JPH0287559U - - Google Patents
Info
- Publication number
- JPH0287559U JPH0287559U JP16512388U JP16512388U JPH0287559U JP H0287559 U JPH0287559 U JP H0287559U JP 16512388 U JP16512388 U JP 16512388U JP 16512388 U JP16512388 U JP 16512388U JP H0287559 U JPH0287559 U JP H0287559U
- Authority
- JP
- Japan
- Prior art keywords
- waveformer
- jet
- molten
- solder
- molten solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案噴流はんだ槽の斜視図、第２図
は同中央断面図、第３図はノズル上での溶融はん
だの流れを説明する図である。
１……ノズル、２，３……ノズル板、４……側
板、５，６……ウエーブフオーマー、７……流動
制御板、８……固定杆。
FIG. 1 is a perspective view of the jet solder bath of the present invention, FIG. 2 is a sectional view of the same, and FIG. 3 is a diagram illustrating the flow of molten solder on the nozzle. 1... Nozzle, 2, 3... Nozzle plate, 4... Side plate, 5, 6... Wave former, 7... Flow control plate, 8... Fixed rod.
Claims (1)
ーマーに沿つて流動させる噴流はんだ槽において
、ウエーブフオーマー上でしかも流動する溶融は
んだの液面下にプリント基板の進行方向に対して
平行となるように多数の流動制御板を立設したこ
とを特徴とする噴流はんだ槽。 In a jet solder bath in which molten solder jetted from a nozzle flows along a waveformer, a large number of molten solders are placed on the waveformer and below the surface of the flowing molten solder parallel to the direction in which the printed circuit board travels. A jet soldering bath characterized by having a flow control plate installed upright.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16512388U JPH0287559U (en) | 1988-12-22 | 1988-12-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16512388U JPH0287559U (en) | 1988-12-22 | 1988-12-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0287559U true JPH0287559U (en) | 1990-07-11 |
Family
ID=31451323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16512388U Pending JPH0287559U (en) | 1988-12-22 | 1988-12-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0287559U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010184251A (en) * | 2009-02-10 | 2010-08-26 | Oki Electric Ind Co Ltd | Apparatus for forming planar jet wave of soldering |
| JP2011155058A (en) * | 2010-01-26 | 2011-08-11 | Mitsubishi Electric Corp | Solder jet device |
| WO2012143966A1 (en) * | 2011-04-18 | 2012-10-26 | 三菱電機株式会社 | Solder jet nozzle and soldering device |
-
1988
- 1988-12-22 JP JP16512388U patent/JPH0287559U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010184251A (en) * | 2009-02-10 | 2010-08-26 | Oki Electric Ind Co Ltd | Apparatus for forming planar jet wave of soldering |
| JP2011155058A (en) * | 2010-01-26 | 2011-08-11 | Mitsubishi Electric Corp | Solder jet device |
| WO2012143966A1 (en) * | 2011-04-18 | 2012-10-26 | 三菱電機株式会社 | Solder jet nozzle and soldering device |