JPS63101163U - - Google Patents

Info

Publication number
JPS63101163U
JPS63101163U JP19233486U JP19233486U JPS63101163U JP S63101163 U JPS63101163 U JP S63101163U JP 19233486 U JP19233486 U JP 19233486U JP 19233486 U JP19233486 U JP 19233486U JP S63101163 U JPS63101163 U JP S63101163U
Authority
JP
Japan
Prior art keywords
carrier
automatic soldering
claws
less automatic
opposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19233486U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19233486U priority Critical patent/JPS63101163U/ja
Publication of JPS63101163U publication Critical patent/JPS63101163U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の要部拡大平面図、第2図は第
1図―線断面図、第3図は第1図―線断
面図である。 1,2……フレーム、4……爪、5……はんだ
槽、6……爪カバー。
FIG. 1 is an enlarged plan view of the main part of the present invention, FIG. 2 is a sectional view taken along the line of FIG. 1, and FIG. 3 is a sectional view taken along the line of FIG. 1. 1, 2...Frame, 4...Claw, 5...Solder bath, 6...Claw cover.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 相対向して回動する多数の爪でプリント基板を
搬送しながらはんだ付けを行うキヤリアレス自動
はんだ付け装置において、はんだ槽の上方のフレ
ームに爪が溶触はんだと接触するのを防ぐ爪カバ
ーを設置したことを特徴とするキヤリアレス自動
はんだ付け装置。
In carrier-less automatic soldering equipment, which carries and solders printed circuit boards using multiple claws that rotate in opposition to each other, a claw cover is installed on the frame above the solder tank to prevent the claws from coming into contact with molten solder. A carrier-less automatic soldering device characterized by:
JP19233486U 1986-12-16 1986-12-16 Pending JPS63101163U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19233486U JPS63101163U (en) 1986-12-16 1986-12-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19233486U JPS63101163U (en) 1986-12-16 1986-12-16

Publications (1)

Publication Number Publication Date
JPS63101163U true JPS63101163U (en) 1988-07-01

Family

ID=31147315

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19233486U Pending JPS63101163U (en) 1986-12-16 1986-12-16

Country Status (1)

Country Link
JP (1) JPS63101163U (en)

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