JPS6051015U - Wafer scribing equipment - Google Patents
Wafer scribing equipmentInfo
- Publication number
- JPS6051015U JPS6051015U JP14335883U JP14335883U JPS6051015U JP S6051015 U JPS6051015 U JP S6051015U JP 14335883 U JP14335883 U JP 14335883U JP 14335883 U JP14335883 U JP 14335883U JP S6051015 U JPS6051015 U JP S6051015U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- wafer scribing
- scribing equipment
- cutting edge
- scribing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案装置の概略構成図、第２図は同刃先の移
動軌跡を示す図、第３図は他の実施例、第４図は第３図
における刃先の移動軌跡を示す図である。Figure 1 is a schematic configuration diagram of the device of the present invention, Figure 2 is a diagram showing the locus of movement of the same cutting edge, Figure 3 is a diagram showing another embodiment, and Figure 4 is a diagram showing the locus of movement of the cutting edge in Figure 3. be.
Claims (1)
を針状の刃先にてスクライブする装置に於て、前記刃先
とウェハの一方を他方に対して円弧状もしくはＶ字状に
移動させる手段を設け、ウェハの中央部のみスクライブ
するようにして成ることを特徴とするウェハのスクライ
ブ装置。In order to divide a semiconductor wafer into chips, an apparatus for scribing the wafer surface with a needle-like cutting edge is provided with means for moving one of the cutting edge and the wafer in an arcuate or V-shape relative to the other. A wafer scribing device characterized in that it is configured to scribe only the central portion of the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14335883U JPS6051015U (en) | 1983-09-14 | 1983-09-14 | Wafer scribing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14335883U JPS6051015U (en) | 1983-09-14 | 1983-09-14 | Wafer scribing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6051015U true JPS6051015U (en) | 1985-04-10 |
Family
ID=30320013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14335883U Pending JPS6051015U (en) | 1983-09-14 | 1983-09-14 | Wafer scribing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6051015U (en) |
-
1983
- 1983-09-14 JP JP14335883U patent/JPS6051015U/en active Pending
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