JPS58475U - Carrier for board positioning - Google Patents
Carrier for board positioningInfo
- Publication number
- JPS58475U JPS58475U JP9417781U JP9417781U JPS58475U JP S58475 U JPS58475 U JP S58475U JP 9417781 U JP9417781 U JP 9417781U JP 9417781 U JP9417781 U JP 9417781U JP S58475 U JPS58475 U JP S58475U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- carrier
- positioning
- board positioning
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図はワイヤボンディング装置の平面図、第2図、第
3図はそれぞれ従来のキャリアの平面図、第4図は本考
案になるキャリアの一実施例を示す平面図である。
10・・・キャリア、11・・・ベース、12.13・
・・基板位置決め用ピン、14.14・・・板ばね。FIG. 1 is a plan view of a wire bonding apparatus, FIGS. 2 and 3 are plan views of conventional carriers, and FIG. 4 is a plan view showing an embodiment of the carrier according to the present invention. 10...Carrier, 11...Base, 12.13.
... Board positioning pin, 14.14... Leaf spring.
Claims (1)
めの基板位置決め用キャリアにおいて、基板を載置する
ベースと、このベースに植設され基板の直交する2辺を
それぞれ位置決めする基板位置決め用ピンと、前記ベー
スに設けられ前記基板の他方の直交する2辺にそれぞれ
圧接する板ばねとからなる基板位置決め用キャリア。
゛In a substrate positioning carrier for positioning and mounting a substrate and transporting it to a bonding position, a base on which the substrate is placed, substrate positioning pins implanted in this base and positioning two orthogonal sides of the substrate, respectively; A substrate positioning carrier comprising a plate spring provided on a base and press-contacted to the other two orthogonal sides of the substrate.
゛
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9417781U JPS58475U (en) | 1981-06-25 | 1981-06-25 | Carrier for board positioning |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9417781U JPS58475U (en) | 1981-06-25 | 1981-06-25 | Carrier for board positioning |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58475U true JPS58475U (en) | 1983-01-05 |
JPH0314061Y2 JPH0314061Y2 (en) | 1991-03-28 |
Family
ID=29889111
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9417781U Granted JPS58475U (en) | 1981-06-25 | 1981-06-25 | Carrier for board positioning |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58475U (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS498166A (en) * | 1972-05-10 | 1974-01-24 | ||
JPS5111766U (en) * | 1974-07-13 | 1976-01-28 | ||
JPS5415164A (en) * | 1977-07-04 | 1979-02-03 | Cii Honeywell Bull | Method and apparatus for positioning electric or electronic or similar parts at proper location relative to carrier |
-
1981
- 1981-06-25 JP JP9417781U patent/JPS58475U/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS498166A (en) * | 1972-05-10 | 1974-01-24 | ||
JPS5111766U (en) * | 1974-07-13 | 1976-01-28 | ||
JPS5415164A (en) * | 1977-07-04 | 1979-02-03 | Cii Honeywell Bull | Method and apparatus for positioning electric or electronic or similar parts at proper location relative to carrier |
Also Published As
Publication number | Publication date |
---|---|
JPH0314061Y2 (en) | 1991-03-28 |
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