into contact with the wafer. Furthermore, since the flange 32A and the flange 32B also have a symmetrical structure, erroneous installation when mounting the pad 1 on the robot hand 100 can be prevented, and the mounting of the pad 1 is easy.
  • the hand main body 110 has a passage portion 102 in which one end is communicated with the opening 101 and the other end is connected to the intake / exhaust unit. . Accordingly, if the wafer is transferred without being sucked to the pad and the cycle time of the wafer transfer is insufficient or the suction force is insufficient, the suction and exhaust unit is separately provided and the passage unit 102 is provided. By evacuating the wafer, it is possible to transfer the wafer while securely holding the wafer.
  • the hand main body 110 when the pad 1 is attached to the hand main body 110, the hand main body 110 is sandwiched between the flange 32A and the flange 32B, and the pad 1 is securely attached to the hand main body 110. It is held in close contact. Thereby, it is possible to prevent the pad 1 from dropping from the robot hand 100.
  • the pad 1 when the pad 1 is worn by use, it is not necessary to replace the robot hand 100 itself, and only the pad 1 needs to be attached and replaced. In addition, no special tools or members are required for the replacement, and it can be easily removed and attached by hand. Further, the pad 1 is free from the front and back when the pad is first attached. After the pad 1 is first attached and the front side is used, the pad 1 is once removed and the opposite back side (the side located in the passage portion 102) is removed. Can be reused. Therefore, the time required for the replacement work can be significantly reduced, and there is no cost for the members required for replacement, and one pad 1 can be used twice.
  • the pad 1 when the pad 1 is attached to the robot hand 100, it is not necessary to attach a sealing member or the like such as a vacuum suction pad disclosed in Patent Document 2, for example. 1 can be easily replaced.
  • the holding portion 3 including the ring portion 31 and the flange portion 32 is provided at both ends of the main body portion 2.
  • the holding portion 3 may be configured to be provided at at least one end of the main body 2.
  • a holding portion having a different shape from the holding portion 3 of the above-described embodiment is attached to the end of the main body 2 on the side to be inserted into the hand main body 110 (FIG. (Lower end).
  • the holding portion 3BA on the side inserted into the hand main body 110 has a flange 32BA (an example of a third flange) extending toward the outside of the main body 2.
  • the flange portion 32BA is formed at the edge of the through-hole 5 in parallel with a surface orthogonal to the height direction of the main body 2, and is formed vertically from the outer end of the surface 35BA toward the main body 2.
  • Surface 33BA, and a surface (seating surface) 34BA formed at a portion of the flange portion 32BA in contact with the main body 2 and formed in parallel with a surface orthogonal to the height direction of the main body 2.
  • the pad 1A can be attached in a state in which the pad 1A is securely adhered to the robot hand 100 by sandwiching the hand main body 110 between the flanges 32A and 32BA at both ends of the main body 2. Therefore, it is possible to prevent the pad 1A from falling off from the robot hand 100.
  • the shape of the main body 2 is cylindrical, but is not limited to this.
  • the main body 2 is appropriately selected according to the shape of the opening 101, and may be, for example, a prism such as a quadrangular prism or a polygonal prism.
  • the shape of the holding portion 3 (3A, 3B) is a truncated cone, but the shape is not limited to this.
  • the holding unit 3 is also appropriately selected according to the shape of the opening 101, and may be, for example, a truncated pyramid.
  • the ring portion 31 (31A, 31B) has a substantially flat shape orthogonal to the axial direction of the main body 2, but is not limited thereto.
  • the annular portion 31 (31A, 31B) has, for example, an inclined surface that is gradually inclined toward the inner side (as it approaches the through hole 5) toward the flange portion 32 (32A, 32B) or an outer surface (the through hole 5). May be formed as an inclined surface that is gradually inclined toward the flange portion 32 (32A, 32B) side (as the distance from the flange portion increases).
  • the outer peripheral edge of the ring 31 (31A, 31B) is in contact with the wafer
  • the inner peripheral edge of the ring 31 (31A, 31B) is in contact with the wafer.
  • the tapered portions 33 are formed so that the ridge shape in a front view is straight, but the present invention is not limited to this.
  • the ridgeline shape in a front view may be an upwardly convex arched tapered portion 33C (see FIG. 8) or a downwardly concave arched tapered portion 33D (see FIG. 9).
  • the tapered portion may not be continuous, and may be a tapered portion 33 ⁇ / b> E (see FIG. 10) having a stepped ridge shape in a front view.
  • the present invention is not limited to the above-described embodiment, and may be appropriately modified and improved.
  • the material, shape, dimension, numerical value, form, number, arrangement location, and the like of each component in the above-described embodiment are arbitrary and are not limited as long as the present invention can be achieved.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

This robot hand (100), that is attached to a robot arm for transferring a substrate and holds the substrate, is equipped with a hand body part (110) and a pad member (1) that is attached to an opening section (101) provided in the hand body part (110) and holds the substrate. The pad member (1) is equipped with: a pad body part (2) that is attached to the opening section (101) of the robot hand (100) and has, in the center section thereof, a through-hole (5); a first annular part (31A) that is provided on the tip side of the pad member (1) and is brought into contact with the substrate; and a first flange part (32A) that is provided integrally with the first annular part (31A) and the pad body part (2) and extends toward the outside of the pad body part (2).

Description

パッド部材を備えたロボットハンドRobot hand with pad member
　本発明は、基板を保持するパッド部材を備えたロボットハンドに関する。 The present invention relates to a robot hand including a pad member for holding a substrate.
　従来から、半導体製造の分野においては、ウエハを保持して搬送する搬送ロボットが用いられている。この搬送ロボットは、アームの先端に連結されたハンドを有している。ハンドは、その上面でウエハの裏面を保持し、ウエハを収納するカセット等との間においてウエハの受け渡しを行う。
　これらの搬送ロボットのハンドは、ウエハを保持するための保持部を有している。保持部は、ハンドを構成している部材を直接削り出して形成するものや、天然ゴムや合成ゴム等の弾性材料により成形されたパッドをハンドに装着するものもある。 Conventionally, in the field of semiconductor manufacturing, a transfer robot that holds and transfers a wafer has been used. This transfer robot has a hand connected to the tip of an arm. The hand holds the back surface of the wafer on its upper surface, and transfers the wafer to a cassette or the like that stores the wafer.
The hands of these transfer robots have a holding unit for holding a wafer. The holding portion may be formed by directly shaving a member constituting the hand, or may be mounted on the hand with a pad formed of an elastic material such as natural rubber or synthetic rubber.
　このようなロボットアームのハンドにおいてパッドが用いられる例として、特許文献１は、ロボットのアーム先端に開口を通じて接続される取付部と、取付部に続く根本部と、根本部から一体的に連設されたスカート部とを備えた吸着用パッドを開示している。根本部は、略円形の断面を有し、その外周が徐々に拡径してスカート部に続いている。スカート部は、根本部より大きい略円形断面を呈し、スカート部の始点から終点に至る裾部は、スカート部の始点から終点にかけて徐々に薄くなって一体的に形成されている。スカート部の内部底面でワークと接する面の略中心部には、スカート部底面から開口まで達する貫通孔が設けられている。 As an example in which a pad is used in a hand of such a robot arm, Patent Document 1 discloses a mounting portion connected to an end of a robot arm through an opening, a root portion following the mounting portion, and integrally connected from the root portion. And a suction pad having a skirt portion. The root has a substantially circular cross section, and its outer periphery gradually increases in diameter and continues to the skirt. The skirt has a substantially circular cross section larger than the root, and the skirt from the starting point to the end of the skirt gradually becomes thinner from the starting point to the end of the skirt and is integrally formed. A through hole extending from the bottom surface of the skirt portion to the opening is provided substantially at the center of a surface of the skirt portion that contacts the workpiece on the inner bottom surface.
　特許文献２は、基板搬送装置の搬送アームに形成された第１の取付孔に取り付けられ、搬送アームの真空吸引路に連結されて、基板を搬送アームに真空吸着する真空吸着パッドを開示している。 Patent Document 2 discloses a vacuum suction pad attached to a first mounting hole formed in a transfer arm of a substrate transfer device, connected to a vacuum suction path of the transfer arm, and vacuum-sucking a substrate to the transfer arm. I have.
日本国実用新案登録第２５８６２６１号公報Japanese Utility Model Registration No. 2586261 日本国特許第５３７９５８９号公報Japanese Patent No. 5379589
　しかしながら、上記のパッドを使用したロボットハンドによりウエハを保持して搬送する場合には次のような問題がある。 However, when the wafer is held and transported by the robot hand using the pad, there are the following problems.
　特許文献１の吸着用パッドは、スカート部の裾部を厚くすることによりワークとの接触部分を少なくするものである。ところが、近年において、吸着用パッドとワークとの接触面積はますます小さくなる傾向にあり、その対応が求められている。 吸着 The suction pad of Patent Document 1 reduces the contact portion with the workpiece by increasing the thickness of the skirt portion. However, in recent years, the contact area between the suction pad and the work tends to be smaller and smaller, and a response is required.
　特許文献２の真空吸着パッドは、搬送アームの取付孔にシール部材を介して取り付けられており、シール部材により気密性を確保している。そのため、真空吸着パッドの交換時にシール部材も交換する必要があり、真空吸着パッドの交換作業が煩雑となる。 真空 The vacuum suction pad of Patent Document 2 is attached to the mounting hole of the transfer arm via a seal member, and the seal member ensures airtightness. Therefore, when the vacuum suction pad is replaced, the seal member also needs to be replaced, and the replacement of the vacuum suction pad becomes complicated.
　本発明は、上記の点に鑑みてなされたものであり、ロボットハンドにウエハを載せて保持する場合、安定した保持を可能とし、また、パッド部材の取付けや取外しなどの交換作業を容易にすることができるロボットハンドを提供する。 The present invention has been made in view of the above points, and when a wafer is placed and held on a robot hand, stable holding is enabled, and replacement work such as attachment and removal of a pad member is facilitated. Provide a robot hand that can do it.
　上記目的を達成するために、本発明のロボットハンドは、
　基板を移載するロボットアームに取り付けられ、前記基板を保持するロボットハンドであって、
　ハンド本体部と、
　該ハンド本体部に設けられた開口部に取り付けられ、前記基板を保持するパッド部材と、を備え、
　前記パッド部材は、
　　前記開口部に取り付けられ、その中央部に貫通孔を有するパッド本体部と、
　　前記パッド部材の先端側に設けられ、前記基板に当接される第１の環部と、
　　前記第１の環部および前記パッド本体部と一体に設けられ、前記パッド本体部の外側に向かって延設される第１の鍔部と、を備えていることを特徴とする。 In order to achieve the above object, the robot hand of the present invention
A robot hand attached to a robot arm for transferring a substrate and holding the substrate,
A hand body,
A pad member attached to an opening provided in the hand main body and holding the substrate,
The pad member,
A pad body attached to the opening and having a through hole in the center thereof,
A first ring portion provided on the tip side of the pad member and abutting on the substrate;
A first flange portion provided integrally with the first ring portion and the pad body portion and extending toward the outside of the pad body portion.
　この構成によれば、パッドを押しつぶすように変形させながらパッド取付孔であるハンド本体部の開口部に差し込むことができるため、開口部へのパッドの取付けおよび取外し作業が容易になる。 According to this configuration, the pad can be inserted into the opening of the hand main body, which is the pad mounting hole, while the pad is deformed so as to be crushed, so that the work of attaching and removing the pad from the opening becomes easy.
　また、本発明のロボットハンドにおいて、
　前記パッド部材は、
　　前記パッド部材の後端側に設けられ、前記第１の環部と同形状で形成された第２の環部と、
　　前記第２の環部および前記パッド本体部と一体に設けられ、前記ハンド本体部に着座される第２の鍔部と、をさらに備えていてもよい。 In the robot hand of the present invention,
The pad member,
A second ring portion provided on the rear end side of the pad member and formed in the same shape as the first ring portion;
A second flange portion provided integrally with the second ring portion and the pad body portion and seated on the hand body portion may be further provided.
　この構成によれば、第１の環部と第２の環部とが対称構造であるため、第１の環部と第２の環部のどちらを基板と接触する側としてもよい。さらに、ロボットハンドにパッドを取り付ける際の誤設置を防止することができ、パッドの取付容易性を高めることができる。 According to this configuration, since the first ring portion and the second ring portion have a symmetrical structure, either the first ring portion or the second ring portion may be the side that comes into contact with the substrate. Furthermore, erroneous installation when attaching the pad to the robot hand can be prevented, and the ease of attaching the pad can be enhanced.
　また、本発明のロボットハンドにおいて、
　前記パッド部材は、
　前記パッド部材の後端側に前記パッド本体部と一体に設けられ、前記パッド本体部の外側に向かって延設される第３の鍔部をさらに備えていてもよい。 In the robot hand of the present invention,
The pad member,
The pad member may further include a third flange provided integrally with the pad body at a rear end side thereof and extending toward the outside of the pad body.
　この構成によれば、第３の鍔部を備えることで、パッドをロボットハンドの開口部へ容易に取り付けることができる。 According to this configuration, by providing the third flange, the pad can be easily attached to the opening of the robot hand.
　また、本発明のロボットハンドにおいて、
　前記ハンド本体部は、その内部に、一端部が前記開口部と連通され、他端部が吸排気ユニットに接続される通路部を有していてもよい。 In the robot hand of the present invention,
The hand main body may have a passage therein, one end of which is communicated with the opening, and the other end of which is connected to a suction / exhaust unit.
　この構成によれば、吸着なしでサイクルタイムが不足する場合などには、吸排気ユニットを別に設けて真空吸引路を介して真空引きを行うことにより、確実に基板を保持したまま移載することが可能となる。 According to this configuration, when the cycle time is insufficient without suction, for example, the suction / exhaust unit is separately provided, and the vacuum transfer is performed through the vacuum suction path, so that the transfer can be reliably performed while holding the substrate. Becomes possible.
　また、本発明のロボットハンドにおいて、
　前記パッド本体部は、円筒部材であり、
　前記第１の鍔部は、前記第１の環部側から前記パッド本体部側に向かって拡径するテーパ部を有していてもよい。 In the robot hand of the present invention,
The pad body is a cylindrical member,
The first flange portion may have a tapered portion that increases in diameter from the first ring portion side to the pad body portion side.
　また、本発明のロボットハンドにおいて、
　前記第２の鍔部は、前記第２の環部側から前記パッド本体部側に向かって拡径するテーパ部を有していてもよい。 In the robot hand of the present invention,
The second flange portion may have a tapered portion that increases in diameter from the second ring portion side to the pad body portion side.
　これらの構成によれば、パッドをロボットハンドの開口部へ容易に取り付けることができる。  According to these configurations, the pad can be easily attached to the opening of the robot hand.
　また、本発明のロボットハンドにおいて、
　前記パッド部材は、前記ハンド本体部を前記第１の鍔部および前記第２の鍔部で挟持させることで、前記ハンド本体部に取り付けられてもよい。 In the robot hand of the present invention,
The pad member may be attached to the hand main body by holding the hand main body between the first flange and the second flange.
　この構成によれば、ロボットハンドからのパッドの脱落を防止することができる。 According to this configuration, it is possible to prevent the pad from falling off the robot hand.
　また、本発明のロボットハンドにおいて、
　前記パッド部材は、前記ハンド本体部を前記第１の鍔部および前記第３の鍔部で挟持させることで、前記ハンド本体部に取り付けられてもよい。 In the robot hand of the present invention,
The pad member may be attached to the hand main body by holding the hand main body between the first flange and the third flange.
　この構成によれば、ロボットハンドからのパッドの脱落を防止することができる。 According to this configuration, it is possible to prevent the pad from falling off the robot hand.
　また、本発明のロボットハンドにおいて、
　前記パッド部材は、樹脂組成物に導電性粒子を分散させてなる導電性樹脂で構成されていてもよい。 In the robot hand of the present invention,
The pad member may be made of a conductive resin obtained by dispersing conductive particles in a resin composition.
　この構成によれば、基板の帯電、ひいては基板のスパークを防止することができるとともに、基板へのパーティクル付着を抑制することができる。 According to this configuration, it is possible to prevent the charging of the substrate, and thus the spark of the substrate, and to suppress the adhesion of particles to the substrate.
　また、本発明のロボットハンドにおいて、
　前記第１の環部の外径が、前記パッド本体部の外径よりも小さくなるように形成されていてもよい。 In the robot hand of the present invention,
An outer diameter of the first ring portion may be formed to be smaller than an outer diameter of the pad body.
　この構成によれば、基板とパッドの接触面（第１の環部）との接触面積を小さくすることができるため、基板へパッドが接触することに起因する基板へのパーティクルの付着を抑制することができる。 According to this configuration, the contact area between the substrate and the contact surface (the first ring portion) of the pad can be reduced, so that adhesion of particles to the substrate due to contact of the pad with the substrate is suppressed. be able to.
　本発明によれば、ロボットハンドにウエハを載せて保持する場合、安定した保持を可能とし、また、パッド部材の取付けや取外しなどの交換作業を容易にすることができるロボットハンドを提供することができる。 According to the present invention, it is possible to provide a robot hand which can stably hold a wafer when the wafer is placed and held on the robot hand, and which can easily perform replacement work such as mounting and removing a pad member. it can.
本発明に係るパッドの斜視図である。It is a perspective view of the pad concerning the present invention. パッドの正面図である。It is a front view of a pad. パッドの平面図である。It is a top view of a pad. 図３のＩＶ－ＩＶ線断面図である。FIG. 4 is a sectional view taken along line IV-IV of FIG. 3. 本発明に係るロボットハンドの一例を示す斜視図である。It is a perspective view showing an example of the robot hand concerning the present invention. 図５のＶＩ－ＶＩ線断面図である。FIG. 6 is a sectional view taken along line VI-VI of FIG. 5. 本発明に係るパッドの変形例を示す断面図である。It is sectional drawing which shows the modification of the pad which concerns on this invention. 本発明に係るパッドの変形例を示す部分拡大正面図である。It is a partial enlarged front view showing a modification of the pad concerning the present invention. 本発明に係るパッドの変形例を示す部分拡大正面図である。It is a partial enlarged front view showing a modification of the pad concerning the present invention. 本発明に係るパッドの変形例を示す部分拡大正面図である。It is a partial enlarged front view showing a modification of the pad concerning the present invention.
　以下、本発明の実施形態に係るロボットハンドおよびパッド部材について、図面を参照しつつ説明する。
　先ず、図１から図４を参照して、実施形態に係るパッド１（パッド部材の一例）について説明する。パッド１は、例えば、半導体素子を製造するための材料であるウエハ（基板の一例）を保持する部品として用いられる。パッド１は、産業用ロボット、例えば、ウエハを設備間で受け渡すためのウエハ搬送ロボットのアーム（ロボットアームの一例）の先端に連結されたハンド（以下、ロボットハンドと称す）に取り付けられて使用され得る。ロボットハンドの詳細は後述する。 Hereinafter, a robot hand and a pad member according to an embodiment of the present invention will be described with reference to the drawings.
First, a pad 1 (an example of a pad member) according to the embodiment will be described with reference to FIGS. The pad 1 is used, for example, as a component that holds a wafer (an example of a substrate) that is a material for manufacturing a semiconductor device. The pad 1 is used by being attached to a hand (hereinafter, referred to as a robot hand) connected to the tip of an arm (an example of a robot arm) of an industrial robot, for example, a wafer transfer robot for transferring wafers between facilities. Can be done. Details of the robot hand will be described later.
　図１から図４に示すように、パッド１は、中央部に設けられる本体部（パッド本体部）２と、本体部２の高さ方向（図２中では上下方向）における両端部に設けられる保持部３と、を備えている。本実施形態における保持部３は、本体部２の一方の端部（例えば、図２，４において上端部）に設けられる第１保持部３Ａと、第１保持部３Ａとは反対側の端部（例えば、図２，４において下端部）に設けられる第２保持部３Ｂとを含んでいる。本体部２と保持部３Ａ，３Ｂとは、一体的に形成されている。 As shown in FIGS. 1 to 4, the pad 1 is provided at a main body (pad main body) 2 provided at a central portion and at both ends in a height direction (a vertical direction in FIG. 2) of the main body 2. And a holding unit 3. The holding portion 3 in the present embodiment includes a first holding portion 3A provided at one end portion (for example, an upper end portion in FIGS. 2 and 4) of the main body portion 2 and an end portion opposite to the first holding portion 3A. (For example, a lower end portion in FIGS. 2 and 4). The main body 2 and the holding parts 3A, 3B are formed integrally.
　本体部２は、円筒部材である。本体部２の高さは、例えば、後述する開口部１０１（図６参照）におけるハンド本体部１１０の厚み（図６中では上下方向高さ）と略同一となるように設定されている。本体部２の高さは、例えば、１～２ｍｍ程度である。また、本体部２の外径Ｒ１は、後述する開口部１０１（図６参照）の内径と同径または同径よりもやや大きく形成される。好ましくは、本体部２の外径Ｒ１は、開口部１０１の内径と同径よりもやや大きく形成される。これによって、後述するパッド１の取り付けの際に、開口部１０１への本体部２の密着度が高まる。 The main body 2 is a cylindrical member. The height of the main body 2 is set, for example, to be substantially the same as the thickness (the vertical height in FIG. 6) of the hand main body 110 at an opening 101 (see FIG. 6) described later. The height of the main body 2 is, for example, about 1 to 2 mm. The outer diameter R1 of the main body 2 is formed to be the same as or slightly larger than the inner diameter of an opening 101 (see FIG. 6) described later. Preferably, the outer diameter R1 of the main body 2 is formed slightly larger than the same diameter as the inner diameter of the opening 101. Thereby, when the pad 1 described later is attached, the degree of adhesion of the main body 2 to the opening 101 is increased.
　本体部２の中央部および保持部３（３Ａ，３Ｂ）の中央部には、本体部２と保持部３（３Ａ，３Ｂ）とを連通するように貫通孔５が形成されている。本実施形態における貫通孔５は、断面円形で、パッド１の高さ方向に一様な径を有している。 貫通 A through hole 5 is formed at the center of the main body 2 and at the center of the holder 3 (3A, 3B) so as to communicate the main body 2 with the holder 3 (3A, 3B). The through hole 5 in this embodiment has a circular cross section and a uniform diameter in the height direction of the pad 1.
　保持部３（３Ａ，３Ｂ）は、対象部材であるウエハ等を保持（載置）する際に当該ウエハ等に当接する環部３１（３１Ａ，３１Ｂ）を有している。環部３１（３１Ａ，３１Ｂ）は、貫通孔５の縁部において環状に形成されている。環部３１Ａと環部３１Ｂとは、略同形状であってよい。本実施形態では、環部３１Ａと環部３１Ｂとは、同径の円環形状に形成されている。環部３１（３１Ａ，３１Ｂ）の外径Ｒ２は、本体部２の外径Ｒ１よりも小さくなるように形成されている。言い換えると、環部３１（３１Ａ，３１Ｂ）の外径Ｒ２は、貫通孔５の径Ｒ４（図４参照）よりも若干大きく形成される。環部３１（３１Ａ，３１Ｂ）は、本体部２の高さ方向に直交するように略平坦面となるように形成されている。ウエハは、第１保持部３Ａの環部３１Ａ（第１の環部の一例）または第２保持部３Ｂの環部３１Ｂ（第２の環部の一例）のいずれか一方に接触した状態で保持される。 The holding unit 3 (3A, 3B) has a ring 31 (31A, 31B) that comes into contact with the wafer or the like when the wafer or the like as the target member is held (placed). The ring portion 31 (31A, 31B) is formed in an annular shape at the edge of the through hole 5. The ring 31A and the ring 31B may have substantially the same shape. In the present embodiment, the ring portion 31A and the ring portion 31B are formed in an annular shape having the same diameter. The outer diameter R2 of the ring 31 (31A, 31B) is formed to be smaller than the outer diameter R1 of the main body 2. In other words, the outer diameter R2 of the ring portion 31 (31A, 31B) is formed slightly larger than the diameter R4 of the through hole 5 (see FIG. 4). The ring portion 31 (31A, 31B) is formed to be substantially flat so as to be orthogonal to the height direction of the main body 2. The wafer is held in a state of being in contact with one of the ring portion 31A (an example of a first ring portion) of the first holding portion 3A and the ring portion 31B (an example of the second ring portion) of the second holding portion 3B. Is done.
　保持部３（３Ａ，３Ｂ）は、その環部３１（３１Ａ，３１Ｂ）と本体部２との間に、本体部２および環部３１（３１Ａ，３１Ｂ）と一体に設けられた鍔部３２（３２Ａ，３２Ｂ）を有している。鍔部３２（３２Ａ，３２Ｂ）は、テーパ部３３（３３Ａ，３３Ｂ）と、着座面３４（３４Ａ，３４Ｂ）とから構成されている。テーパ部３３（３３Ａ，３３Ｂ）は、環部３１（３１Ａ，３１Ｂ）側から本体部２側に向かって拡径するように形成されている。着座面３４（３４Ａ，３４Ｂ）は、鍔部３２（３２Ａ，３２Ｂ）における本体部２と接する部分に形成され、本体部２の高さ方向に直交する面と平行に形成されている。すなわち、鍔部３２（３２Ａ，３２Ｂ）の外径Ｒ３は、本体部２の外径Ｒ１よりも大きくなるように形成されている。着座面３４（３４Ａ，３４Ｂ）は、パッド１がロボットハンド１００に取り付けられたときに、ロボットハンド１００の一部分に当接する面である。 The holding portion 3 (3A, 3B) is provided between the ring portion 31 (31A, 31B) and the main body portion 2 with a flange portion 32 (1) provided integrally with the main body portion 2 and the ring portion 31 (31A, 31B). 32A, 32B). The flange 32 (32A, 32B) includes a tapered portion 33 (33A, 33B) and a seating surface 34 (34A, 34B). The tapered portion 33 (33A, 33B) is formed so as to increase in diameter from the ring portion 31 (31A, 31B) side toward the main body portion 2 side. The seating surface 34 (34A, 34B) is formed in a portion of the flange 32 (32A, 32B) in contact with the main body 2, and is formed in parallel with a plane orthogonal to the height direction of the main body 2. That is, the outer diameter R3 of the flange 32 (32A, 32B) is formed to be larger than the outer diameter R1 of the main body 2. The seating surface 34 (34A, 34B) is a surface that contacts a part of the robot hand 100 when the pad 1 is attached to the robot hand 100.
　このように、保持部３（３Ａ，３Ｂ）は、截頭円錐形に形成されている。本体部２の上端部に設けられている第１保持部３Ａは、環部３１Ａに向かうにしたがって径が小さくなるように形成されている。また、本体部２の下端部に設けられている第２保持部３Ｂは、環部３１Ｂに向かうにしたがって径が小さくなるように形成されている。第１保持部３Ａと第２保持部３Ｂとは、それらの間に本体部２を挟んで対称構造となるように形成されている。なお、図示は省略するが、パッド１の底面図は、図３に示す平面図と同様になる。また、パッド１の背面図、および左右側面図は、図２に示す正面図と同様になる。 Thus, the holding portions 3 (3A, 3B) are formed in a truncated cone shape. The first holding portion 3A provided at the upper end of the main body 2 is formed so that the diameter decreases toward the ring portion 31A. The second holding portion 3B provided at the lower end of the main body 2 is formed such that the diameter decreases toward the ring portion 31B. The first holding portion 3A and the second holding portion 3B are formed so as to have a symmetrical structure with the main body 2 therebetween. Although not shown, the bottom view of the pad 1 is the same as the plan view shown in FIG. The rear view and the left and right side views of the pad 1 are the same as the front view shown in FIG.
　環部３１（３１Ａ，３１Ｂ）の面積は、例えば、０．１～１平方ミリメートル（ｍｍ２）以下となるように形成される。環部３１（３１Ａ，３１Ｂ）の面積が０．１ｍｍ２未満であると、ウエハとの接触不良を生じる可能性がある。一方、環部３１（３１Ａ，３１Ｂ）の面積が１ｍｍ２よりも大きいと、ウエハへのパーティクル付着が問題となる可能性がある。例えば、貫通孔５の径Ｒ４が４ｍｍに形成されている場合、環部３１（３１Ａ，３１Ｂ）の径方向幅Ｗは、０．０１ｍｍ～０．０６５ｍｍとなるように形成されている。また、環部３１（３１Ａ，３１Ｂ）の面積は、ロボットハンド１００に取り付けられる全てのパッド１とウエハとの許容可能な接触総面積Ｓ、すなわち、パッド１の数によって変わる。全てのパッド１とウエハとの許容可能な接触総面積Ｓを一定とした場合、パッド１の数が１個，２個，３個，…と増えるに応じて、１個当たりの環部３１（３１Ａ，３１Ｂ）の面積は、Ｓ、Ｓ／２，Ｓ／３，…と小さくなる。言い換えると、全てのパッド１とウエハとの許容可能な接触総面積Ｓが決定され、かつ、ロボットハンド１００に取り付けられる全てのパッド１の数が決定されたとき、環部３１（３１Ａ，３１Ｂ）の面積が一義的に定まる。 The area of the ring portion 31 (31A, 31B) is formed to be, for example, 0.1 to 1 square millimeter (mm 2 ) or less. If the area of the ring portion 31 (31A, 31B) is less than 0.1 mm 2 , there is a possibility that poor contact with the wafer may occur. On the other hand, if the area of the ring portion 31 (31A, 31B) is larger than 1 mm 2, there is a possibility that particles adhere to the wafer. For example, when the diameter R4 of the through hole 5 is 4 mm, the radial width W of the ring portion 31 (31A, 31B) is formed to be 0.01 mm to 0.065 mm. The area of the ring 31 (31A, 31B) varies depending on the total allowable contact area S between all the pads 1 attached to the robot hand 100 and the wafer, that is, the number of the pads 1. Assuming that the total allowable contact area S between all the pads 1 and the wafer is constant, as the number of the pads 1 increases to one, two, three,... 31A, 31B) are reduced to S, S / 2, S / 3,... In other words, when the allowable total contact area S between all the pads 1 and the wafer is determined and the number of all the pads 1 attached to the robot hand 100 is determined, the ring portion 31 (31A, 31B) Is uniquely determined.
　具体的には、例えば、接触総面積Ｓが３ｍｍ２以下、パッド１の総数が３個、貫通孔５の径Ｒ４が４ｍｍ、環部３１（３１Ａ，３１Ｂ）の外径Ｒ２が４．１３ｍｍのとき、環部３１（３１Ａ，３１Ｂ）の径方向幅Ｗは、０．０６５ｍｍになる。このとき、環部３１（３１Ａ，３１Ｂ）の面積は０．８３ｍｍ２、環部３１の総面積は２．４９ｍｍ２となり、接触総面積Ｓ（３ｍｍ２以下）を満足する。また、例えば、接触総面積Ｓが０．５ｍｍ２以下、パッド１の総数が３個、貫通孔５の径Ｒ４が４ｍｍ、環部３１（３１Ａ，３１Ｂ）の外径Ｒ２が４．０２ｍｍのとき、環部３１（３１Ａ，３１Ｂ）の径方向幅Ｗは、０．０１ｍｍになる。このとき、環部３１（３１Ａ，３１Ｂ）の面積は０．１３ｍｍ２、環部３１の総面積は０．３９ｍｍ２となり、接触総面積Ｓ（０．５ｍｍ２以下）を満足する。 Specifically, for example, when the total contact area S is 3 mm 2 or less, the total number of pads 1 is three, the diameter R4 of the through hole 5 is 4 mm, and the outer diameter R2 of the ring 31 (31A, 31B) is 4.13 mm. At this time, the radial width W of the ring portion 31 (31A, 31B) is 0.065 mm. At this time, the area of the ring portions 31 (31A, 31B) is 0.83 mm 2, the total area of the ring portion 31 satisfies 2.49 2, and the total contact area S a (3 mm 2 or less). For example, when the total contact area S is 0.5 mm 2 or less, the total number of pads 1 is 3, the diameter R4 of the through hole 5 is 4 mm, and the outer diameter R2 of the ring portions 31 (31A, 31B) is 4.02 mm. The radial width W of the ring portion 31 (31A, 31B) is 0.01 mm. In this case, satisfying the ring portion 31 (31A, 31B) area of 0.13 mm 2, the total area of 0.39 mm 2 next to the ring portion 31, the contact total area S (0.5 mm 2 or less).
　パッド１を構成する本体部２および保持部３（３Ａ，３Ｂ）は、樹脂組成物に導電性粒子を分散させてなる導電性樹脂で構成されている。本体部２および保持部３（３Ａ，３Ｂ）は、例えば、ポリテトラフルオロエチレン、パーフルオロアルコシキアルカン、エチレンテトラフルオロエチレンコポリマー等のフッ素樹脂等により作製することができる。樹脂組成物としては、その他、半導体ウエハをハンドリングするロボットハンドのパッドに慣用的に用いられている樹脂が全て適用可能である。 本体 The main body 2 and the holding parts 3 (3A, 3B) constituting the pad 1 are made of a conductive resin obtained by dispersing conductive particles in a resin composition. The main body 2 and the holding parts 3 (3A, 3B) can be made of, for example, a fluororesin such as polytetrafluoroethylene, perfluoroalkoxyalkane, ethylene tetrafluoroethylene copolymer, or the like. As the resin composition, all other resins commonly used for pads of robot hands for handling semiconductor wafers can be applied.
　次に、図５および図６を参照して、パッド１を備えたロボットハンド１００について説明する。
　図５は、パッド１を備えたロボットハンド１００を示す斜視図である。図６は、ロボットハンド１００のＶＩ－ＶＩ断面図である。 Next, the robot hand 100 including the pad 1 will be described with reference to FIGS.
FIG. 5 is a perspective view showing the robot hand 100 including the pad 1. FIG. 6 is a sectional view of the robot hand 100 taken along the line VI-VI.
　図５に示すように、ロボットハンド１００には、その先端部にウエハを保持するためのパッド１が複数（本実施形態では３個）取り付けられている。また、ロボットハンド１００は、図示を省略する吸排気ユニットを備えており、各パッド１は吸排気ユニットに後述の通路部１０２を介して接続される。ロボットハンド１００に取り付けられたパッド１は、ウエハを真空吸着することにより、ロボットハンド１００に対してウエハ等が位置ずれを起こしたり、ロボットハンド１００から落下したりしないようにウエハ等を保持する。ロボットハンド１００は、例えばアルミナなどのセラミック材料で構成されている。 As shown in FIG. 5, the robot hand 100 is provided with a plurality (three in this embodiment) of pads 1 for holding a wafer at its tip. Further, the robot hand 100 includes a suction / exhaust unit (not shown), and each pad 1 is connected to the suction / exhaust unit via a passage 102 described later. The pad 1 attached to the robot hand 100 holds the wafer and the like so that the wafer and the like do not shift with respect to the robot hand 100 or drop from the robot hand 100 by vacuum-sucking the wafer. The robot hand 100 is made of, for example, a ceramic material such as alumina.
　図６に示すように、ロボットハンド１００は、ハンド本体部１１０と、パッド１を取り付けるための開口部１０１と、開口部１０１と連通する通路部１０２（吸排気ユニットの一部）とを有している。
　開口部１０１は、ハンド本体部１１０においてウエハ等が保持される側の面である保持面１０３（図６における上面）に形成される孔であり、通路部１０２に連通される。本実施形態における開口部１０１は、断面円形で、開口部１０１におけるハンド本体部１１０の厚み方向に一様な径を有している。開口部１０１の径は、本体部２の外径Ｒ１と略同一または外径Ｒ１よりもやや小さくとなるように形成されている。 As shown in FIG. 6, the robot hand 100 has a hand main body 110, an opening 101 for attaching the pad 1, and a passage 102 (a part of the intake / exhaust unit) communicating with the opening 101. ing.
The opening 101 is a hole formed in a holding surface 103 (upper surface in FIG. 6) which is a surface of the hand main body 110 on which a wafer or the like is held, and is communicated with the passage 102. The opening 101 in the present embodiment has a circular cross section and a uniform diameter in the thickness direction of the hand main body 110 at the opening 101. The diameter of the opening 101 is formed to be substantially the same as or slightly smaller than the outer diameter R1 of the main body 2.
　通路部１０２は、ハンド本体部１１０における保持面１０３の反対側の面（裏面）１０４に形成された溝を蓋部材（シール部材）１０５で密封してなる。通路部１０２の端部（図６中では右端部）は、図示を省略する吸排気ユニットに接続されている。 The passage portion 102 is formed by sealing a groove formed on a surface (back surface) 104 of the hand main body 110 opposite to the holding surface 103 with a lid member (seal member) 105. An end (the right end in FIG. 6) of the passage 102 is connected to a suction / exhaust unit (not shown).
　パッド１のいずれか一方の保持部３（３Ａまたは３Ｂ）を、ハンド本体部１１０の保持面１０３側から開口部１０１内に弾性変形させながら挿入させる。このとき、鍔部３２（３２Ａ，３２Ｂ）はテーパ部３３（３３Ａ，３３Ｂ）を備えているため、保持部３（３Ａまたは３Ｂ）は自動調心されながら開口部１０１内に導かれる。そして、鍔部３２（３２Ａ，３２Ｂ）の最大径部分３２１（図６参照）が、本体部２側に折り返されつつ弾性変形し、開口部１０１を完全に通過した後は元の形状に弾性変形することで、保持部３（３Ａまたは３Ｂ）が開口部の１０１の下縁に密着する。例えば、第２保持部３Ｂを開口部１０１に挿入させる場合、第２保持部３Ｂの鍔部３２Ｂ（テーパ部３３Ｂ）が開口部１０１に入り込み、第２保持部３Ｂ（環部３１Ｂおよび鍔部３２Ｂ）が通路部１０２内に配置される。これにより、通路部１０２内に配置された第２保持部３Ｂの着座面３４Ｂが通路部１０２の内壁面（図６において通路部１０２の上面）に当接（着座）する。 。 One of the holding portions 3 (3A or 3B) of the pad 1 is inserted into the opening 101 from the holding surface 103 side of the hand main body 110 while being elastically deformed. At this time, since the flange portion 32 (32A, 32B) includes the tapered portion 33 (33A, 33B), the holding portion 3 (3A or 3B) is guided into the opening portion 101 while being self-aligned. Then, the largest diameter portion 321 (see FIG. 6) of the flange portion 32 (32A, 32B) is elastically deformed while being folded toward the main body portion 2 and elastically deformed to the original shape after completely passing through the opening 101. By doing so, the holding portion 3 (3A or 3B) comes into close contact with the lower edge of the opening 101. For example, when the second holding portion 3B is inserted into the opening 101, the flange 32B (tapered portion 33B) of the second holding portion 3B enters the opening 101, and the second holding portion 3B (the ring portion 31B and the flange 32B). ) Are arranged in the passage portion 102. As a result, the seating surface 34B of the second holding portion 3B arranged in the passage portion 102 abuts (sits) on the inner wall surface of the passage portion 102 (the upper surface of the passage portion 102 in FIG. 6).
　このとき、パッド１の本体部２は、開口部１０１の内周面に当接され、双方が密着する。また、第１保持部３Ａは、開口部１０１内には差し込まれず、開口部１０１の外部（図６において保持面１０３よりも上側）に配置され、第１保持部３Ａの着座面３４Ａが保持面１０３に当接した状態で取り付けられる。すなわち、ハンド本体部１１０を第１保持部３Ａの鍔部３２Ａおよび第２保持部３Ｂの鍔部３２Ｂで挟持することで、パッド１がハンド本体部１１０に確実に密着した状態で取り付けられる。このように、ロボットハンド１００に取り付けられたパッド１は、第１保持部３Ａの鍔部３２Ａと第２保持部３Ｂの鍔部３２Ｂとによって取付位置が適正の位置に規定される。 At this time, the main body 2 of the pad 1 is in contact with the inner peripheral surface of the opening 101, and both are in close contact with each other. The first holding portion 3A is not inserted into the opening 101, but is arranged outside the opening 101 (above the holding surface 103 in FIG. 6), and the seating surface 34A of the first holding portion 3A is It is attached in a state where it abuts on 103. That is, the pad 1 is securely attached to the hand main body 110 by holding the hand main body 110 between the flange 32A of the first holding part 3A and the flange 32B of the second holding part 3B. As described above, the mounting position of the pad 1 attached to the robot hand 100 is defined by the flange portion 32A of the first holding portion 3A and the flange portion 32B of the second holding portion 3B at an appropriate position.
　パッド１が開口部１０１を介してロボットハンド１００に取り付けられると、パッド１の貫通孔５とロボットハンド１００の通路部１０２とが連通される。この状態で、吸排気ユニットの動作により貫通孔５内および通路部１０２内の空気を真空引きすることで、ロボットハンド１００に載置されるウエハはパッド１の環部３１Ａ上に真空吸着される。 When the pad 1 is attached to the robot hand 100 through the opening 101, the through hole 5 of the pad 1 and the passage 102 of the robot hand 100 are communicated. In this state, the air in the through-hole 5 and the passage portion 102 is evacuated by the operation of the suction / exhaust unit, so that the wafer placed on the robot hand 100 is vacuum-sucked on the ring portion 31A of the pad 1. .
　なお、本実施形態においては、１つのロボットハンド１００には３個のパッド１が取り付けられている。そのため、ロボットハンド１００におけるパッド１（環部３１Ａ）とウエハとの接触面積は、３ｍｍ２以下になる。 In this embodiment, three pads 1 are attached to one robot hand 100. Therefore, the contact area between the pad 1 (ring portion 31A) and the wafer in the robot hand 100 becomes 3 mm 2 or less.
　以上説明したように、本実施形態に係るロボットハンド１００は、ハンド本体部１１０と、ハンド本体部１１０に設けられた開口部１０１に取り付けられ、ウエハを保持するパッド１と、を備えている。パッド１は、開口部１０１に取り付けられ、その中央部に貫通孔５を有する本体部２（パッド本体部の一例）と、パッド１の両端に設けられた環部３１と、環部３１および本体部２と一体に設けられ、本体部２の外側に向かって延設される鍔部３２と、を備えている。そして、環部３１の外径Ｒ２が、本体部２の外径Ｒ１よりも小さくなるように形成されている。この構成によれば、ウエハとパッド１の環部３１との接触面積を小さくすることができるため、ウエハとパッド１とが接触することに起因するウエハへのパーティクルの付着を抑制することができる。また、この構成によれば、パッド取付孔であるハンド本体部１１０の開口部１０１に、パッド１を押しつぶすように変形させながら差し込むだけで、ロボットハンド１００にパッド１を取り付けることができる。このため、開口部１０１へのパッド１の取付けおよび取外しの際に特別な器具や部材は不要である。よって、取り付け・取り外し作業が容易であるとともに、取り付け・取り外しに伴う部材コストはゼロである。さらに、パッド１は導電性粒子を含む樹脂組成物で構成されるため、パッド１をウエハに接触させることで、ウエハに帯電している静電気がアースされる。その結果、パッド１とウエハとの間でスパークが生じるおそれはない。ひいては、ウエハの破損のおそれがなくなり、ウエハの歩留まりが向上する。 As described above, the robot hand 100 according to the present embodiment includes the hand main body 110 and the pad 1 attached to the opening 101 provided in the hand main body 110 and holding a wafer. The pad 1 is attached to the opening 101 and has a through-hole 5 at the center thereof, a main body 2 (an example of a pad main body), rings 31 provided at both ends of the pad 1, a ring 31 and a main body. A flange portion 32 provided integrally with the portion 2 and extending toward the outside of the main body portion 2. The outer diameter R2 of the ring portion 31 is formed to be smaller than the outer diameter R1 of the main body portion 2. According to this configuration, since the contact area between the wafer and the ring portion 31 of the pad 1 can be reduced, adhesion of particles to the wafer due to the contact between the wafer and the pad 1 can be suppressed. . Further, according to this configuration, the pad 1 can be attached to the robot hand 100 simply by inserting the pad 1 into the opening 101 of the hand main body 110, which is a pad attachment hole, while deforming the pad 1 so as to crush it. For this reason, a special instrument or member is not required when attaching and detaching the pad 1 to and from the opening 101. Therefore, the attachment / detachment operation is easy, and the cost of members associated with the attachment / detachment is zero. Further, since the pad 1 is made of a resin composition containing conductive particles, the pad 1 is brought into contact with the wafer to ground the static electricity charged on the wafer. As a result, there is no possibility that a spark will occur between the pad 1 and the wafer. As a result, there is no risk of damage to the wafer, and the yield of the wafer is improved.
　また、本実施形態のロボットハンド１００において、環部３１は、パッド１の先端側に設けられた環部３１Ａ（第１の環部の一例）と、パッド１の後端側に設けられて環部３１Ａと同形状で形成された環部３１Ｂ（第２の環部の一例）とを含み、鍔部３２は、環部３１Ａおよび本体部２と一体に設けられた鍔部３２Ａ（第１の鍔部の一例）と、環部３１Ｂおよび本体部２と一体に設けられた鍔部３２Ｂ（第２の鍔部の一例）とを含む。このように、環部３１Ａと環部３１Ｂとが対称構造であるため、環部３１Ａと環部３１Ｂのどちらをウエハと接触する側としてもよい。さらに、鍔部３２Ａと鍔部３２Ｂも対称構造であるため、ロボットハンド１００にパッド１を取り付ける際の誤設置を防止することができ、パッド１の取り付けが容易である。 Further, in the robot hand 100 of the present embodiment, the ring 31 is provided with a ring 31A (an example of a first ring) provided on the front end side of the pad 1 and a ring provided on the rear end side of the pad 1. The flange portion 32 includes a ring portion 31B (an example of a second ring portion) formed in the same shape as the portion 31A, and the flange portion 32 is provided integrally with the ring portion 31A and the main body portion 32 (first flange portion 32A). A flange portion) and a flange portion 32B (an example of a second flange portion) provided integrally with the ring portion 31B and the main body portion 2. As described above, since the ring portion 31A and the ring portion 31B have a symmetric structure, either the ring portion 31A or the ring portion 31B may be on the side that comes into contact with the wafer. Furthermore, since the flange 32A and the flange 32B also have a symmetrical structure, erroneous installation when mounting the pad 1 on the robot hand 100 can be prevented, and the mounting of the pad 1 is easy.
　また、本実施形態のロボットハンド１００において、ハンド本体部１１０は、その内部に、一端部が開口部１０１と連通され、他端部が吸排気ユニットに接続される通路部１０２を有している。これにより、パッドに対してウエハを吸着せずに搬送しようとすると、ウエハ搬送のサイクルタイムが不足する場合や、吸着力が不足する場合などには、吸排気ユニットを別に設けて通路部１０２を介して真空引きを行うことにより、確実にウエハを保持した状態で移載することが可能となる。 Further, in the robot hand 100 of the present embodiment, the hand main body 110 has a passage portion 102 in which one end is communicated with the opening 101 and the other end is connected to the intake / exhaust unit. . Accordingly, if the wafer is transferred without being sucked to the pad and the cycle time of the wafer transfer is insufficient or the suction force is insufficient, the suction and exhaust unit is separately provided and the passage unit 102 is provided. By evacuating the wafer, it is possible to transfer the wafer while securely holding the wafer.
　また、本実施形態のロボットハンド１００において、パッド１がハンド本体部１１０に取り付けられた際、ハンド本体部１１０が鍔部３２Ａおよび鍔部３２Ｂで挟持され、ハンド本体部１１０にパッド１が確実に密着した状態で保持される。これにより、ロボットハンド１００からのパッド１の脱落を防止することができる。 In the robot hand 100 of the present embodiment, when the pad 1 is attached to the hand main body 110, the hand main body 110 is sandwiched between the flange 32A and the flange 32B, and the pad 1 is securely attached to the hand main body 110. It is held in close contact. Thereby, it is possible to prevent the pad 1 from dropping from the robot hand 100.
　また、本実施形態に係るロボットハンド１００によれば、使用によりパッド１が摩耗した際には、ロボットハンド１００自体を交換する必要がなくパッド１のみを取り付け交換すればよい。また、その交換の際に特別な器具や部材等は必要とせず、手作業で簡単に取り外し・取り付けができる。さらに、パッド１は初回の取り付け時は表裏フリーであり、初めにパッド１を取り付けて表側を使用した後、一旦パッド１を取り外して反対の裏側（通路部１０２内に位置していた側）を再使用することができる。そのため、交換作業に係る所要時間を大幅に低減することができ、また、交換に要する部材コストはなく、その上さらに、１つのパッド１を２回使用することができる。 According to the robot hand 100 according to the present embodiment, when the pad 1 is worn by use, it is not necessary to replace the robot hand 100 itself, and only the pad 1 needs to be attached and replaced. In addition, no special tools or members are required for the replacement, and it can be easily removed and attached by hand. Further, the pad 1 is free from the front and back when the pad is first attached. After the pad 1 is first attached and the front side is used, the pad 1 is once removed and the opposite back side (the side located in the passage portion 102) is removed. Can be reused. Therefore, the time required for the replacement work can be significantly reduced, and there is no cost for the members required for replacement, and one pad 1 can be used twice.
　また、本実施形態に係るパッド１によれば、パッド１をロボットハンド１００に取り付ける際に、例えば特許文献２に開示される真空吸着パッドのようなシール部材等の装着が不要であるため、パッド１の交換作業がさらに容易となる。 Further, according to the pad 1 according to the present embodiment, when the pad 1 is attached to the robot hand 100, it is not necessary to attach a sealing member or the like such as a vacuum suction pad disclosed in Patent Document 2, for example. 1 can be easily replaced.
　なお、上記実施形態においては、環部３１と鍔部３２とから構成される保持部３を本体部２の両端部に設ける構成としたが、これに限定されない。保持部３は、本体部２の少なくとも一方の端部に設けられている構成であってもよい。例えば、図７に示すパッド１Ａのように、上記実施形態の保持部３とは異なる形状の保持部を、ハンド本体部１１０内に挿入される側の本体部２の端部（図７中の下端部）に設けてもよい。具体的には、パッド１Ａにおいて、ハンド本体部１１０内に挿入される側の保持部３ＢＡは、本体部２の外側に向かって延設される鍔部３２ＢＡ（第３の鍔部の一例）を備えている。鍔部３２ＢＡは、貫通孔５の縁部において本体部２の高さ方向に直交する面と平行に形成された面３５ＢＡと、面３５ＢＡの外端部から本体部２側に向けて垂直に形成された面３３ＢＡと、鍔部３２ＢＡにおける本体部２と接する部分に形成されて本体部２の高さ方向に直交する面と平行に形成された面（着座面）３４ＢＡとから構成されている。この構成によっても、本体部２の両端の鍔部３２Ａ，３２ＢＡによりハンド本体部１１０を挟持することで、パッド１Ａがロボットハンド１００に確実に密着した状態で取り付け可能となる。このため、ロボットハンド１００からのパッド１Ａの脱落を防止することができる。 In the above-described embodiment, the holding portion 3 including the ring portion 31 and the flange portion 32 is provided at both ends of the main body portion 2. However, the present invention is not limited to this. The holding portion 3 may be configured to be provided at at least one end of the main body 2. For example, like the pad 1 </ b> A shown in FIG. 7, a holding portion having a different shape from the holding portion 3 of the above-described embodiment is attached to the end of the main body 2 on the side to be inserted into the hand main body 110 (FIG. (Lower end). Specifically, in the pad 1A, the holding portion 3BA on the side inserted into the hand main body 110 has a flange 32BA (an example of a third flange) extending toward the outside of the main body 2. Have. The flange portion 32BA is formed at the edge of the through-hole 5 in parallel with a surface orthogonal to the height direction of the main body 2, and is formed vertically from the outer end of the surface 35BA toward the main body 2. Surface 33BA, and a surface (seating surface) 34BA formed at a portion of the flange portion 32BA in contact with the main body 2 and formed in parallel with a surface orthogonal to the height direction of the main body 2. Even with this configuration, the pad 1A can be attached in a state in which the pad 1A is securely adhered to the robot hand 100 by sandwiching the hand main body 110 between the flanges 32A and 32BA at both ends of the main body 2. Therefore, it is possible to prevent the pad 1A from falling off from the robot hand 100.
　また、上記実施形態では、本体部２の形状を円柱形としたがこれに限定されない。本体部２は、開口部１０１の形状に応じて適宜選択され、例えば、四角柱、多角柱等の角柱形であってもよい。 In the above embodiment, the shape of the main body 2 is cylindrical, but is not limited to this. The main body 2 is appropriately selected according to the shape of the opening 101, and may be, for example, a prism such as a quadrangular prism or a polygonal prism.
　また、上記実施形態では、保持部３（３Ａ，３Ｂ）の形状を截頭円錐形としたがこれに限定されない。保持部３もまた、開口部１０１の形状に応じて適宜選択され、例えば、截頭角錐形等であってもよい。 Also, in the above embodiment, the shape of the holding portion 3 (3A, 3B) is a truncated cone, but the shape is not limited to this. The holding unit 3 is also appropriately selected according to the shape of the opening 101, and may be, for example, a truncated pyramid.
　また、上記実施形態では、環部３１（３１Ａ，３１Ｂ）を本体部２の軸方向に直交する略平坦な形状としたがこれに限定されない。環部３１（３１Ａ，３１Ｂ）は、例えば、内側ほど（貫通孔５に近づくにしたがって）鍔部３２（３２Ａ，３２Ｂ）側に向かって徐々に傾斜する傾斜面、または、外側ほど（貫通孔５から離れるにしたがって）鍔部３２（３２Ａ，３２Ｂ）側に向かって徐々に傾斜する傾斜面として形成されていてもよい。前者の場合、環部３１（３１Ａ，３１Ｂ）における外周側縁部がウエハと接触され、後者の場合、環部３１（３１Ａ，３１Ｂ）における内周側縁部がウエハと接触される。 In the above embodiment, the ring portion 31 (31A, 31B) has a substantially flat shape orthogonal to the axial direction of the main body 2, but is not limited thereto. The annular portion 31 (31A, 31B) has, for example, an inclined surface that is gradually inclined toward the inner side (as it approaches the through hole 5) toward the flange portion 32 (32A, 32B) or an outer surface (the through hole 5). May be formed as an inclined surface that is gradually inclined toward the flange portion 32 (32A, 32B) side (as the distance from the flange portion increases). In the former case, the outer peripheral edge of the ring 31 (31A, 31B) is in contact with the wafer, and in the latter, the inner peripheral edge of the ring 31 (31A, 31B) is in contact with the wafer.
　また、上記実施形態では、テーパ部３３（３３Ａ，３３Ｂ）は、正面視の稜線形状が直線状となるように形成されているがこれに限定されない。例えば、正面視の稜線形状が上向き凸型のアーチ状のテーパ部３３Ｃ（図８参照）、または、下向き凹型のアーチ状のテーパ部３３Ｄ（図９参照）であってもよい。また、テーパ部は、連続的でなくてもよく、正面視の稜線形状が段差状のテーパ部３３Ｅ（図１０参照）であってもよい。 Also, in the above embodiment, the tapered portions 33 (33A, 33B) are formed so that the ridge shape in a front view is straight, but the present invention is not limited to this. For example, the ridgeline shape in a front view may be an upwardly convex arched tapered portion 33C (see FIG. 8) or a downwardly concave arched tapered portion 33D (see FIG. 9). Further, the tapered portion may not be continuous, and may be a tapered portion 33 </ b> E (see FIG. 10) having a stepped ridge shape in a front view.
　なお、本発明は、上述した実施形態に限定されず、適宜、変形、改良等が自在である。その他、上述した実施形態における各構成要素の材質、形状、寸法、数値、形態、数、配置場所等は、本発明を達成できるものであれば任意であり、限定されない。 Note that the present invention is not limited to the above-described embodiment, and may be appropriately modified and improved. In addition, the material, shape, dimension, numerical value, form, number, arrangement location, and the like of each component in the above-described embodiment are arbitrary and are not limited as long as the present invention can be achieved.
　本出願は、２０１８年６月２８日出願の日本特許出願２０１８－１２２９３２号に基づくものであり、その内容はここに参照として取り込まれる。 This application is based on Japanese Patent Application No. 2018-122932 filed on June 28, 2018, the contents of which are incorporated herein by reference.

Claims (10)

  1. 　基板を移載するロボットアームに取り付けられ、前記基板を保持するロボットハンドであって、
    　ハンド本体部と、
    　該ハンド本体部に設けられた開口部に取り付けられ、前記基板を保持するパッド部材と、を備え、
    　前記パッド部材は、
    　　前記開口部に取り付けられ、その中央部に貫通孔を有するパッド本体部と、
    　　前記パッド部材の先端側に設けられ、前記基板に当接される第１の環部と、
    　　前記第１の環部および前記パッド本体部と一体に設けられ、前記パッド本体部の外側に向かって延設される第１の鍔部と、を備えている、ロボットハンド。     A robot hand attached to a robot arm for transferring a substrate and holding the substrate,
    A hand body,
    A pad member attached to an opening provided in the hand main body and holding the substrate,
    The pad member,
    A pad body attached to the opening and having a through hole in the center thereof,
    A first ring portion provided on the tip side of the pad member and abutting on the substrate;
    A first flange portion provided integrally with the first ring portion and the pad main body portion and extending toward the outside of the pad main body portion.
  2. 　前記パッド部材は、
    　　前記パッド部材の後端側に設けられ、前記第１の環部と同形状で形成された第２の環部と、
    　　前記第２の環部および前記パッド本体部と一体に設けられ、前記ハンド本体部に着座される第２の鍔部と、をさらに備えている、請求項１に記載のロボットハンド。     The pad member,
    A second ring portion provided on the rear end side of the pad member and formed in the same shape as the first ring portion;
    2. The robot hand according to claim 1, further comprising: a second flange portion provided integrally with the second ring portion and the pad body portion and seated on the hand body portion. 3.
  3. 　前記パッド部材は、
    　前記パッド部材の後端側に前記パッド本体部と一体に設けられ、前記パッド本体部の外側に向かって延設される第３の鍔部をさらに備えている、請求項１に記載のロボットハンド。     The pad member,
    2. The robot hand according to claim 1, further comprising a third flange provided integrally with the pad body at a rear end side of the pad member and extending toward the outside of the pad body. 3. .
  4. 　前記ハンド本体部は、その内部に、一端部が前記開口部と連通され、他端部が吸排気ユニットに接続される通路部を有している、請求項１から３のいずれか一項に記載のロボットハンド。 The hand body according to any one of claims 1 to 3, wherein one end of the hand main body communicates with the opening, and the other end has a passage connected to the suction / exhaust unit. The described robot hand.
  5. 　前記パッド本体部は、円筒部材であり、
    　前記第１の鍔部は、前記第１の環部側から前記パッド本体部側に向かって拡径するテーパ部を有している、請求項１から４のいずれか一項に記載のロボットハンド。     The pad body is a cylindrical member,
    The robot hand according to any one of claims 1 to 4, wherein the first flange portion has a tapered portion whose diameter increases from the first ring portion side toward the pad body portion side. .
  6. 　前記パッド本体部は、円筒部材であり、
    　前記第２の鍔部は、前記第２の環部側から前記パッド本体部側に向かって拡径するテーパ部を有している、請求項２に記載のロボットハンド。     The pad body is a cylindrical member,
    3. The robot hand according to claim 2, wherein the second flange has a tapered portion whose diameter increases from the second ring portion toward the pad body. 4.
  7. 　前記パッド部材は、前記ハンド本体部を前記第１の鍔部および前記第２の鍔部で挟持させることで、前記ハンド本体部に取り付けられる、請求項２に記載のロボットハンド。 The robot hand according to claim 2, wherein the pad member is attached to the hand main body by holding the hand main body between the first flange and the second flange.
  8. 　前記パッド部材は、前記ハンド本体部を前記第１の鍔部および前記第３の鍔部で挟持させることで、前記ハンド本体部に取り付けられる、請求項３に記載のロボットハンド。 The robot hand according to claim 3, wherein the pad member is attached to the hand main body by holding the hand main body between the first flange and the third flange.
  9. 　前記パッド部材は、樹脂組成物に導電性粒子を分散させてなる導電性樹脂で構成されている、請求項１から８のいずれか一項に記載のロボットハンド。 The robot hand according to any one of claims 1 to 8, wherein the pad member is made of a conductive resin obtained by dispersing conductive particles in a resin composition.
  10. 　前記第１の環部の外径が、前記パッド本体部の外径よりも小さくなるように形成されている、請求項１から９のいずれか一項に記載のロボットハンド。 The robot hand according to any one of claims 1 to 9, wherein an outer diameter of the first ring portion is formed to be smaller than an outer diameter of the pad body.
PCT/JP2019/022813 2018-06-28 2019-06-07 Robot hand equipped with pad member WO2020003979A1 (en)

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JP2018122932A JP2021153076A (en) 2018-06-28 2018-06-28 Robot hand including pad member
JP2018-122932 2018-06-28

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102701437B1 (en) * 2020-12-28 2024-09-03 세메스 주식회사 Transfer unit and substrate treating apparatus including the same

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JPS6094487U (en) * 1983-11-30 1985-06-27 東芝機械株式会社 Wafer adsorption device
JPH08107136A (en) * 1994-10-03 1996-04-23 Dainippon Screen Mfg Co Ltd Substrate transfer device
JPH08112793A (en) * 1994-10-13 1996-05-07 Toshiba Corp Sucker holding device and mounting device
JPH10156778A (en) * 1996-12-04 1998-06-16 Smc Corp Attracting pad
JP2002066972A (en) * 2000-09-01 2002-03-05 Koganei Corp Suction device
JP2004059229A (en) * 2002-07-29 2004-02-26 Espec Corp Method for manufacturing thin layer substrate, thin layer substrate transferring device, and suction pad for transfer of thin layer substrate
JP2008282870A (en) * 2007-05-08 2008-11-20 Mitsubishi Cable Ind Ltd Conveyance arm pad
JP2014072262A (en) * 2012-09-28 2014-04-21 Hitachi High-Technologies Corp Vacuum processing apparatus and transfer device

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KR102701437B1 (en) * 2020-12-28 2024-09-03 세메스 주식회사 Transfer unit and substrate treating apparatus including the same

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