JPH0476075U - - Google Patents
Info
- Publication number
- JPH0476075U JPH0476075U JP11938790U JP11938790U JPH0476075U JP H0476075 U JPH0476075 U JP H0476075U JP 11938790 U JP11938790 U JP 11938790U JP 11938790 U JP11938790 U JP 11938790U JP H0476075 U JPH0476075 U JP H0476075U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- thinned
- marked
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Description
第1図は本考案の実施例の側面図で、第2図は
上面図である。
1……プリント基板、2……マーク。
FIG. 1 is a side view of an embodiment of the present invention, and FIG. 2 is a top view. 1...Printed circuit board, 2...mark.
Claims (1)
け、そこにレーザ等の熱線でプリント基板の部材
を抜き取り、マーキングを施した事を特徴とする
プリント基板。 A printed circuit board characterized in that a part of the printed circuit board is thinned, and a part of the printed circuit board is extracted and marked using a hot wire such as a laser.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11938790U JPH0476075U (en) | 1990-11-16 | 1990-11-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11938790U JPH0476075U (en) | 1990-11-16 | 1990-11-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0476075U true JPH0476075U (en) | 1992-07-02 |
Family
ID=31867347
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11938790U Pending JPH0476075U (en) | 1990-11-16 | 1990-11-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0476075U (en) |
-
1990
- 1990-11-16 JP JP11938790U patent/JPH0476075U/ja active Pending