JPS6282768U - - Google Patents
Info
- Publication number
- JPS6282768U JPS6282768U JP17536185U JP17536185U JPS6282768U JP S6282768 U JPS6282768 U JP S6282768U JP 17536185 U JP17536185 U JP 17536185U JP 17536185 U JP17536185 U JP 17536185U JP S6282768 U JPS6282768 U JP S6282768U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- melting point
- solder
- wiring pattern
- point temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は絶縁基板上に回路パターンが形成され
た状態の断面図、第２図は第１図に示した絶縁基
板を溶融半田槽につけた状態の断面図、第３図、
第４図は溶融半田槽から取り出した絶縁基板に部
品を取付けた状態の断面図及び斜視図である。
１……絶縁基板、２……配線パターン、４……
溶融半田、５……部品、７……低融点半田。
Fig. 1 is a cross-sectional view of a circuit pattern formed on an insulating substrate, Fig. 2 is a cross-sectional view of the insulating substrate shown in Fig. 1 placed in a molten solder tank, and Fig. 3.
FIG. 4 is a sectional view and a perspective view of a state in which components are attached to an insulating substrate taken out from a molten solder bath. 1...Insulating board, 2...Wiring pattern, 4...
Molten solder, 5... Parts, 7... Low melting point solder.
Claims (1)
着性がよく、かつこの絶縁基板上に形成される配
線パターンと、この配線パターン上にコーテイン
グされる半田と、この半田の融点温度より低い融
点温度を有し、かつ部品を配線パターンに装着す
る低融点半田とを備えたことを特徴とするプリン
ト配線板。 An insulating substrate having insulating properties, a wiring pattern that has good adhesion to the insulating substrate and is formed on the insulating substrate, a solder coated on the wiring pattern, and a melting point temperature lower than the melting point temperature of the solder. 1. A printed wiring board comprising: a low melting point solder for attaching components to a wiring pattern;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17536185U JPS6282768U (en) | 1985-11-14 | 1985-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17536185U JPS6282768U (en) | 1985-11-14 | 1985-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6282768U true JPS6282768U (en) | 1987-05-27 |
Family
ID=31114614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17536185U Pending JPS6282768U (en) | 1985-11-14 | 1985-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6282768U (en) |
-
1985
- 1985-11-14 JP JP17536185U patent/JPS6282768U/ja active Pending