JPS59125973U - plating device - Google Patents

plating device

Info

Publication number
JPS59125973U
JPS59125973U JP2139183U JP2139183U JPS59125973U JP S59125973 U JPS59125973 U JP S59125973U JP 2139183 U JP2139183 U JP 2139183U JP 2139183 U JP2139183 U JP 2139183U JP S59125973 U JPS59125973 U JP S59125973U
Authority
JP
Japan
Prior art keywords
plating
plating device
nozzle
plating tank
tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2139183U
Other languages
Japanese (ja)
Inventor
山田　鎭浩
Original Assignee
株式会社山田メッキ工業所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社山田メッキ工業所 filed Critical 株式会社山田メッキ工業所
Priority to JP2139183U priority Critical patent/JPS59125973U/en
Publication of JPS59125973U publication Critical patent/JPS59125973U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

図面は本考案の一実施例を示し、第１図は全体の縦断面
図、第２図はノズルの斜視図である。 図中、１はメッキ槽、３はプリント基板（被メッキ物）
、４はノズル、５は噴射口、７は高圧ポンプである。The drawings show an embodiment of the present invention, with FIG. 1 being a longitudinal cross-sectional view of the entire device, and FIG. 2 being a perspective view of the nozzle. In the figure, 1 is a plating tank, 3 is a printed circuit board (object to be plated)
, 4 is a nozzle, 5 is an injection port, and 7 is a high-pressure pump.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] メッキ液を貯留したメッキ槽と、このメッキ槽内に配設
されスリット状の噴射口を有するノズルとを備え、前記
メッキ槽内の被メッキ物に前記ノズルからメッキ液を噴
射しつつ被メッキ物及びノズルを相対的に移動させるよ
うにしたことを特徴とするメッキ装置。The plating tank is equipped with a plating tank that stores a plating solution, and a nozzle that is disposed in the plating tank and has a slit-shaped injection port. and a plating device characterized in that the nozzle is relatively moved.
JP2139183U 1983-02-15 1983-02-15 plating device Pending JPS59125973U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2139183U JPS59125973U (en) 1983-02-15 1983-02-15 plating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2139183U JPS59125973U (en) 1983-02-15 1983-02-15 plating device

Publications (1)

Publication Number Publication Date
JPS59125973U true JPS59125973U (en) 1984-08-24

Family

ID=30152515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2139183U Pending JPS59125973U (en) 1983-02-15 1983-02-15 plating device

Country Status (1)

Country Link
JP (1) JPS59125973U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010216006A (en) * 2009-02-19 2010-09-30 Denso Corp Method for jet stream type plating, and device
JP2014129603A (en) * 2012-12-31 2014-07-10 Samsung Electro-Mechanics Co Ltd Plating device for a printed substrate
JP2015134956A (en) * 2013-12-20 2015-07-27 アイシン精機株式会社 Plating apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5534698A (en) * 1978-08-31 1980-03-11 Production Machinery Corp Apparatus for plating metal strip and method of using same
JPS5642976B2 (en) * 1978-05-04 1981-10-08

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5642976B2 (en) * 1978-05-04 1981-10-08
JPS5534698A (en) * 1978-08-31 1980-03-11 Production Machinery Corp Apparatus for plating metal strip and method of using same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010216006A (en) * 2009-02-19 2010-09-30 Denso Corp Method for jet stream type plating, and device
JP2014129603A (en) * 2012-12-31 2014-07-10 Samsung Electro-Mechanics Co Ltd Plating device for a printed substrate
JP2015134956A (en) * 2013-12-20 2015-07-27 アイシン精機株式会社 Plating apparatus

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