JPS593556U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS593556U JPS593556U JP9786182U JP9786182U JPS593556U JP S593556 U JPS593556 U JP S593556U JP 9786182 U JP9786182 U JP 9786182U JP 9786182 U JP9786182 U JP 9786182U JP S593556 U JPS593556 U JP S593556U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- semiconductor pellet
- semiconductor
- notch
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の半導体装置の一例を示す一部透視平面図
、第２図は第１図半導体装置の製造に用いられるリード
フレームの平面図、第３図はり−ドフレームの他の例を
示す平面図、第４図は第３−図Ａ−Ａ断面図、第５図及
び第７図は第３図リードフレームの製法を説明する平面
図、第６図は第５図Ｂ−Ｂ断面図、第８図は第７図Ｃ−
Ｃ断面図、第９図は第３図リードフレームの変形例を示
す側面図、第１０図は本考案の一実施例を示す半導体装
置の一部透視平面図、第１１図は第１０図一部透視側面
図である。
１３・・・基板、１３ｂ・・・切欠き部、１４・・・半
導体ペレット、１５．１５Ｃ・・・リード。Fig. 1 is a partially transparent plan view showing an example of a conventional semiconductor device, Fig. 2 is a plan view of a lead frame used in the manufacture of the semiconductor device shown in Fig. 1, and Fig. 3 shows another example of a lead frame. FIG. 4 is a sectional view taken along line A-A in FIG. 3, FIGS. 5 and 7 are plan views explaining the manufacturing method of the lead frame shown in FIG. Figure 8 is Figure 7C-
9 is a side view showing a modification of the lead frame shown in FIG. 3, FIG. 10 is a partially transparent plan view of a semiconductor device showing an embodiment of the present invention, and FIG. FIG. 13...Substrate, 13b...Notch, 14...Semiconductor pellet, 15.15C...Lead.
Claims (1)
トの近傍に配置したリードの一端部とを電気的に接続し
たものにおいて、上記基板の半導、体ペレット載置部近
傍に切欠きを設け、リードの一端部を切欠き部に配置し
たことを特徴とする半導体装置。In a device in which an electrode of a semiconductor pellet placed on a substrate and one end of a lead placed near the semiconductor pellet are electrically connected, a notch is provided near the semiconductor pellet placement part of the substrate, A semiconductor device characterized in that one end of a lead is arranged in a notch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9786182U JPS593556U (en) | 1982-06-29 | 1982-06-29 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9786182U JPS593556U (en) | 1982-06-29 | 1982-06-29 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS593556U true JPS593556U (en) | 1984-01-11 |
Family
ID=30232595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9786182U Pending JPS593556U (en) | 1982-06-29 | 1982-06-29 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS593556U (en) |
-
1982
- 1982-06-29 JP JP9786182U patent/JPS593556U/en active Pending
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