JPS6413131U - - Google Patents

Info

Publication number
JPS6413131U
JPS6413131U JP10722287U JP10722287U JPS6413131U JP S6413131 U JPS6413131 U JP S6413131U JP 10722287 U JP10722287 U JP 10722287U JP 10722287 U JP10722287 U JP 10722287U JP S6413131 U JPS6413131 U JP S6413131U
Authority
JP
Japan
Prior art keywords
concave portion
semiconductor device
suction jig
semiconductor devices
chamfered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10722287U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10722287U priority Critical patent/JPS6413131U/ja
Publication of JPS6413131U publication Critical patent/JPS6413131U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図aは本考案の一実施例を示す正面図、第
1図bは同側面図、第2図aは従来例を示す正面
図、第2図bは同側面図、第3図はペレツトのハ
ンドリング機構の一例を示す構成図である。 1……凹陥部、3……ペレツト、8……コレツ
ト、9〜12……面取り。
Fig. 1a is a front view showing one embodiment of the present invention, Fig. 1b is a side view of the same, Fig. 2a is a front view of a conventional example, Fig. 2b is a side view of the same, Fig. 3 is a side view of the same. FIG. 3 is a configuration diagram showing an example of a pellet handling mechanism. 1...Concave portion, 3...Pellet, 8...Collection, 9-12...Chamfer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ウエハーの状態より個別に分割された半導体装
置を受け入れて吸着保持する凹陥部を端面に形成
してなる半導体装置の吸着治具において、半導体
装置と接触する前記凹陥部の角部に面取りを付し
たことを特徴とする半導体装置の吸着治具。
In a semiconductor device suction jig having a concave portion formed on an end face for receiving and adsorbing and holding semiconductor devices that are individually divided according to the state of a wafer, the corners of the concave portion that come into contact with the semiconductor device are chamfered. A suction jig for semiconductor devices characterized by the following.
JP10722287U 1987-07-13 1987-07-13 Pending JPS6413131U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10722287U JPS6413131U (en) 1987-07-13 1987-07-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10722287U JPS6413131U (en) 1987-07-13 1987-07-13

Publications (1)

Publication Number Publication Date
JPS6413131U true JPS6413131U (en) 1989-01-24

Family

ID=31341440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10722287U Pending JPS6413131U (en) 1987-07-13 1987-07-13

Country Status (1)

Country Link
JP (1) JPS6413131U (en)

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