JPH0460565U - - Google Patents
Info
- Publication number
- JPH0460565U JPH0460565U JP10140390U JP10140390U JPH0460565U JP H0460565 U JPH0460565 U JP H0460565U JP 10140390 U JP10140390 U JP 10140390U JP 10140390 U JP10140390 U JP 10140390U JP H0460565 U JPH0460565 U JP H0460565U
- Authority
- JP
- Japan
- Prior art keywords
- plating
- contact
- performs
- electrolytic
- plating device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 238000009713 electroplating Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Description
第１図は本考案の一実施例の要部構成説明図、
第２図は第１図の側断面図、第３図は第１図の要
部構成説明図、第４図は第３図の側断面図、第５
図は本考案の他の実施例の要部構成説明図、第６
図は従来より一般に使用されている従来例の工程
説明図、第７図から第９図は第６図の動作説明図
である。
１３……メツキ槽、１４……メツキ液、２１…
…支持機構、２２……給電コンタクト、２２１…
…給電コンタクト本体、２２２……底部、２２３
……縦連通孔、２２４……横連通孔、２２５……
絶縁被覆、Ａ……プリント板、Ｂ……供給空気、
Ｃ……空気層。
FIG. 1 is an explanatory diagram of the main part configuration of an embodiment of the present invention,
Figure 2 is a side sectional view of Figure 1, Figure 3 is an explanatory diagram of the main part configuration of Figure 1, Figure 4 is a side sectional view of Figure 3, and Figure 5 is a side sectional view of Figure 1.
The figure is an explanatory diagram of the main part configuration of another embodiment of the present invention, No. 6
The figure is a process explanatory diagram of a conventional example that has been generally used, and FIGS. 7 to 9 are explanatory diagrams of the operation of FIG. 6. 13... plating tank, 14... plating liquid, 21...
...Support mechanism, 22...Power supply contact, 221...
...Power contact main body, 222...Bottom, 223
... Vertical communication hole, 224 ... Horizontal communication hole, 225 ...
Insulating coating, A...printed board, B...supply air,
C...Air layer.
Claims (1)
液接触防止の為の空気層を形成する給電コンタク
ト を具備したことを特徴とするメツキ装置。[Scope of Claim for Utility Model Registration] In a plating device that is equipped with an electroless copper plating device that performs chemical plating and an electrolytic copper plating device that performs electrolytic plating, a device for preventing plating liquid from coming into contact with the exposed metal portion of a plating contact is provided. A plating device characterized by being equipped with a power supply contact that forms an air layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10140390U JPH0460565U (en) | 1990-09-27 | 1990-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10140390U JPH0460565U (en) | 1990-09-27 | 1990-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0460565U true JPH0460565U (en) | 1992-05-25 |
Family
ID=31844817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10140390U Pending JPH0460565U (en) | 1990-09-27 | 1990-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0460565U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012207293A (en) * | 2011-03-30 | 2012-10-25 | Dowa Metaltech Kk | Power feeding electrode, power feeder, plating device, plating method, plating member and method for producing the same |
-
1990
- 1990-09-27 JP JP10140390U patent/JPH0460565U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012207293A (en) * | 2011-03-30 | 2012-10-25 | Dowa Metaltech Kk | Power feeding electrode, power feeder, plating device, plating method, plating member and method for producing the same |
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