JPS60169857U - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS60169857U JPS60169857U JP5769584U JP5769584U JPS60169857U JP S60169857 U JPS60169857 U JP S60169857U JP 5769584 U JP5769584 U JP 5769584U JP 5769584 U JP5769584 U JP 5769584U JP S60169857 U JPS60169857 U JP S60169857U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- board
- circuit board
- printed board
- disposable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図Ａは従来例のプリント基板、同ＢはＡのプリント
基板のソリの状態を示す図、第２図Ａは本考案に係る一
実施例を示す図、同ＢはＡの捨て基板の一部拡大図、第
３図は及び第４図は他の一実施例を示す図である。
１・・・プリント基板、２・・・回路構成基板、３・・
・捨て基板、４・・・ミシン目、５・・・捨て基板に形
成された銅箔。FIG. 1A is a diagram showing a conventional printed circuit board, FIG. 1B is a diagram showing the state of warpage of the printed circuit board A, FIG. Partially enlarged views, FIG. 3 and FIG. 4 are views showing another embodiment. 1... Printed circuit board, 2... Circuit configuration board, 3...
- Discarded board, 4... Perforation, 5... Copper foil formed on the discarded board.
Claims (1)
ない捨て基板とを有するプリント基板において、前記プ
リント基板のソリを防止するために前記捨て基板の一面
側に所望量の銅箔を形成したことを特徴とするプリント
基板。In a printed circuit board having a printed circuit board on which a circuit is formed and a disposable board on which no circuit is formed, a desired amount of copper foil is formed on one side of the disposable board in order to prevent warping of the printed circuit board. A printed circuit board featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5769584U JPS60169857U (en) | 1984-04-19 | 1984-04-19 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5769584U JPS60169857U (en) | 1984-04-19 | 1984-04-19 | Printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60169857U true JPS60169857U (en) | 1985-11-11 |
Family
ID=30582464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5769584U Pending JPS60169857U (en) | 1984-04-19 | 1984-04-19 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60169857U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01296690A (en) * | 1988-05-24 | 1989-11-30 | Hokuriku Electric Ind Co Ltd | Printed board |
| JPH0851258A (en) * | 1994-08-05 | 1996-02-20 | Sharp Corp | Dummy pattern on printed wiring board |
| JPH09107159A (en) * | 1996-10-07 | 1997-04-22 | Hokuriku Electric Ind Co Ltd | Circuit board and method of manufacture |
| JPH11177191A (en) * | 1997-12-12 | 1999-07-02 | Mitsubishi Electric Corp | Printed circuit board and multi-layer printed circuit board |
| JP2001053394A (en) * | 1999-08-16 | 2001-02-23 | Ibiden Co Ltd | Wiring board and manufacture thereof |
| JP2002076529A (en) * | 2000-08-24 | 2002-03-15 | Funai Electric Co Ltd | Printed board |
| KR20100062922A (en) * | 2008-12-02 | 2010-06-10 | 신꼬오덴기 고교 가부시키가이샤 | Wiring board and electronic component device |
| JP2019121617A (en) * | 2017-12-28 | 2019-07-22 | 日立オートモティブシステムズ株式会社 | Circuit-board of electronic control equipment and manufacturing method thereof |
-
1984
- 1984-04-19 JP JP5769584U patent/JPS60169857U/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01296690A (en) * | 1988-05-24 | 1989-11-30 | Hokuriku Electric Ind Co Ltd | Printed board |
| JPH0851258A (en) * | 1994-08-05 | 1996-02-20 | Sharp Corp | Dummy pattern on printed wiring board |
| JPH09107159A (en) * | 1996-10-07 | 1997-04-22 | Hokuriku Electric Ind Co Ltd | Circuit board and method of manufacture |
| JPH11177191A (en) * | 1997-12-12 | 1999-07-02 | Mitsubishi Electric Corp | Printed circuit board and multi-layer printed circuit board |
| JP2001053394A (en) * | 1999-08-16 | 2001-02-23 | Ibiden Co Ltd | Wiring board and manufacture thereof |
| JP2002076529A (en) * | 2000-08-24 | 2002-03-15 | Funai Electric Co Ltd | Printed board |
| KR20100062922A (en) * | 2008-12-02 | 2010-06-10 | 신꼬오덴기 고교 가부시키가이샤 | Wiring board and electronic component device |
| JP2010135418A (en) * | 2008-12-02 | 2010-06-17 | Shinko Electric Ind Co Ltd | Wiring board and electronic component device |
| JP2019121617A (en) * | 2017-12-28 | 2019-07-22 | 日立オートモティブシステムズ株式会社 | Circuit-board of electronic control equipment and manufacturing method thereof |
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