JPH0246861U - - Google Patents

Info

Publication number
JPH0246861U
JPH0246861U JP12486488U JP12486488U JPH0246861U JP H0246861 U JPH0246861 U JP H0246861U JP 12486488 U JP12486488 U JP 12486488U JP 12486488 U JP12486488 U JP 12486488U JP H0246861 U JPH0246861 U JP H0246861U
Authority
JP
Japan
Prior art keywords
plating
small inner
inner tanks
utility
registration request
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12486488U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12486488U priority Critical patent/JPH0246861U/ja
Publication of JPH0246861U publication Critical patent/JPH0246861U/ja
Pending legal-status Critical Current

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Landscapes

  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の実施例1を示す構成図、第2
図は本考案の実施例2を示す構成図、第3図は従
来例を示す構成図である。 1……半導体基板、2……小型内槽、3……外
槽、4……メツキ液、5……パンチング板、6…
…噴出口、7……流量計、8……循環ポンプ。
Fig. 1 is a configuration diagram showing the first embodiment of the present invention;
The figure is a block diagram showing a second embodiment of the present invention, and FIG. 3 is a block diagram showing a conventional example. 1... Semiconductor substrate, 2... Small inner tank, 3... Outer tank, 4... Plating liquid, 5... Punching plate, 6...
...Spout port, 7...Flow meter, 8...Circulation pump.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体基板のメツキを行うメツキ装置において
、一枚処理用小型内槽の複数基をメツキ槽内に設
け、かつ、該小型内槽にメツキ液を供給する機構
を装備したことを特徴とするメツキ装置。
A plating device for plating semiconductor substrates, characterized in that the plating tank is provided with a plurality of small inner tanks for single-wafer processing, and is equipped with a mechanism for supplying plating liquid to the small inner tanks. .
JP12486488U 1988-09-24 1988-09-24 Pending JPH0246861U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12486488U JPH0246861U (en) 1988-09-24 1988-09-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12486488U JPH0246861U (en) 1988-09-24 1988-09-24

Publications (1)

Publication Number Publication Date
JPH0246861U true JPH0246861U (en) 1990-03-30

Family

ID=31374961

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12486488U Pending JPH0246861U (en) 1988-09-24 1988-09-24

Country Status (1)

Country Link
JP (1) JPH0246861U (en)

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