JPH0395162U - - Google Patents
Info
- Publication number
- JPH0395162U JPH0395162U JP364090U JP364090U JPH0395162U JP H0395162 U JPH0395162 U JP H0395162U JP 364090 U JP364090 U JP 364090U JP 364090 U JP364090 U JP 364090U JP H0395162 U JPH0395162 U JP H0395162U
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- lead
- board
- length
- cuts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案のはんだ付装置の一実施例を示
す説明図、第２図は従来のはんだ付装置の説明図
、第３図はプリント基板のはんだ付前、後の断面
図、第４図は従来技術を用いた一次はんだ付、二
次はんだ付を一系統で行う場合の説明図である。
１……はんだ付装置、４，４′……はんだ槽、
６……リードカツタ、７……リード長さ判別器。
Fig. 1 is an explanatory diagram showing one embodiment of the soldering device of the present invention, Fig. 2 is an explanatory diagram of a conventional soldering device, Fig. 3 is a sectional view before and after soldering a printed circuit board, and Fig. 4 The figure is an explanatory diagram when primary soldering and secondary soldering are performed in one system using the conventional technique. 1... Soldering device, 4, 4'... Solder bath,
6...Lead cutter, 7...Lead length discriminator.
Claims (1)
れた部品をはんだ付した後余分のリードを切断し
て搬出するはんだ付装置において、前記部品のリ
ードの長さを検出して規定値より長ければ前記リ
ードカツタで必要長に切断した後再び前記はんだ
槽に送つて二次はんだ付を行わせ、規程値以内な
らば前記リードカツタを停止させて該基板を処理
済として排出するリード長さ判別器を設けたこと
を特徴とするはんだ付装置。 In a soldering device that is equipped with a soldering bath and a lead cutter and that cuts off excess leads after soldering a component assembled on a board and carries it out, the length of the lead of the component is detected and if it is longer than a specified value, the A lead length discriminator is provided that cuts the board to the required length with a lead cutter and then sends it to the solder bath again for secondary soldering, and if it is within a specified value, the lead cutter is stopped and the board is discharged as processed. A soldering device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP364090U JPH0395162U (en) | 1990-01-18 | 1990-01-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP364090U JPH0395162U (en) | 1990-01-18 | 1990-01-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0395162U true JPH0395162U (en) | 1991-09-27 |
Family
ID=31507451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP364090U Pending JPH0395162U (en) | 1990-01-18 | 1990-01-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0395162U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009511865A (en) * | 2005-10-06 | 2009-03-19 | ソシエテ ド テクノロジー ミシュラン | Method and apparatus for measuring tire inflation pressure with a stress sensor |
-
1990
- 1990-01-18 JP JP364090U patent/JPH0395162U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009511865A (en) * | 2005-10-06 | 2009-03-19 | ソシエテ ド テクノロジー ミシュラン | Method and apparatus for measuring tire inflation pressure with a stress sensor |