JPH0238472U

JPH0238472U -

Info

Publication number: JPH0238472U
Application number: JP11389988U
Authority: JP
Priority date: 1988-08-30
Filing date: 1988-08-30
Publication date: 1990-03-14

Description

[Brief explanation of drawings]

第１図はこの考案のウエフアーめつき装置の一
実施例を示した概略断面図、第２図は第１図に示
したウエフアーめつき装置のウエフアー固定機構
として用いられる部材の各々を示した概略斜視図
、第３図は第１図に示したウエフアーめつき装置
で用いられる導電性緩衝板の一実施例を示した概
略断面図、第４図は板状陰極とウエフアーとの固
定状態を拡大して示した概略断面図、第５図はめ
つきを施すウエフアーの表面を示した概略斜視図
、第６図は従来のウエフアーめつき装置を示した
概略断面図、第７図は第６図に示したウエフアー
めつき装置で用いられる針状陰極とウエフアーと
の接触状態を示した概略断面図である。１……めつき液容器、３……陽極、４……ウエ
フアー、５……板状陰極、６……導電性緩衝板、
Ｌ……めつき液。 FIG. 1 is a schematic sectional view showing one embodiment of the wafer plating apparatus of this invention, and FIG. 2 is a schematic sectional view showing each member used as the wafer fixing mechanism of the wafer plating apparatus shown in FIG. A perspective view, FIG. 3 is a schematic sectional view showing an example of the conductive buffer plate used in the wafer plating apparatus shown in FIG. 1, and FIG. 4 is an enlarged view of the fixed state of the plate cathode and the wafer. 5 is a schematic sectional view showing the surface of a wafer to be plated, FIG. 6 is a schematic sectional view showing a conventional wafer plating apparatus, and FIG. FIG. 2 is a schematic cross-sectional view showing a state of contact between a needle cathode and a wafer used in the illustrated wafer plating apparatus. DESCRIPTION OF SYMBOLS 1... Plating liquid container, 3... Anode, 4... Wafer, 5... Plate cathode, 6... Conductive buffer plate,
L...Plating liquid.

Claims

[Scope of Claim for Utility Model Registration] A wafer comprising a plating solution supplied in a plating solution container having an anode and a cathode in contact with the wafer, while overflowing the plating solution so that the wafer and the plating solution come into contact with each other. A wafer plating apparatus, characterized in that the wafer is pressed and fixed onto a plate-shaped cathode with a conductive buffer plate interposed therebetween.