JPS62162263U - - Google Patents
Info
- Publication number
- JPS62162263U JPS62162263U JP5047686U JP5047686U JPS62162263U JP S62162263 U JPS62162263 U JP S62162263U JP 5047686 U JP5047686 U JP 5047686U JP 5047686 U JP5047686 U JP 5047686U JP S62162263 U JPS62162263 U JP S62162263U
- Authority
- JP
- Japan
- Prior art keywords
- plating
- center
- blow
- anode
- partial plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 4
- 238000005507 spraying Methods 0.000 description 1
Description
第１図は、本考案による部分めつき装置の噴き
あげ部分の一実施例を示す概略説明図であり、第
２図ａ及びｂは、本考案による部分めつき装置の
陽極部分の一実施例を示す概略説明図であり、第
３図は、本考案による部分めつき装置の一実施例
を示す概略説明図であり、第４図は、従来の部分
めつき装置の噴きあげ部分の一例を示す概略説明
図であり、第５図は、従来の部分めつき装置の噴
きあげ部分の他の例を示す概略説明図である。
１……部分めつき装置、２……上マスク、３…
…下マスク板、４……リードルーム、５……噴き
あげ部、６……陽極、７……めつき液、８……ス
パージヤー、９……ポンプ、１０……めつきタン
ク、１１……ヒータ、１２……温調器、１３……
中心線、１４……アイランド、１５……めつき被
膜。
FIG. 1 is a schematic explanatory diagram showing one embodiment of the blow-up part of the partial plating apparatus according to the present invention, and FIGS. 2 a and b are one embodiment of the anode part of the partial plating apparatus according to the present invention. FIG. 3 is a schematic explanatory diagram showing an embodiment of a partial plating device according to the present invention, and FIG. 4 is a schematic explanatory diagram showing an example of a blow-up portion of a conventional partial plating device. FIG. 5 is a schematic explanatory diagram showing another example of a blow-up portion of a conventional partial plating device. 1... partial plating device, 2... upper mask, 3...
... Lower mask plate, 4 ... Lead room, 5 ... Spraying section, 6 ... Anode, 7 ... Plating liquid, 8 ... Spargeer, 9 ... Pump, 10 ... Plating tank, 11 ... Heater, 12... Temperature controller, 13...
Center line, 14...Island, 15...Plating film.
Claims (1)
めつきエリアの中心部より外れた下方に位置し、
中心部を境にして前記噴きあげ部５の反対側に陽
極６を設置する事を特徴とする部分めつき装置１
。 The spouting part 5 of the plating liquid is located below and away from the center of the plating area of the lead frame 4,
Partial plating device 1 characterized in that an anode 6 is installed on the opposite side of the blow-up portion 5 with the center as a boundary.
.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5047686U JPH0414454Y2 (en) | 1986-04-04 | 1986-04-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5047686U JPH0414454Y2 (en) | 1986-04-04 | 1986-04-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62162263U true JPS62162263U (en) | 1987-10-15 |
| JPH0414454Y2 JPH0414454Y2 (en) | 1992-03-31 |
Family
ID=30873877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5047686U Expired JPH0414454Y2 (en) | 1986-04-04 | 1986-04-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0414454Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006328448A (en) * | 2005-05-24 | 2006-12-07 | Shinko Electric Ind Co Ltd | Partial plating apparatus and partial plating method |
-
1986
- 1986-04-04 JP JP5047686U patent/JPH0414454Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006328448A (en) * | 2005-05-24 | 2006-12-07 | Shinko Electric Ind Co Ltd | Partial plating apparatus and partial plating method |
| JP4644528B2 (en) * | 2005-05-24 | 2011-03-02 | 新光電気工業株式会社 | Partial plating apparatus and partial plating method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0414454Y2 (en) | 1992-03-31 |
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