JPS59117171U - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS59117171U
JPS59117171U JP1983009977U JP997783U JPS59117171U JP S59117171 U JPS59117171 U JP S59117171U JP 1983009977 U JP1983009977 U JP 1983009977U JP 997783 U JP997783 U JP 997783U JP S59117171 U JPS59117171 U JP S59117171U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
pattern
outside
terminal pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983009977U
Other languages
Japanese (ja)
Inventor
西村　保久
田口　靖伸
Original Assignee
沖電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 沖電気工業株式会社 filed Critical 沖電気工業株式会社
Priority to JP1983009977U priority Critical patent/JPS59117171U/en
Publication of JPS59117171U publication Critical patent/JPS59117171U/en
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図Ａ、　Ｂは従来基板の端子部パターンの正面図及
び断面拡大図、第２図Ａ、　Ｂは本考案の一実施例の端
子パターンを示す正面図及び断面拡大図である。 １・・・基板、２・・・基板端部、３・・・端子部パタ
ーン、４・・・電子回路パターン、５・・・接触部、９
・・・薄材は金めつきパターン、１０・・・厚付は金め
つきパターン。1A and 1B are a front view and an enlarged sectional view of a terminal pattern of a conventional board, and FIGS. 2A and 2B are a front view and an enlarged sectional view of a terminal pattern of an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Board, 2... Board edge, 3... Terminal part pattern, 4... Electronic circuit pattern, 5... Contact part, 9
...Thin material has a gold plating pattern, 10...Thick material has a gold plating pattern.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 銅張積層板に所定の回路パターンと該回路と外部に接続
するための端子部パターンとを有するプリント配線板に
おいて、前記端子部パターンは外部との接触部が厚くか
つその他の部分は薄くめっきが施されていることを特徴
とするプリント配線板。In a printed wiring board having a copper-clad laminate with a predetermined circuit pattern and a terminal pattern for connecting the circuit to the outside, the terminal pattern has a thick part in contact with the outside and a thin plating in other parts. A printed wiring board characterized by:
JP1983009977U 1983-01-28 1983-01-28 printed wiring board Pending JPS59117171U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983009977U JPS59117171U (en) 1983-01-28 1983-01-28 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983009977U JPS59117171U (en) 1983-01-28 1983-01-28 printed wiring board

Publications (1)

Publication Number Publication Date
JPS59117171U true JPS59117171U (en) 1984-08-07

Family

ID=30141424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983009977U Pending JPS59117171U (en) 1983-01-28 1983-01-28 printed wiring board

Country Status (1)

Country Link
JP (1) JPS59117171U (en)

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