JPS61111660U - - Google Patents
Info
- Publication number
- JPS61111660U JPS61111660U JP19984684U JP19984684U JPS61111660U JP S61111660 U JPS61111660 U JP S61111660U JP 19984684 U JP19984684 U JP 19984684U JP 19984684 U JP19984684 U JP 19984684U JP S61111660 U JPS61111660 U JP S61111660U
- Authority
- JP
- Japan
- Prior art keywords
- opening
- nozzle
- solder bath
- perforated plate
- jet solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案のノズル装置の一実施例を示す
断面図、第２図はその平面図、第３図はその被は
んだ付け物の一例を示す正面図、第４図はその底
面図である。
１……はんだ槽、３，１６……ノズルを構成す
るノズル本体およびノズル噴流口部、１７……多
孔板、１８，１９……小孔、２３……調整板、２
９……搬出側の開口部、４１，４２……被はんだ
付け物としてのコンデンサケースおよび取付けプ
レート。
Fig. 1 is a sectional view showing an embodiment of the nozzle device of the present invention, Fig. 2 is a plan view thereof, Fig. 3 is a front view showing an example of the object to be soldered, and Fig. 4 is a bottom view thereof. be. DESCRIPTION OF SYMBOLS 1... Solder bath, 3, 16... Nozzle main body and nozzle jet opening portion constituting the nozzle, 17... Perforated plate, 18, 19... Small hole, 23... Adjustment plate, 2
9... Opening on the delivery side, 41, 42... Capacitor case and mounting plate as objects to be soldered.
Claims (1)
んだ付け物が搬入される側に、多数の小孔を穿設
してなる多孔板を設けた噴流式はんだ槽のノズル
装置において、上記ノズルの上部開口のうち上記
多孔板が設けられていない搬出側の開口部に、こ
の開口部の開口面積を調整する調整板を水平方向
に摺動可能に取付けたことを特徴とする噴流式は
んだ槽のノズル装置。 In a nozzle device for a jet solder bath, the upper opening of the nozzle is provided with a perforated plate having a large number of small holes on the side of the upper opening of the nozzle into which the soldering object is carried. A nozzle device for a jet solder bath, characterized in that an adjustment plate for adjusting the opening area of the opening is horizontally slidably attached to the opening on the delivery side where the perforated plate is not provided. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19984684U JPS61111660U (en) | 1984-12-26 | 1984-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19984684U JPS61111660U (en) | 1984-12-26 | 1984-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61111660U true JPS61111660U (en) | 1986-07-15 |
Family
ID=30760151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19984684U Pending JPS61111660U (en) | 1984-12-26 | 1984-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61111660U (en) |
-
1984
- 1984-12-26 JP JP19984684U patent/JPS61111660U/ja active Pending