JPS60172768U - Lead frame partial plating device - Google Patents
Lead frame partial plating deviceInfo
- Publication number
- JPS60172768U JPS60172768U JP6161884U JP6161884U JPS60172768U JP S60172768 U JPS60172768 U JP S60172768U JP 6161884 U JP6161884 U JP 6161884U JP 6161884 U JP6161884 U JP 6161884U JP S60172768 U JPS60172768 U JP S60172768U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- partial plating
- plating device
- frame partial
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はリードフレームの部分メッキ装置の全体図を模
式的に示す側面図、第２，３図は従来のマスク板の使用
状態を説明する断面図、第４図は本考案に係わる部分メ
ッキ装置のマスク板の一部を示す断面図、第５図は第４
図のマスク板の平面図、第６図は第４図のマスク板にデ
ィンプル加工したリードフレームをセットした状態を示
す断面図である。
２・・・・・・メッキ槽、３・・・・・・ポンプ、４・
・・・・・スパージャ−１５・・・・・・陽極部、６・
・・・・・マスク板、７・・・・・・メッキエリア、８
−−−−−−リードフレーム、１２・・・・・・ゴムプ
レス盤、１３・・・・・・陰極線−１１４・・・・・・
ヒータ、１５・・・・・・温度センサー、１６・・・・
・・マスク板、１６ａ・・・・・・基板、１６ｂ・・・
・・・弾性層、１７・・・・・・窪み、１８・・・・・
・メッキエリア。Fig. 1 is a side view schematically showing the overall view of a lead frame partial plating device, Figs. 2 and 3 are cross-sectional views illustrating how a conventional mask plate is used, and Fig. 4 is a partial plating device according to the present invention. A cross-sectional view showing a part of the mask plate of the device, FIG.
FIG. 6 is a plan view of the mask plate shown in the figure, and FIG. 6 is a sectional view showing a state in which a dimpled lead frame is set on the mask plate of FIG. 2...Plating tank, 3...Pump, 4.
... Sparger 15 ... Anode section, 6.
...Mask board, 7...Plating area, 8
---Lead frame, 12...Rubber press plate, 13...Cathode ray-114...
Heater, 15...Temperature sensor, 16...
...Mask plate, 16a...Substrate, 16b...
...Elastic layer, 17...Indentation, 18...
・Plating area.
Claims (1)
極機構と、被メツキ物品の必要メッキ部分のみを露出さ
せるためのマスク板とを具備してなるリードフレームの
部分メッキ装置において、上記マスク板が、その上面に
ディンプル加工リートフレームをセットしたとき、アイ
ランド部の吊りリードのディンプル部分を完全に落ち込
ませる窪みを有することを特徴とする装置。In a lead frame partial plating apparatus comprising a plating bath, a plating liquid injection mechanism to an article to be plated, an electrode mechanism, and a mask plate for exposing only the necessary plated portion of the article to be plated, the above-mentioned mask is provided. A device characterized in that the board has a recess into which the dimpled part of the hanging lead of the island part is completely depressed when the dimpled reed frame is set on the upper surface of the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6161884U JPS60172768U (en) | 1984-04-26 | 1984-04-26 | Lead frame partial plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6161884U JPS60172768U (en) | 1984-04-26 | 1984-04-26 | Lead frame partial plating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60172768U true JPS60172768U (en) | 1985-11-15 |
Family
ID=30590055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6161884U Pending JPS60172768U (en) | 1984-04-26 | 1984-04-26 | Lead frame partial plating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60172768U (en) |
-
1984
- 1984-04-26 JP JP6161884U patent/JPS60172768U/en active Pending
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