JPS6364774U - - Google Patents
Info
- Publication number
- JPS6364774U JPS6364774U JP15627986U JP15627986U JPS6364774U JP S6364774 U JPS6364774 U JP S6364774U JP 15627986 U JP15627986 U JP 15627986U JP 15627986 U JP15627986 U JP 15627986U JP S6364774 U JPS6364774 U JP S6364774U
- Authority
- JP
- Japan
- Prior art keywords
- partial plating
- press plate
- heating element
- showing
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
第１図は、本考案の部分めつき装置の一実施例
を示す部分拡大断面図であり、第２図は、本考案
の部分めつき装置の一実施例を示す概略説明図で
ある。第３図は、リードフレームの一部分を示す
平面図であり、第４図は、従来の部分めつき装置
の一実施例を示す部分拡大断面図である。
１…プレス盤、２…マスク板、３…リードフレ
ーム、４…噴きあげ部、５…めつき液、６…めつ
き皮膜、７…プレス板、８…面状発熱体、９…ク
ツシヨン層、１０…マスク構造板、１１…クツシ
ヨン層、１２…陰極線、１３…部分めつき装置、
１４…陽極部、１５…スパージヤー、１６…めつ
きタンク、１７…タンク、１８…孔、１９…アイ
ランド部、２０…インナーリード部。
FIG. 1 is a partially enlarged sectional view showing one embodiment of the partial plating apparatus of the present invention, and FIG. 2 is a schematic explanatory diagram showing one embodiment of the partial plating apparatus of the present invention. FIG. 3 is a plan view showing a portion of a lead frame, and FIG. 4 is a partially enlarged sectional view showing an embodiment of a conventional partial plating apparatus. DESCRIPTION OF SYMBOLS 1...Press plate, 2...Mask plate, 3...Lead frame, 4...Blow-up part, 5...Plating liquid, 6...Plating film, 7...Press plate, 8...Planar heating element, 9...Cushion layer, 10... Mask structure plate, 11... Cushion layer, 12... Cathode ray, 13... Partial plating device,
14... Anode part, 15... Spargeer, 16... Plating tank, 17... Tank, 18... Hole, 19... Island part, 20... Inner lead part.
Claims (1)
熱体が設置されている事を特徴とする部分めつき
装置。 A partial plating device characterized in that a sheet heating element is installed on a press plate to uniformly heat the body to be plated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15627986U JPS6364774U (en) | 1986-10-13 | 1986-10-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15627986U JPS6364774U (en) | 1986-10-13 | 1986-10-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6364774U true JPS6364774U (en) | 1988-04-28 |
Family
ID=31077745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15627986U Pending JPS6364774U (en) | 1986-10-13 | 1986-10-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6364774U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0662551U (en) * | 1993-02-10 | 1994-09-02 | 株式会社三井ハイテック | Partial plating device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6187891A (en) * | 1984-10-03 | 1986-05-06 | Furukawa Electric Co Ltd:The | Method and device for partial plating on one side of metallic foil strid |
| JPS61231193A (en) * | 1985-04-03 | 1986-10-15 | Mitsubishi Electric Corp | Partial plating device |
-
1986
- 1986-10-13 JP JP15627986U patent/JPS6364774U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6187891A (en) * | 1984-10-03 | 1986-05-06 | Furukawa Electric Co Ltd:The | Method and device for partial plating on one side of metallic foil strid |
| JPS61231193A (en) * | 1985-04-03 | 1986-10-15 | Mitsubishi Electric Corp | Partial plating device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0662551U (en) * | 1993-02-10 | 1994-09-02 | 株式会社三井ハイテック | Partial plating device |
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