JPS6133443U - Wafer transfer device - Google Patents

Wafer transfer device

Info

Publication number
JPS6133443U
JPS6133443U JP11564084U JP11564084U JPS6133443U JP S6133443 U JPS6133443 U JP S6133443U JP 11564084 U JP11564084 U JP 11564084U JP 11564084 U JP11564084 U JP 11564084U JP S6133443 U JPS6133443 U JP S6133443U
Authority
JP
Japan
Prior art keywords
wafer
pair
groove
transfer device
chuck plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11564084U
Other languages
Japanese (ja)
Other versions
JPH0249715Y2 (en
Inventor
良介 佐藤
晴彦 牧野
明和 小久保
和弘 杉田
Original Assignee
ソニー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ソニー株式会社 filed Critical ソニー株式会社
Priority to JP11564084U priority Critical patent/JPS6133443U/en
Publication of JPS6133443U publication Critical patent/JPS6133443U/en
Application granted granted Critical
Publication of JPH0249715Y2 publication Critical patent/JPH0249715Y2/ja
Granted legal-status Critical Current

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  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案ウエハー移載装置の一実施例を示す一部
切欠斜視図、第２図及び第３図は夫々本−考案の要部の
例を示す断面図、第４図は本考案の要部の例を示す拡大
切欠図である。 − １はウエハー移載装置本体、２はウエハーボート、
３はウエハープロセスキャリャ、４は半導体ウエハー、
５はウエハーハンドリンク装置、５ａ及び５ｂは夫々チ
ャック板、６ａ及び６ｂは夫夫縦溝である。FIG. 1 is a partially cutaway perspective view showing an embodiment of the wafer transfer device of the present invention, FIGS. 2 and 3 are cross-sectional views showing examples of essential parts of the present invention, and FIG. 4 is a perspective view of the present invention. FIG. - 1 is the wafer transfer device main body, 2 is the wafer boat,
3 is a wafer process carrier, 4 is a semiconductor wafer,
5 is a wafer hand link device, 5a and 5b are chuck plates, and 6a and 6b are vertical grooves.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 開閉自在な一対のウエハーハンドリ、ング用チャック板
を有しバッチ弐のウエハー移載装置に於いて、上記チャ
ック板は内側に複数のウエノ１−の厚みよりも幅広の溝
を等間隔に有し、且つ上記複数の溝は上記一対のチャイ
ク板が閉状態で上記一対のチャック板の対応する溝の先
端部の谷部間の間隔が上記ウエハーの径よりも小さくな
し、上記ウエハーを捕捉できる第１の溝と、上記一対の
チャック板が閉状態で上記一対のチャック板の対応ずる
溝の先端部の谷部間の間隔が上記ウエハーの径よりも大
きくなし、上記ウエハーを捕捉できない第２の溝とそ構
成し、上記第１の溝と第２の溝とを一定比一定間隔て設
け、ウエハー移載時に上記ウエハーのピッチ変換を容易
としたことを特徴とするウエハー移載装置。In the wafer transfer device for batch 2, which has a pair of wafer handling chuck plates that can be opened and closed, the chuck plate has grooves on the inside thereof that are wider than the thickness of the plurality of wafers 1- and are equally spaced apart. , and the plurality of grooves are configured such that when the pair of chuck plates are in a closed state, the interval between the troughs at the tips of the corresponding grooves of the pair of chuck plates is smaller than the diameter of the wafer, so that the wafer can be captured. A second groove that cannot capture the wafer by making the gap between the first groove and the trough at the tip of the corresponding groove of the pair of chuck plates larger than the diameter of the wafer when the pair of chuck plates are closed. A wafer transfer device characterized in that the first groove and the second groove are provided at a constant ratio and at a constant interval to facilitate pitch conversion of the wafer during wafer transfer.
JP11564084U 1984-07-28 1984-07-28 Wafer transfer device Granted JPS6133443U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11564084U JPS6133443U (en) 1984-07-28 1984-07-28 Wafer transfer device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11564084U JPS6133443U (en) 1984-07-28 1984-07-28 Wafer transfer device

Publications (2)

Publication Number Publication Date
JPS6133443U true JPS6133443U (en) 1986-02-28
JPH0249715Y2 JPH0249715Y2 (en) 1990-12-27

Family

ID=30674601

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11564084U Granted JPS6133443U (en) 1984-07-28 1984-07-28 Wafer transfer device

Country Status (1)

Country Link
JP (1) JPS6133443U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH021143A (en) * 1988-03-11 1990-01-05 Toshiba Corp Pitch changeover apparatus of semiconductor wafers
JPH0312216A (en) * 1989-06-09 1991-01-21 Toshiba Corp Moistureproof storage container

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54137960A (en) * 1978-04-19 1979-10-26 Hitachi Ltd Commodity transfer unit
JPS6045031A (en) * 1983-08-22 1985-03-11 Tomuko:Kk Automatic wafer transfer machine

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54137960A (en) * 1978-04-19 1979-10-26 Hitachi Ltd Commodity transfer unit
JPS6045031A (en) * 1983-08-22 1985-03-11 Tomuko:Kk Automatic wafer transfer machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH021143A (en) * 1988-03-11 1990-01-05 Toshiba Corp Pitch changeover apparatus of semiconductor wafers
JPH0312216A (en) * 1989-06-09 1991-01-21 Toshiba Corp Moistureproof storage container

Also Published As

Publication number Publication date
JPH0249715Y2 (en) 1990-12-27

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