JPS62113860U - - Google Patents
Info
- Publication number
- JPS62113860U JPS62113860U JP45586U JP45586U JPS62113860U JP S62113860 U JPS62113860 U JP S62113860U JP 45586 U JP45586 U JP 45586U JP 45586 U JP45586 U JP 45586U JP S62113860 U JPS62113860 U JP S62113860U
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- jet pump
- main body
- soldering
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 4
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例を示す縦断面図、第
２図は上記実施例に用いるオーバフロー型ノズル
の斜視図、第３図は本考案の他の実施例を示す縦
断面図、第４図ないし第７図は従来の各種はんだ
付け装置を示す縦断面図である。
Ｐ：プリント基板、１：はんだ槽外枠、２：フ
ローデイツプ型はんだ槽、３：噴流ポンプ、４：
溶融はんだ、５：オーバフロー型ノズル、５ａ：
ノズル本体、５ｂ：はんだ噴流開口部、５ｃ：本
体底部。
FIG. 1 is a longitudinal sectional view showing one embodiment of the present invention, FIG. 2 is a perspective view of an overflow type nozzle used in the above embodiment, and FIG. 3 is a longitudinal sectional view showing another embodiment of the invention. 4 to 7 are vertical sectional views showing various conventional soldering devices. P: Printed circuit board, 1: Solder tank outer frame, 2: Flow dip type solder tank, 3: Jet pump, 4:
Molten solder, 5: Overflow type nozzle, 5a:
Nozzle main body, 5b: solder jet opening, 5c: main body bottom.
Claims (1)
槽に、はんだ噴流開口部を狭く形成した自動はん
だ付け専用のオーバフロー型のノズルを着脱可能
に嵌装し、更に前記ノズルの本体底部を開口して
、前記ノズルを前記フローデイツプ型はんだ槽に
嵌装して時に前記噴流ポンプが前記開口部を通し
て前記ノズルの本体内部に収容されるように構成
してなることを特徴とするはんだ付け装置。 An overflow type nozzle for automatic soldering, which has a narrow solder jet opening, is removably fitted into a flow dip type solder bath equipped with a jet pump, and the bottom of the main body of the nozzle is opened, and the nozzle is removed. A soldering apparatus characterized in that the jet pump is fitted into the flow dip type soldering tank so that the jet pump is accommodated inside the main body of the nozzle through the opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP45586U JPS62113860U (en) | 1986-01-07 | 1986-01-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP45586U JPS62113860U (en) | 1986-01-07 | 1986-01-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62113860U true JPS62113860U (en) | 1987-07-20 |
Family
ID=30777443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP45586U Pending JPS62113860U (en) | 1986-01-07 | 1986-01-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62113860U (en) |
-
1986
- 1986-01-07 JP JP45586U patent/JPS62113860U/ja active Pending
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