JPH022832U - - Google Patents
Info
- Publication number
- JPH022832U JPH022832U JP7970388U JP7970388U JPH022832U JP H022832 U JPH022832 U JP H022832U JP 7970388 U JP7970388 U JP 7970388U JP 7970388 U JP7970388 U JP 7970388U JP H022832 U JPH022832 U JP H022832U
- Authority
- JP
- Japan
- Prior art keywords
- processing
- semiconductor substrate
- processing tank
- uniform
- fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- 239000012530 fluid Substances 0.000 claims 1
- 238000007654 immersion Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
Landscapes
- Weting (AREA)
Description
第１図は本考案の一実施例の配管図、第２図は
本考案の実施例２の配管図、第３図は従来の配管
図である。
１，１２……処理槽、２……ドレン口、３……
バツフア槽、４……貯液用バルブ、５，１３，１
７……送液ポンプ、６……ノズル、７……蓋、８
……キヤリア、９，１１，１５……処理液供給バ
ルブ、１０，１４，１８……フイルター、１６…
…外槽、１９……内槽。
FIG. 1 is a piping diagram of an embodiment of the present invention, FIG. 2 is a piping diagram of a second embodiment of the invention, and FIG. 3 is a conventional piping diagram. 1, 12...processing tank, 2...drain port, 3...
Buffer tank, 4...Liquid storage valve, 5, 13, 1
7...Liquid pump, 6...Nozzle, 7...Lid, 8
...Carrier, 9,11,15...Processing liquid supply valve, 10,14,18...Filter, 16...
...outer tank, 19...inner tank.
Claims (1)
て、半導体基板処理中の処理槽内の流体の流れを
均一かつ上方から下方にすることを特徴とする半
導体基板浸漬処理装置。 A semiconductor substrate immersion processing apparatus characterized in that, in a processing tank for immersing semiconductor substrates, the flow of fluid in the processing tank during semiconductor substrate processing is uniform and from top to bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7970388U JPH022832U (en) | 1988-06-15 | 1988-06-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7970388U JPH022832U (en) | 1988-06-15 | 1988-06-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH022832U true JPH022832U (en) | 1990-01-10 |
Family
ID=31304560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7970388U Pending JPH022832U (en) | 1988-06-15 | 1988-06-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH022832U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6366106U (en) * | 1986-10-16 | 1988-05-02 | ||
| JP2012142419A (en) * | 2010-12-28 | 2012-07-26 | Mitsubishi Electric Corp | Wet etching device |
-
1988
- 1988-06-15 JP JP7970388U patent/JPH022832U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6366106U (en) * | 1986-10-16 | 1988-05-02 | ||
| JP2012142419A (en) * | 2010-12-28 | 2012-07-26 | Mitsubishi Electric Corp | Wet etching device |
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