JPS61111661U - - Google Patents
Info
- Publication number
- JPS61111661U JPS61111661U JP19984784U JP19984784U JPS61111661U JP S61111661 U JPS61111661 U JP S61111661U JP 19984784 U JP19984784 U JP 19984784U JP 19984784 U JP19984784 U JP 19984784U JP S61111661 U JPS61111661 U JP S61111661U
- Authority
- JP
- Japan
- Prior art keywords
- nozzle body
- solder
- nozzle
- jet
- supplied
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案のノズル装置の一実施例を示す
断面図、第２図はその平面図、第３図はその被は
んだ付け物の一例を示す正面図、第４図はその底
面図である。
１……はんだ槽、３……ノズヌ本体、５，７…
…均流器、１３……穴、１６……ノズル噴流口部
、４１，４２……被はんだ付け物としてのコンデ
ンサケースおよび取付けプレート。
Fig. 1 is a sectional view showing an embodiment of the nozzle device of the present invention, Fig. 2 is a plan view thereof, Fig. 3 is a front view showing an example of the object to be soldered, and Fig. 4 is a bottom view thereof. be. 1...Solder bath, 3...Nozunu body, 5, 7...
...Flow equalizer, 13... Hole, 16... Nozzle jet opening, 41, 42... Capacitor case and mounting plate as objects to be soldered.
Claims (1)
供給し、このノズル本体の上部開口からこのノズ
ル本体の上側に設けた複数のノズル噴流口部を経
て溶解はんだを噴流させ、この噴流する溶解はん
だを被はんだ付け物に付ける噴流式はんだ槽のノ
ズル装置において、上記ノズル本体の上部開口か
らノズル本体の内部に、全体にわたつて無数の穴
が形成された角箱状の均流器を配置し、この均流
器によりノズル本体内に供給されたはんだ流をノ
ズル本体の全体にわたつて均等化することを特徴
とする噴流式はんだ槽のノズル装置。 Melted solder is supplied to the lower opening of a rectangular cylindrical nozzle body, and the molten solder is jetted from the upper opening of the nozzle body through a plurality of nozzle jet openings provided on the upper side of the nozzle body. In a jet type soldering bath nozzle device for attaching solder to an object to be soldered, a square box-shaped flow equalizer having numerous holes formed throughout the nozzle body is arranged from the upper opening of the nozzle body to the inside of the nozzle body. A nozzle device for a jet solder bath, characterized in that the flow equalizer equalizes the solder flow supplied into the nozzle body over the entire nozzle body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19984784U JPS61111661U (en) | 1984-12-26 | 1984-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19984784U JPS61111661U (en) | 1984-12-26 | 1984-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61111661U true JPS61111661U (en) | 1986-07-15 |
Family
ID=30760153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19984784U Pending JPS61111661U (en) | 1984-12-26 | 1984-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61111661U (en) |
-
1984
- 1984-12-26 JP JP19984784U patent/JPS61111661U/ja active Pending
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