JPS6284966U - - Google Patents
Info
- Publication number
- JPS6284966U JPS6284966U JP17575685U JP17575685U JPS6284966U JP S6284966 U JPS6284966 U JP S6284966U JP 17575685 U JP17575685 U JP 17575685U JP 17575685 U JP17575685 U JP 17575685U JP S6284966 U JPS6284966 U JP S6284966U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- circuit board
- printed circuit
- insulating film
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図ａは本考案による一実施例の一部を示す
平面図、第１図ｂは第１図ａのＡ―Ａで切断した
端面図である。第１図ｃは第１図ｂに電子部品を
装着した状態を示す端面図である。第２図ａは従
来のプリント基板の一例の一部を示す平面図、第
２図ｂは第２図ａのＢ―Ｂで切断した端面図、第
２図ｃは第２図ａのＣ―Ｃで切断した端面図、第
２図ｄは第２図ｂに電子部品を実装した状態を示
す端面図である。
１……プリント基板、２……パツド、３……パ
ターン、４……ソルダレジスト、５ａ……電子部
品本体、５ｂ……リード端子、６……絶縁膜。
FIG. 1a is a plan view showing a part of an embodiment of the present invention, and FIG. 1b is an end view taken along line AA in FIG. 1a. FIG. 1c is an end view showing a state in which electronic components are attached to FIG. 1b. FIG. 2a is a plan view showing a part of an example of a conventional printed circuit board, FIG. 2b is an end view taken along line BB in FIG. 2a, and FIG. 2c is an end view taken along line C-- in FIG. FIG. 2 d is an end view taken along line C, and FIG. 2 d is an end view showing a state in which electronic components are mounted in FIG. 2 b. DESCRIPTION OF SYMBOLS 1... Printed circuit board, 2... Pad, 3... Pattern, 4... Solder resist, 5a... Electronic component body, 5b... Lead terminal, 6... Insulating film.
Claims (1)
、前記電子部品のリード端子先端との段差に相応
する厚さの絶縁膜を、前記電子部品の本体を配置
する位置に設けたことを特徴とする部品支持絶縁
膜つきプリント基板。 An insulating film having a thickness corresponding to the level difference between the main body of the electronic component to be mounted on the printed circuit board and the tip of the lead terminal of the electronic component is provided at the position where the main body of the electronic component is arranged. Printed circuit board with component support insulating film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17575685U JPS6284966U (en) | 1985-11-15 | 1985-11-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17575685U JPS6284966U (en) | 1985-11-15 | 1985-11-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6284966U true JPS6284966U (en) | 1987-05-30 |
Family
ID=31115368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17575685U Pending JPS6284966U (en) | 1985-11-15 | 1985-11-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6284966U (en) |
-
1985
- 1985-11-15 JP JP17575685U patent/JPS6284966U/ja active Pending