JPS6016764U - electroplating equipment - Google Patents

electroplating equipment

Info

Publication number
JPS6016764U
JPS6016764U JP10119883U JP10119883U JPS6016764U JP S6016764 U JPS6016764 U JP S6016764U JP 10119883 U JP10119883 U JP 10119883U JP 10119883 U JP10119883 U JP 10119883U JP S6016764 U JPS6016764 U JP S6016764U
Authority
JP
Japan
Prior art keywords
plating
plated
plating tank
electroplating equipment
tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10119883U
Other languages
Japanese (ja)
Inventor
正己 鈴木
邦明 関口
Original Assignee
日立コンデンサ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立コンデンサ株式会社 filed Critical 日立コンデンサ株式会社
Priority to JP10119883U priority Critical patent/JPS6016764U/en
Publication of JPS6016764U publication Critical patent/JPS6016764U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の電気めっき装置の斜視図、第２図は本考
案の実施例の斜視図を示す。 １１−・・めっき槽、１２ａ、　ｉ２ｂ、　１２ｃ。 １３ａ、　　１３ｂ、　　１３Ｃ−・・金属棒、１４ａ
、１４ｂ。 １４Ｃ，１５ａ、　　１５ｂ、　　１５Ｃ−・・金属棒
の先端、１６．１７・・・側壁。FIG. 1 is a perspective view of a conventional electroplating apparatus, and FIG. 2 is a perspective view of an embodiment of the present invention. 11-... Plating tank, 12a, i2b, 12c. 13a, 13b, 13C--metal rod, 14a
, 14b. 14C, 15a, 15b, 15C--tip of metal rod, 16.17... side wall.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] めっき槽に収納されためつき液に被めっき材を浸漬し、
前記めっき槽と前記めつき槽内に配設された金属棒に電
圧を印加１．て前記波めっき材をめっきしうる電気めっ
き装置において、めつき槽内に、先端が該めっき槽の側
壁の延長面よりも外側に配設されかつ該先端が互いに接
続された電極を形成する金属棒を設けることを特徴とす
る電気めつき装置。The material to be plated is immersed in the plating solution stored in the plating tank.
Applying a voltage to the plating tank and a metal rod disposed in the plating tank 1. In an electroplating apparatus capable of plating the wave-plated material, a metal forming an electrode having a tip disposed outside an extended surface of a side wall of the plating bath and whose tips are connected to each other in the plating bath. An electroplating device characterized by being provided with a rod.
JP10119883U 1983-06-30 1983-06-30 electroplating equipment Pending JPS6016764U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10119883U JPS6016764U (en) 1983-06-30 1983-06-30 electroplating equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10119883U JPS6016764U (en) 1983-06-30 1983-06-30 electroplating equipment

Publications (1)

Publication Number Publication Date
JPS6016764U true JPS6016764U (en) 1985-02-04

Family

ID=30239072

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10119883U Pending JPS6016764U (en) 1983-06-30 1983-06-30 electroplating equipment

Country Status (1)

Country Link
JP (1) JPS6016764U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013027782A (en) * 2002-09-30 2013-02-07 Relievant Medsystems Inc Intraosseous nerve denervation device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013027782A (en) * 2002-09-30 2013-02-07 Relievant Medsystems Inc Intraosseous nerve denervation device

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