JPH0238472U - - Google Patents
Info
- Publication number
- JPH0238472U JPH0238472U JP11389988U JP11389988U JPH0238472U JP H0238472 U JPH0238472 U JP H0238472U JP 11389988 U JP11389988 U JP 11389988U JP 11389988 U JP11389988 U JP 11389988U JP H0238472 U JPH0238472 U JP H0238472U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- plating solution
- contact
- cathode
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 12
- 239000007788 liquid Substances 0.000 description 2
Landscapes
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Description
第1図はこの考案のウエフアーめつき装置の一
実施例を示した概略断面図、第2図は第1図に示
したウエフアーめつき装置のウエフアー固定機構
として用いられる部材の各々を示した概略斜視図
、第3図は第1図に示したウエフアーめつき装置
で用いられる導電性緩衝板の一実施例を示した概
略断面図、第4図は板状陰極とウエフアーとの固
定状態を拡大して示した概略断面図、第5図はめ
つきを施すウエフアーの表面を示した概略斜視図
、第6図は従来のウエフアーめつき装置を示した
概略断面図、第7図は第6図に示したウエフアー
めつき装置で用いられる針状陰極とウエフアーと
の接触状態を示した概略断面図である。
1……めつき液容器、3……陽極、4……ウエ
フアー、5……板状陰極、6……導電性緩衝板、
L……めつき液。
FIG. 1 is a schematic sectional view showing one embodiment of the wafer plating apparatus of this invention, and FIG. 2 is a schematic sectional view showing each member used as the wafer fixing mechanism of the wafer plating apparatus shown in FIG. A perspective view, FIG. 3 is a schematic sectional view showing an example of the conductive buffer plate used in the wafer plating apparatus shown in FIG. 1, and FIG. 4 is an enlarged view of the fixed state of the plate cathode and the wafer. 5 is a schematic sectional view showing the surface of a wafer to be plated, FIG. 6 is a schematic sectional view showing a conventional wafer plating apparatus, and FIG. FIG. 2 is a schematic cross-sectional view showing a state of contact between a needle cathode and a wafer used in the illustrated wafer plating apparatus. DESCRIPTION OF SYMBOLS 1... Plating liquid container, 3... Anode, 4... Wafer, 5... Plate cathode, 6... Conductive buffer plate,
L...Plating liquid.
Claims (1)
るめつき液容器内に、ウエフアーとめつき液とが
接触するようにめつき液をオーバーフローさせつ
つ供給してなるウエフアーのめつき装置であつて
、 上記ウエフアーを導電性緩衝板を介在させて板
状陰極上に押圧して固定することを特徴とするウ
エフアーめつき装置。[Scope of Claim for Utility Model Registration] A wafer comprising a plating solution supplied in a plating solution container having an anode and a cathode in contact with the wafer, while overflowing the plating solution so that the wafer and the plating solution come into contact with each other. A wafer plating apparatus, characterized in that the wafer is pressed and fixed onto a plate-shaped cathode with a conductive buffer plate interposed therebetween.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11389988U JPH0238472U (en) | 1988-08-30 | 1988-08-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11389988U JPH0238472U (en) | 1988-08-30 | 1988-08-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0238472U true JPH0238472U (en) | 1990-03-14 |
Family
ID=31354157
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11389988U Pending JPH0238472U (en) | 1988-08-30 | 1988-08-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0238472U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04280992A (en) * | 1991-03-11 | 1992-10-06 | Electroplating Eng Of Japan Co | Wafer plating device |
-
1988
- 1988-08-30 JP JP11389988U patent/JPH0238472U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04280992A (en) * | 1991-03-11 | 1992-10-06 | Electroplating Eng Of Japan Co | Wafer plating device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0238472U (en) | ||
JPS61191467U (en) | ||
JPS60195163U (en) | plate solder | |
JPS6410069U (en) | ||
JPS61187379U (en) | ||
JPH0233265U (en) | ||
JPS6219735U (en) | ||
JPH03100028U (en) | ||
JPS6324273U (en) | ||
JPS6236529U (en) | ||
JPH0437262U (en) | ||
JPS61116029U (en) | ||
JPS60172768U (en) | Lead frame partial plating device | |
JPH0269964U (en) | ||
JPS63162539U (en) | ||
JPH0474454U (en) | ||
JPS6235391U (en) | ||
JPS6314570U (en) | ||
JPS633626U (en) | ||
JPS6165629U (en) | ||
JPH0299970U (en) | ||
JPH0353564U (en) | ||
JPS5974630U (en) | switch | |
JPS6327871U (en) | ||
JPS6181180U (en) |