JPH01118436U - - Google Patents

Info

Publication number
JPH01118436U
JPH01118436U JP1415488U JP1415488U JPH01118436U JP H01118436 U JPH01118436 U JP H01118436U JP 1415488 U JP1415488 U JP 1415488U JP 1415488 U JP1415488 U JP 1415488U JP H01118436 U JPH01118436 U JP H01118436U
Authority
JP
Japan
Prior art keywords
drying
semiconductor wafer
cleaning
wafer cleaning
cleans
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1415488U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1415488U priority Critical patent/JPH01118436U/ja
Publication of JPH01118436U publication Critical patent/JPH01118436U/ja
Pending legal-status Critical Current

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  • Cleaning Or Drying Semiconductors (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の半導体ウエーハ洗浄乾燥装置
の一実施例を示す横断面図および側面図である。 １：流水槽、２：ウエーハ、３：保持治具、４
：気体噴射器、５：気体用配管、８：純水供給管
、９：排水管。 FIG. 1 is a cross-sectional view and a side view showing an embodiment of the semiconductor wafer cleaning and drying apparatus of the present invention. 1: Running water tank, 2: Wafer, 3: Holding jig, 4
: Gas injector, 5: Gas piping, 8: Pure water supply pipe, 9: Drain pipe.

Claims (1)

【実用新案登録請求の範囲】 １ 研磨されたウエーハを洗浄、乾燥して清浄な
鏡面状態に保持する半導体ウエーハ洗浄乾燥装置
において、前記ウエーハを洗浄する流水槽の水面
近傍に、洗浄が終了して水面に引上げられた前記
ウエーハに直ちに気体を吹付けて乾燥させる乾燥
気体噴射器が設けてあることを特徴とする半導体
ウエーハ洗浄乾燥装置。 ２ 前記乾燥気体噴射器は、噴射角度が自由に調
節できるものである実用新案登録請求の範囲第１
項記載の半導体ウエーハ洗浄乾燥装置。[Claims for Utility Model Registration] 1. In a semiconductor wafer cleaning and drying device that cleans and dries polished wafers and maintains them in a clean, mirror-like state, there is a device near the water surface of a running water tank that cleans the wafers after cleaning has been completed. A semiconductor wafer cleaning and drying apparatus characterized in that a drying gas injector is provided for immediately spraying and drying the wafer lifted to the water surface. 2. The dry gas injector has a spray angle that can be freely adjusted.
The semiconductor wafer cleaning and drying apparatus described in 1.
JP1415488U 1988-02-04 1988-02-04 Pending JPH01118436U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1415488U JPH01118436U (en) 1988-02-04 1988-02-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1415488U JPH01118436U (en) 1988-02-04 1988-02-04

Publications (1)

Publication Number Publication Date
JPH01118436U true JPH01118436U (en) 1989-08-10

Family

ID=31225100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1415488U Pending JPH01118436U (en) 1988-02-04 1988-02-04

Country Status (1)

Country Link
JP (1) JPH01118436U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0497525A (en) * 1990-08-16 1992-03-30 Nec Yamagata Ltd Wafer processing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0497525A (en) * 1990-08-16 1992-03-30 Nec Yamagata Ltd Wafer processing apparatus

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