JPH0353564U - - Google Patents
Info
- Publication number
- JPH0353564U JPH0353564U JP11208789U JP11208789U JPH0353564U JP H0353564 U JPH0353564 U JP H0353564U JP 11208789 U JP11208789 U JP 11208789U JP 11208789 U JP11208789 U JP 11208789U JP H0353564 U JPH0353564 U JP H0353564U
- Authority
- JP
- Japan
- Prior art keywords
- roller
- plating
- bus bar
- plate
- performs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第1図は本考案の鍍金装置の一実施例を示す平
面略示図、第2図は同側面略示図、第3図は第1
図のA部の要部拡大図、第4図は第3図の矢視B
方向からの要部側面図、第5図は従来例の側面略
示図、第6図は同平面略示図である。
2……ブスバー、3……支承治具、4……被鍍
金板、5……鍍金槽、6……鍍金液、7……ロー
ラ支承部、8……第1のローラ、10……テーパ
ローラ(第2のローラ)、10a……ローラ面。
FIG. 1 is a schematic plan view showing one embodiment of the plating apparatus of the present invention, FIG. 2 is a schematic side view of the same, and FIG.
An enlarged view of the main parts of part A in the figure, Figure 4 is the direction of arrow B in Figure 3.
FIG. 5 is a schematic side view of the conventional example, and FIG. 6 is a schematic plan view of the same. 2... bus bar, 3... support jig, 4... plate to be plated, 5... plating tank, 6... plating liquid, 7... roller support section, 8... first roller, 10... taper roller (second roller), 10a...roller surface.
Claims (1)
運動を行うブスバーと、ブスバーに固設され、陰
極板となる被鍍金板を鍍金槽の鍍金液中に吊下す
る支承治具とを有し、被鍍金板を移動運動せしめ
つつ鍍金処理する鍍金装置において、ブスバーか
ら突設するローラ支承部と、ローラ支承部先端に
設けられ、かつ上下方向に沿う回転中心軸線を有
する第1のローラと、鍍金槽に設けられ、互に水
平面内で平行な回転中心軸線を有し、かつブスバ
ーの長手方向と所定角度をもつた平行に対峙する
ローラ面により第1のローラを挟持してローラ面
に沿つて案内する第2のローラを具備することを
特徴とする鍍金装置。 It has a bus bar that reciprocates in the longitudinal direction or moves up and down at the same time as the reciprocating motion, and a support jig that is fixed to the bus bar and suspends the plate to be plated, which will become the cathode plate, into the plating solution in the plating bath. A plating apparatus that performs plating while moving a plating plate, includes a roller support protruding from a bus bar, a first roller provided at the tip of the roller support and having a rotational center axis along a vertical direction, and a plating tank. The first roller is guided along the roller surface by sandwiching the first roller between the roller surfaces which are provided in parallel to each other in a horizontal plane and which face each other in parallel and have a predetermined angle with the longitudinal direction of the bus bar. A plating device characterized by comprising a second roller that performs a plating process.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11208789U JPH0410223Y2 (en) | 1989-09-27 | 1989-09-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11208789U JPH0410223Y2 (en) | 1989-09-27 | 1989-09-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0353564U true JPH0353564U (en) | 1991-05-23 |
JPH0410223Y2 JPH0410223Y2 (en) | 1992-03-13 |
Family
ID=31660542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11208789U Expired JPH0410223Y2 (en) | 1989-09-27 | 1989-09-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0410223Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101381102B1 (en) * | 2012-04-10 | 2014-04-04 | 최광식 | Cathode frame for recovery apparatus of precious metal |
-
1989
- 1989-09-27 JP JP11208789U patent/JPH0410223Y2/ja not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101381102B1 (en) * | 2012-04-10 | 2014-04-04 | 최광식 | Cathode frame for recovery apparatus of precious metal |
Also Published As
Publication number | Publication date |
---|---|
JPH0410223Y2 (en) | 1992-03-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0353564U (en) | ||
JPH0334056U (en) | ||
CN213898172U (en) | Extensible concrete vibrator | |
JPS6433572U (en) | ||
JPH0238472U (en) | ||
JP3178164B2 (en) | Electroplating equipment | |
JPS59110180U (en) | Manufacturing jig for beam-shaped structures | |
JPS6414163U (en) | ||
JPH0336U (en) | ||
JPS5924768U (en) | Anode electrode for plating | |
JPS61111641U (en) | ||
JPS61205612U (en) | ||
JPS6364773U (en) | ||
JPS62118170U (en) | ||
JPH04977U (en) | ||
JPS62179214U (en) | ||
JPS61106377U (en) | ||
JPS6230382U (en) | ||
JPS63140359U (en) | ||
JPH0178168U (en) | ||
JPS61201722U (en) | ||
JPH0278222U (en) | ||
JPS63135973U (en) | ||
JPS63170074U (en) | ||
JPS637171U (en) |