JPS6230382U - - Google Patents
Info
- Publication number
- JPS6230382U JPS6230382U JP12236085U JP12236085U JPS6230382U JP S6230382 U JPS6230382 U JP S6230382U JP 12236085 U JP12236085 U JP 12236085U JP 12236085 U JP12236085 U JP 12236085U JP S6230382 U JPS6230382 U JP S6230382U
- Authority
- JP
- Japan
- Prior art keywords
- plating
- circuit board
- printed circuit
- tank
- divided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 15
- 238000009713 electroplating Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は本考案に係るメツキ装置の説明図、第
２図は第１図の実施例によるメツキ処理の説明図
、第３図は従来のメツキ装置の説明図、第４図は
第３図の従来例によるメツキ処理の説明図である
。
１０……メツキ槽、１２……メツキ液、１４…
…プリント基板、１８……電圧装置、２０……陽
極板、２８……スルーホール、３４……保持部、
３８……回転軸、４０……容積物。
FIG. 1 is an explanatory diagram of the plating device according to the present invention, FIG. 2 is an explanatory diagram of the plating process according to the embodiment of FIG. 1, FIG. 3 is an explanatory diagram of the conventional plating device, and FIG. 4 is the diagram shown in FIG. FIG. 2 is an explanatory diagram of plating processing according to a conventional example. 10... plating tank, 12... plating liquid, 14...
... Printed circuit board, 18 ... Voltage device, 20 ... Anode plate, 28 ... Through hole, 34 ... Holding part,
38...rotating shaft, 40...volume object.
Claims (1)
たスルーホールを有するプリント基板を浸し、槽
内に配設された電極と前記プリント基板のメツキ
層間に直流電圧を印加して電気メツキを施すプリ
ント基板のメツキ装置において、前記メツキ槽の
略中央部にプリント基板を縦設してメツキ槽を分
割し、プリント基板下方で分割されたメツキ槽の
連通部に容積物を各槽側に移動可能に設けること
を特徴とするプリント基板のメツキ装置。 A printed circuit board having through-holes with a lower plating layer is immersed in a plating solution in a plating tank, and a DC voltage is applied between an electrode placed in the tank and the plating layer of the printed circuit board to perform electroplating. In a circuit board plating device, a printed circuit board is installed vertically in the approximate center of the plating tank, the plating tank is divided, and a volume can be moved to each tank side through a communicating part of the divided plating tank below the printed circuit board. A printed circuit board plating device characterized by being provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12236085U JPS6230382U (en) | 1985-08-09 | 1985-08-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12236085U JPS6230382U (en) | 1985-08-09 | 1985-08-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6230382U true JPS6230382U (en) | 1987-02-24 |
Family
ID=31012473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12236085U Pending JPS6230382U (en) | 1985-08-09 | 1985-08-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6230382U (en) |
-
1985
- 1985-08-09 JP JP12236085U patent/JPS6230382U/ja active Pending
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