JPH0379424U - - Google Patents
Info
- Publication number
- JPH0379424U JPH0379424U JP13976789U JP13976789U JPH0379424U JP H0379424 U JPH0379424 U JP H0379424U JP 13976789 U JP13976789 U JP 13976789U JP 13976789 U JP13976789 U JP 13976789U JP H0379424 U JPH0379424 U JP H0379424U
- Authority
- JP
- Japan
- Prior art keywords
- cylinder
- wafer
- processing
- processing liquid
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 7
- 235000012431 wafers Nutrition 0.000 claims 6
Landscapes
- Weting (AREA)
Description
第１図は本考案の一実施例の半導体ウエーハの
片面処理装置を示す要部側断面図、第２図は従来
の半導体ウエーハの片面処理装置を示す要部側断
面図である。
１……処理液供給用液溜円筒、２，１２……半
導体ウエーハ、３，１１……半導体ウエーハ支持
チヤツク、５……弁、６……ポンプ、７……処理
液貯液槽、８……処理液、９……使用済処理液溜
、１０……外槽、１３……槽、１６……処理液導
入用通路。
FIG. 1 is a sectional side view of a main part of a semiconductor wafer single-sided processing apparatus according to an embodiment of the present invention, and FIG. 2 is a main part sectional side view of a conventional semiconductor wafer single-sided processing apparatus. DESCRIPTION OF SYMBOLS 1...Liquid storage cylinder for supplying processing liquid, 2, 12...Semiconductor wafer, 3, 11...Semiconductor wafer support chuck, 5...Valve, 6...Pump, 7...Processing liquid storage tank, 8... ...processing liquid, 9...used processing liquid reservoir, 10...outer tank, 13...tank, 16...processing liquid introduction passage.
Claims (1)
けた処理液供給用液溜が備えられた円筒と、前記
円筒の下に近接して設けられ且つ処理すべきウエ
ーハ面を上向きにして半導体ウエーハを回転可能
に支持するチヤツクを含み、前記円筒の上方から
処理液を供給することによつて前記ウエーハを処
理するようにしたことを特徴とする半導体ウエー
ハの片面処理装置。 A cylinder is provided with a processing liquid supply reservoir having a passage for introducing the processing liquid above the wafer processing surface, and a semiconductor wafer is placed close to the bottom of the cylinder, and the semiconductor wafer is placed with the wafer surface to be processed facing upward. 1. A single-side processing apparatus for semiconductor wafers, comprising a chuck that rotatably supports the cylinder, and processing the wafer by supplying a processing liquid from above the cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13976789U JPH0379424U (en) | 1989-11-30 | 1989-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13976789U JPH0379424U (en) | 1989-11-30 | 1989-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0379424U true JPH0379424U (en) | 1991-08-13 |
Family
ID=31686793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13976789U Pending JPH0379424U (en) | 1989-11-30 | 1989-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0379424U (en) |
-
1989
- 1989-11-30 JP JP13976789U patent/JPH0379424U/ja active Pending