JPS58184841U - Wafer transfer device - Google Patents
Wafer transfer deviceInfo
- Publication number
- JPS58184841U JPS58184841U JP8239882U JP8239882U JPS58184841U JP S58184841 U JPS58184841 U JP S58184841U JP 8239882 U JP8239882 U JP 8239882U JP 8239882 U JP8239882 U JP 8239882U JP S58184841 U JPS58184841 U JP S58184841U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- passage hole
- electrode
- light passage
- transfer device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図、第2図は、本考案の一実施例を説明するもので
、第1図は、本考案によるウェハー搬送装置を適用した
半導体製造装置の部分縦断面図、第2図は、第1図のA
−A視部分平面図である。
10・・・・・・処理室、11・・・電極、12a、1
2b・・・・・・光通過孔、14・・・・・・発光素子
:、15・・・・・・受光素子、16・・・・・・予備
室、17・・・・・・アーム、18・・・・・・掴み装
置。1 and 2 are for explaining one embodiment of the present invention. FIG. 1 is a partial longitudinal cross-sectional view of a semiconductor manufacturing apparatus to which a wafer transfer device according to the present invention is applied, and FIG. A in Figure 1
- It is a partial plan view seen from A. 10... Processing chamber, 11... Electrode, 12a, 1
2b...Light passing hole, 14...Light emitting element:, 15...Light receiving element, 16...Preliminary chamber, 17...Arm , 18... Grasping device.
Claims (1)
能に内設され、前記光通過孔と同軸に発光素子と受光素
子とが設けられた処理室と、該処理室に具設された予備
室との間でウェーハを掴み搬送する装置において、前記
ウエーノ1掴み装置に、ウェーハ掴み装置が前記電極の
ウェーハ載置位置に到達した時点で電極の前記光通過孔
と対向する1うに光通過孔を穿設したことを特徴とする
ウェーハ搬送装置。A processing chamber in which an electrode with a light passage hole bored at a wafer placement position is rotatably installed therein, and a light emitting element and a light receiving element are provided coaxially with the light passage hole; In the apparatus for gripping and transporting wafers to and from a preparatory chamber, the wafer 1 gripping device is provided with a wafer 1 that faces the light passage hole of the electrode when the wafer gripping device reaches the wafer placement position of the electrode. A wafer transfer device characterized by having a light passage hole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8239882U JPS58184841U (en) | 1982-06-04 | 1982-06-04 | Wafer transfer device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8239882U JPS58184841U (en) | 1982-06-04 | 1982-06-04 | Wafer transfer device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58184841U true JPS58184841U (en) | 1983-12-08 |
JPS6214693Y2 JPS6214693Y2 (en) | 1987-04-15 |
Family
ID=30091465
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8239882U Granted JPS58184841U (en) | 1982-06-04 | 1982-06-04 | Wafer transfer device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58184841U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0425151A (en) * | 1990-05-21 | 1992-01-28 | Canon Inc | Thin plate carrying device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49104569A (en) * | 1973-02-07 | 1974-10-03 |
-
1982
- 1982-06-04 JP JP8239882U patent/JPS58184841U/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49104569A (en) * | 1973-02-07 | 1974-10-03 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0425151A (en) * | 1990-05-21 | 1992-01-28 | Canon Inc | Thin plate carrying device |
Also Published As
Publication number | Publication date |
---|---|
JPS6214693Y2 (en) | 1987-04-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS58184841U (en) | Wafer transfer device | |
JPS60169838U (en) | semiconductor manufacturing equipment | |
JPS6117742U (en) | semiconductor manufacturing equipment | |
JPS59180424U (en) | Jig for semiconductor substrate | |
JPS6117734U (en) | Furnace tube of wafer heat treatment equipment | |
JPS59195741U (en) | Wafer transfer device | |
JPS6133443U (en) | Wafer transfer device | |
JPS619834U (en) | semiconductor wafer | |
JPS6052625U (en) | Wafer transfer device | |
JPS6131662U (en) | Tweezers for gripping semiconductors | |
JPS5885399U (en) | Chip element mounting mechanism | |
JPS60180206U (en) | Wafer transfer device | |
JPS59103436U (en) | Boat for semiconductor wafers | |
JPS5948052U (en) | Wafer transfer device | |
JPS6064926U (en) | Wafer transfer device | |
JPS593541U (en) | Semiconductor substrate transport mechanism | |
JPS6135748U (en) | Tweezers for semiconductor wafers | |
JPS5914341U (en) | Semiconductor device manufacturing equipment | |
JPS593556U (en) | semiconductor equipment | |
JPS58147155U (en) | Tube mount conveyance device | |
JPS60111039U (en) | vacuum chuck | |
JPS5999447U (en) | Package for semiconductors | |
JPS60143683U (en) | handling mechanism | |
JPS6014880U (en) | handling equipment | |
JPS6049636U (en) | Thin gripping device |