JPH0447862U - - Google Patents
Info
- Publication number
- JPH0447862U JPH0447862U JP8778890U JP8778890U JPH0447862U JP H0447862 U JPH0447862 U JP H0447862U JP 8778890 U JP8778890 U JP 8778890U JP 8778890 U JP8778890 U JP 8778890U JP H0447862 U JPH0447862 U JP H0447862U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- jet
- solder jet
- plate
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 27
- 238000005476 soldering Methods 0.000 claims description 8
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Description
第１図Ａは本考案の半田噴流板の一例を示す平
面図、第１図Ｂはその拡大部分断面図、第２図は
第１図に示す半田噴流板を用いた場合の半田噴流
の流れを示すための説明図、第３図Ａは自動半田
付け装置における半田槽の部分を示す概略構成図
、第３図Ｂは半田の不乗り部分を示すための説明
図である。
符号の説明、１……半田槽、２……一次側槽、
４……回路基板（被半田付け部材）、４ａ……回
路基板の裏面（半田付け面）、１１……半田噴流
板、１２……半田噴流孔、１４……半田案内用溝
、２１……半田槽本体、２２……半田、２３……
半田噴流板。
Figure 1A is a plan view showing an example of the solder jet plate of the present invention, Figure 1B is an enlarged partial sectional view thereof, and Figure 2 is the flow of solder jet when the solder jet plate shown in Figure 1 is used. FIG. 3A is a schematic configuration diagram showing a portion of a solder tank in an automatic soldering apparatus, and FIG. 3B is an explanatory diagram showing a portion where solder is not applied. Explanation of symbols, 1...Solder tank, 2...Primary side tank,
4... Circuit board (member to be soldered), 4a... Back side of circuit board (soldering surface), 11... Solder jet plate, 12... Solder jet hole, 14... Solder guide groove, 21... Solder tank body, 22...Solder, 23...
Solder jet plate.
Claims (1)
の半田付け面が下向きの状態で、ほぼ水平方向に
搬送する搬送手段と、この搬送手段によつて搬送
されている前記被半田付け部材の半田付け面に対
して、下側から半田噴流を供給する半田供給手段
とを有し、この半田供給手段は、前記搬送手段に
よる前記被半田付け部材の搬送路の下方に配置し
た、多数の半田噴流孔が形成された半田噴流板と
、この半田噴流板に形成された多数の半田噴流孔
を介してその下側から上側に向いて半田を供給す
ることにより、半田噴流を形成する噴流形成手段
とを備えており、前記半田噴流板の表面には、半
田噴流孔からこの半田噴流板の上側面に吹き出し
た半出噴流を、前記搬送手段による前記被半田付
け部材の搬送方向に対して傾斜した方向に案内す
る案内部が形成されていることを特徴とする自動
半田付け装置。 (2) 請求項第１項に記載の自動半田付け装置の
半田噴流板。[Scope of Claim for Utility Model Registration] (1) A conveyance means for conveying the soldered components to be soldered in a substantially horizontal direction with the soldering surface facing downward, and conveyance by the conveyance means. and a solder supply means for supplying a jet of solder from below to the soldering surface of the soldering target member, which is connected to the conveying path of the soldering target member by the conveying means. By supplying solder from the bottom to the top through a solder jet plate with a large number of solder jet holes arranged below the solder jet plate and a large number of solder jet holes formed in this solder jet plate. , a jet forming means for forming a solder jet, and the surface of the solder jet plate is provided with a half jet jet blown out from the solder jet holes onto the upper surface of the solder jet plate, and the solder jet is transferred to the solder by the conveying means. An automatic soldering device characterized in that a guide portion is formed to guide the attachment member in a direction inclined with respect to the conveyance direction. (2) A solder jet plate of an automatic soldering device according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8778890U JPH0447862U (en) | 1990-08-21 | 1990-08-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8778890U JPH0447862U (en) | 1990-08-21 | 1990-08-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0447862U true JPH0447862U (en) | 1992-04-23 |
Family
ID=31820459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8778890U Pending JPH0447862U (en) | 1990-08-21 | 1990-08-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0447862U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010122816A1 (en) * | 2009-04-24 | 2010-10-28 | 株式会社メドレックス | Medication liquid supporting jig and method of applying medication to micro-needle using same |
| WO2012143966A1 (en) * | 2011-04-18 | 2012-10-26 | 三菱電機株式会社 | Solder jet nozzle and soldering device |
-
1990
- 1990-08-21 JP JP8778890U patent/JPH0447862U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010122816A1 (en) * | 2009-04-24 | 2010-10-28 | 株式会社メドレックス | Medication liquid supporting jig and method of applying medication to micro-needle using same |
| US9067048B2 (en) | 2009-04-24 | 2015-06-30 | Medrx Co., Ltd. | Medication liquid supporting jig and method of applying medication to micro-needle using same |
| WO2012143966A1 (en) * | 2011-04-18 | 2012-10-26 | 三菱電機株式会社 | Solder jet nozzle and soldering device |
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