JPS61111662U - - Google Patents

Info

Publication number
JPS61111662U
JPS61111662U JP19984884U JP19984884U JPS61111662U JP S61111662 U JPS61111662 U JP S61111662U JP 19984884 U JP19984884 U JP 19984884U JP 19984884 U JP19984884 U JP 19984884U JP S61111662 U JPS61111662 U JP S61111662U
Authority
JP
Japan
Prior art keywords
nozzle
nozzle body
jet
solder
jetted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19984884U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19984884U priority Critical patent/JPS61111662U/ja
Publication of JPS61111662U publication Critical patent/JPS61111662U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案のノズル装置の一実施例を示す
断面図、第2図はその平面図、第3図はその被は
んだ付け物の一例を示す正面図、第4図はその底
面図である。 1……はんだ槽、3……ノズル本体、10……
脈動吸収口、16……ノズル噴流口部、41,4
2……被はんだ付け物としてのコンデンサケース
および取付けプレート。
Fig. 1 is a sectional view showing an embodiment of the nozzle device of the present invention, Fig. 2 is a plan view thereof, Fig. 3 is a front view showing an example of the object to be soldered, and Fig. 4 is a bottom view thereof. be. 1... Solder bath, 3... Nozzle body, 10...
Pulsation absorption port, 16... Nozzle jet port, 41, 4
2... Capacitor case and mounting plate as objects to be soldered.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 角筒状のノズル本体の下部開口に溶解はんだを
供給し、このノズル本体の上部開口からこのノズ
ル本体の上側に設けた小さなノズル噴流口部を経
て溶解はんだを噴流させ、この噴流する溶解はん
だを被はんだ付け物に付ける噴流式はんだ槽のノ
ズル装置において、上記ノズル本体と上記ノズル
噴流口部との間に脈動吸収口を設けたことを特徴
とする噴流式はんだ槽のノズル装置。
Melted solder is supplied to the lower opening of a rectangular cylindrical nozzle body, and the molten solder is jetted from the upper opening of the nozzle body through a small nozzle jet opening provided on the upper side of the nozzle body, and this jetted molten solder is A nozzle device for a jet type solder bath attached to an object to be soldered, characterized in that a pulsation absorbing port is provided between the nozzle body and the nozzle jet port.
JP19984884U 1984-12-26 1984-12-26 Pending JPS61111662U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19984884U JPS61111662U (en) 1984-12-26 1984-12-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19984884U JPS61111662U (en) 1984-12-26 1984-12-26

Publications (1)

Publication Number Publication Date
JPS61111662U true JPS61111662U (en) 1986-07-15

Family

ID=30760155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19984884U Pending JPS61111662U (en) 1984-12-26 1984-12-26

Country Status (1)

Country Link
JP (1) JPS61111662U (en)

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