JPS63202472U - - Google Patents
Info
- Publication number
- JPS63202472U JPS63202472U JP9243587U JP9243587U JPS63202472U JP S63202472 U JPS63202472 U JP S63202472U JP 9243587 U JP9243587 U JP 9243587U JP 9243587 U JP9243587 U JP 9243587U JP S63202472 U JPS63202472 U JP S63202472U
- Authority
- JP
- Japan
- Prior art keywords
- guide plate
- solder
- circuit board
- printed circuit
- dip device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案にかかる半田デイツプ装置の斜
面図、第２図は本考案の溶融半田の流れを示す説
明図、第３図は案内板の斜面図、第４図はプリン
ト基板の一部斜面図、第５図Ａ、第５図Ｂ、第５
図Ｃは比較例の案内板の正面図、第６図は従来例
の説明図である。
１……半田デイツプ槽、５……取付け台、６…
…案内板、７……貫通孔。
Fig. 1 is a perspective view of the solder dip device according to the present invention, Fig. 2 is an explanatory diagram showing the flow of molten solder of the present invention, Fig. 3 is a perspective view of the guide plate, and Fig. 4 is a part of a printed circuit board. Slope view, Figure 5A, Figure 5B, Figure 5
FIG. C is a front view of a guide plate of a comparative example, and FIG. 6 is an explanatory diagram of a conventional example. 1...Solder dip tank, 5...Mounting stand, 6...
...Guidance board, 7...Through hole.
Claims (1)
内板６の長手方向の一方の側縁に溶融半田を吹き
上げて他方の側縁に流し、プリント基板８を案内
板６の長手方向に対して直交する方向に略水平に
移動させつつ前記案内板６上の溶融半田の流れの
層にプリント基板８を接触させて半田付けを行な
う半田デイツプ装置に於て、案内板６にプリント
基板８の移行方向と直交する方向に略等間隔に貫
通孔７を開設した半田デイツプ装置。 案内板は水平に配備されている実用新案登録
請求の範囲第１項に記載の半田デイツプ装置。[Claim for Utility Model Registration] A guide plate 6 is provided at the upper part of the inside of the solder tank 1, and molten solder is blown up on one side edge in the longitudinal direction of the guide plate 6 and flowed to the other side edge, thereby forming a printed circuit board 8. In a solder dip device that performs soldering by bringing a printed circuit board 8 into contact with a flowing layer of molten solder on the guide plate 6 while moving the guide plate 6 substantially horizontally in a direction perpendicular to the longitudinal direction of the guide plate 6, This solder dip device has through holes 7 formed in a guide plate 6 at approximately equal intervals in a direction perpendicular to the direction in which a printed circuit board 8 moves. The solder dip device according to claim 1, wherein the guide plate is arranged horizontally.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9243587U JPS63202472U (en) | 1987-06-16 | 1987-06-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9243587U JPS63202472U (en) | 1987-06-16 | 1987-06-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63202472U true JPS63202472U (en) | 1988-12-27 |
Family
ID=30954139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9243587U Pending JPS63202472U (en) | 1987-06-16 | 1987-06-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63202472U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5332096U (en) * | 1976-08-25 | 1978-03-20 | ||
| JPS5517668B2 (en) * | 1974-09-25 | 1980-05-13 |
-
1987
- 1987-06-16 JP JP9243587U patent/JPS63202472U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5517668B2 (en) * | 1974-09-25 | 1980-05-13 | ||
| JPS5332096U (en) * | 1976-08-25 | 1978-03-20 |
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