JPS59162162U - Jet solder dip equipment - Google Patents
Jet solder dip equipmentInfo
- Publication number
- JPS59162162U JPS59162162U JP5483983U JP5483983U JPS59162162U JP S59162162 U JPS59162162 U JP S59162162U JP 5483983 U JP5483983 U JP 5483983U JP 5483983 U JP5483983 U JP 5483983U JP S59162162 U JPS59162162 U JP S59162162U
- Authority
- JP
- Japan
- Prior art keywords
- duct
- jet solder
- solder
- solder dip
- jet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図はこの考案例の縦断面図、第2図は要部の斜視図
、第3図は従来例の説明図である。
1・・・・・・はんだ槽、1a・・・・・・上縁、2・
・・・・・ダクト、2a・・・・・・入口、2b・・・
・・・出口、3・・・・・・はんだ液、4・・・・・・
送出機構、5・・・・・・筒体、6・・・・・・昇降ス
タンド、6a・・・・・・上面、1・・・・・・間隔。FIG. 1 is a longitudinal sectional view of this example of the invention, FIG. 2 is a perspective view of the main parts, and FIG. 3 is an explanatory diagram of a conventional example. 1...Solder bath, 1a...Top edge, 2.
...Duct, 2a...Inlet, 2b...
...Outlet, 3...Solder liquid, 4...
Delivery mechanism, 5...Cylinder, 6...Elevating stand, 6a...Top surface, 1...Interval.
Claims (1)
はんだ液3の送出機構4を設け、はんだ槽1の上縁1a
より突出する筒体5をダクト2の出口2bへ設けた噴流
式はんだディップ装置において、筒体5の外周へ小間隔
1を経て昇降スタンド6を設け、この昇降スタンド6の
上面6aを水平に形成することを特徴とする噴流式はん
だディップ装置におけるノズル。A duct 2 is provided in the solder bath 1, a delivery mechanism 4 for the solder liquid 3 is provided to the inlet 2a of the duct 2, and an upper edge 1a of the solder bath 1 is provided.
In a jet soldering dipping device in which a cylindrical body 5 that protrudes more is provided at the outlet 2b of the duct 2, an elevating stand 6 is provided at a small interval 1 on the outer periphery of the cylindrical body 5, and the upper surface 6a of this elevating stand 6 is formed horizontally. A nozzle in a jet solder dipping device characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5483983U JPS59162162U (en) | 1983-04-14 | 1983-04-14 | Jet solder dip equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5483983U JPS59162162U (en) | 1983-04-14 | 1983-04-14 | Jet solder dip equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59162162U true JPS59162162U (en) | 1984-10-30 |
JPS6213731Y2 JPS6213731Y2 (en) | 1987-04-08 |
Family
ID=30185183
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5483983U Granted JPS59162162U (en) | 1983-04-14 | 1983-04-14 | Jet solder dip equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59162162U (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5391500B2 (en) * | 2009-05-21 | 2014-01-15 | 三菱電機株式会社 | Soldering nozzle and soldering device |
-
1983
- 1983-04-14 JP JP5483983U patent/JPS59162162U/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6213731Y2 (en) | 1987-04-08 |
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