JP2011155058A - Solder jet device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solder jet device reducing adhesion of an oxide film on a surface of a jet nozzle to a soldering part of an electronic component even if mounting density of the electronic component on a mounting substrate is high. <P>SOLUTION: The solder jet device includes a substrate 11 on which the electronic component 10 having a lead part 10a is placed and which electrically connects the lead part 10a while it relatively moves; a solder tank having an external wall 4 storing flowing thermofusion solder 1; the cylindrical jet nozzle 3 in which a tip 3b is projectively stored on a substrate 11-side of the solder tank and whose inner part is hollow; a plurality of elongated grooves 3a which are disposed on an outer surface of the jet nozzle 3, start from the tip 3b and end midway, and are brought close to each other; a flow rate adjusting means 7 which blows up the thermofusion solder 1 to the lead part 10a from the tip 3b by press-feeding it inside the jet nozzle 3; and a gap which includes oxide 1a generated by oxidation reaction of the thermofusion solder 1 and is arranged between the jet nozzle 3 flowing back the thermofusion solder 1 which is blown up to the solder tank and the external wall of the solder tank. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

The present invention relates to a solder jet device used for local soldering of a printed wiring board.

In a board on which electronic components are mounted at high density, it is necessary to remove the oxide film generated in a film shape on the solder surface from the molten solder surface of the nozzle opening in order to secure a good soldering site. For example, in FIG. 1 of Japanese Patent Laid-Open No. 6-326454 (see Patent Document 1), a relief with the upper end notched in the side wall portion 21a of the jet nozzle 21 is prevented so that the oxide film in the jet nozzle does not adhere to the soldered portion. A local soldering device having a structure in which a mouth 23 is formed and the molten solder 5 blown up from the hole at the bottom of the jet nozzle 21 overflows from the escape port 23 is disclosed.

1 (see Patent Document 2), the shape of the jet nozzle 3 is conical, the volume in the jet nozzle 3 is reduced, the jet velocity is increased, and the upper end of the jet nozzle 3 is shown. There is disclosed a soldering apparatus in which a notch 4 is provided in 3e, and solder is always circulated from the solder bath by flowing the solder from the notch 4 part.

JP-A-6-326454 (FIG. 1, paragraph [0008]) Japanese Unexamined Patent Publication No. 2003-311397 (FIG. 1, paragraph [0005])

However, in the local soldering apparatus 1 described in Patent Document 1, since the jet nozzle 21 having a square opening with a relatively wide tip is used, when applied to a high-density mounting substrate that performs soldering in a narrow region. There is a problem that the surface state of the molten solder 5 becomes non-uniform when moving, and soldering failure due to a solder bridge occurs between electronic components.

Moreover, since the thing of patent document 2 is providing the notch part 4 in the upper end part 3e of the jet nozzle 3, although it is trying to flow a solder from the part of the notch part 4, the upper end part 3e The solder surface becomes uneven in the vicinity of the side wall portion 3, and there is a problem that it is difficult to apply as a local soldering apparatus.

In addition, it is necessary to overflow the melted solder from the jet nozzle, so that the oxide film generated in the form of a film on the hot-melted solder surface is not generated on the nozzle surface, but when used as a jet nozzle of a movable local soldering device If it overflows, the molten solder comes into contact with surrounding surface-mounted components, which causes a soldering failure such as a solder bridge.

The present invention has been made to solve the above-described problems, and even if the mounting density of electronic components on the mounting board is high, the oxide film on the surface of the jet nozzle is prevented from adhering to the soldered portion of the electronic component. An object of the present invention is to provide a solder jet device capable of improving the quality, reliability and workability during soldering.

A solder jet apparatus according to claim 1 is a solder tub having an electronic component having a lead portion and a board for electrically connecting the lead portion while relatively moving, and an outer wall for storing flowing hot-melt solder. The tip of the solder bath is projected and housed on the substrate side, and the inside is a hollow cylindrical jet nozzle, and the jet nozzle is provided on the outer surface of the jet nozzle and close to each other starting from the tip and ending in the middle And a plurality of elongated grooves provided in the jet nozzle, flow rate adjusting means for pumping the hot melt solder from the tip portion to the lead portion by feeding into the jet nozzle, and an oxidation reaction of the hot melt solder. And a gap provided between the jet nozzle for returning the sprayed hot melt solder to the solder tank and the outer wall of the solder tank.

The solder jet apparatus according to a second aspect is the solder jet apparatus according to the first aspect, wherein the plurality of grooves provided farthest from each other are arranged at a narrow angle with respect to the tip end center of the jet nozzle.

A solder jet apparatus according to claim 3 is a solder bath having an electronic component having a lead portion and a board for electrically connecting the lead portion while relatively moving, and an outer wall for storing flowing hot-melt solder The tip of the solder bath is projected and housed on the substrate side, the inside is a conical jet nozzle having a hollow inside, and the nozzle nozzle is provided on the outer surface of the jet nozzle and close to each other starting from the tip and ending in the middle And a plurality of elongated grooves provided in the jet nozzle, flow rate adjusting means for pumping the hot melt solder from the tip portion to the lead portion by feeding into the jet nozzle, and an oxidation reaction of the hot melt solder. And a gap provided between the jet nozzle for returning the sprayed hot melt solder to the solder tank and the outer wall of the solder tank.

The solder jet device according to claim 4 is the solder jet device according to claim 3, wherein the plurality of grooves provided farthest from each other are arranged at a narrow angle with respect to the center of the tip of the jet nozzle.

According to the present invention, even when the mounting density of the electronic components on the mounting board is high, the oxide film on the surface of the jet nozzle does not adhere to the soldering site of the electronic components. It is possible to obtain a solder jet device capable of dramatically improving the performance.

It is a cross-sectional schematic diagram of the solder jet apparatus by Embodiment 1 of this invention. It is explanatory drawing of the jet nozzle of the solder jet apparatus by Embodiment 1 of this invention, Fig.2 (a) is an external view of a jet nozzle, FIG.2 (b) is a top view of a jet nozzle. It is a figure explaining the removal procedure of the hot melt solder oxide film of the solder jet apparatus by Embodiment 1 of this invention. It is a figure explaining the relationship between the internal dimension and groove depth of the cylindrical jet nozzle of the solder jet apparatus by Embodiment 1 of this invention. It is a figure explaining the relationship between the internal dimension and groove depth of the cylindrical jet nozzle of the solder jet apparatus by Embodiment 1 of this invention. It is a cross-sectional schematic diagram of the solder jet apparatus by Embodiment 2 of this invention. It is explanatory drawing of the jet nozzle of the solder jet apparatus by Embodiment 2 of this invention, Fig.7 (a) is an external view of a jet nozzle, FIG.7 (b) is a top view of a jet nozzle.

Embodiment 1 FIG.
Embodiment 1 of the present invention will be described below with reference to the drawings. 1 is an external view of a solder (solder) jet apparatus according to Embodiment 1 of the present invention. 1 is a liquid hot-melt solder obtained by melting a rod-like solder (solder) by heat, 2 is a cylindrical upper tank (solder tank) containing a flowing hot-melt solder 1 and 3 is an upper tank 2 is a cylindrical (cylindrical) jet nozzle having a hollow inside, and 3 a is an elongated groove provided at the tip of the jet nozzle 3. 3b shows the cavity area | region of the front-end | tip of the jet nozzle 3, and is called an upper surface opening part (front-end | tip part).

4 is installed in the vicinity of the jet nozzle 3 and constitutes the upper tank 2 and the outer wall of the upper tank 2 for fixing the jet nozzle 3 as appropriate. 5 is provided in a part of the hollow area of the bottom surface of the upper tank 2. 3 is a jet hole through which the hot melt solder 1 is sent and the hot melt solder 1 is jetted from the upper surface opening 3b at the tip of the jet nozzle 3, and the hot melt solder 1 that is flowing is pumped through the jet hole 5. A lower tank (solder tank) 7 for sending the hot melt solder 1 to the upper tank 2, 7 is installed in the lower tank 6, and a flow rate adjusting means 8 for adjusting the flow rate of the hot melt solder 1 in the lower tank 6 with a rotating propeller; Heating means 9 for maintaining the hot-melt solder 1 in the lower tank 6 in the heat-melted state, and 9 a flow rate adjusting means 7 for adjusting the flow rate of the hot-melted solder 1 and a heating means 8 for maintaining the heat-melted state of the hot-melt solder 1 Flow rate management and temperature tube A control unit for (control box).

Reference numeral 10 denotes an electronic component made up of a lead insertion type component, a surface mount component, and the like. Reference numeral 10a denotes each lead terminal (lead portion) of the electronic component 10, and the lead terminal 10a protruding from the package and the electronic component 10 are solidified. Electrical connection is made with molten solder 1. Reference numeral 11 denotes a substrate on which an electronic component 10 is placed and is constituted by a printed wiring board or the like that is relatively movable in the transport direction over the base material surface by a transport means (not shown). Here, d1 represents the inner diameter (inner dimension) of the jet nozzle 3, and d2 represents the outer diameter (outer dimension) of the jet nozzle 3.

2A and 2B are explanatory views of the jet nozzle of the solder jet apparatus according to Embodiment 1 of the present invention. FIG. 2A is an external view of the jet nozzle, and FIG. 2B is a plan view of the jet nozzle. 2A, L1 indicates the length (dimension) of the groove 3a provided in the jet nozzle 3. FIG. In FIG. 2B, W1 is the width of the groove 3a of the jet nozzle 3, D1 is the depth of the groove 3a of the jet nozzle 3, and θ is an angle with respect to the tip inner diameter center of the jet nozzle 3 between the two arranged grooves 3a. is there. In the figure, the same reference numerals as those in FIG. 1 denote the same or corresponding parts.

Next, the operation will be described with reference to FIGS. Inside the upper tank 2, a cylindrical jet nozzle 3 having an open front end (upper surface) is provided. The jet nozzle 3 slightly protrudes upward from the upper tank 2. On the outer surface of the jet nozzle 3, a groove 3a is linearly cut into the surface of the jet nozzle 3 from the edge of the upper surface opening 3b to the lower part. This groove 3a causes the flow rate of the hot melt solder 1 to partially flow when the hot melt solder 1 springs up from the cavity region of the jet nozzle 3 and overflows and then flows into the upper tank 2 along the outer surface of the jet nozzle 3. Take the role of changing. That is, the heat-melted solder 1 generated on the surface of the heat-melting solder 1 is not required by making the heat-melting state of the heat-melting solder 1 in the soldering region of the lead portion 10a placed on the surface of the substrate 11 uneven. Allow foreign material to flow down. In this way, an oxidation reaction occurs on the outermost surface of the flowing hot-melt solder 1, and the surface oxide film of the hot-melt solder 1 generated by this reaction is removed.

Next, a procedure for removing the oxide film will be described. FIGS. 3A to 3D are views for explaining the process of removing the hot-melt solder oxide film of the solder jet device according to Embodiment 1 of the present invention. In the figure, the same reference numerals as those in FIG. 1 denote the same or corresponding parts. Reference numeral 1a denotes an oxide film of the hot melt solder 1 generated on the outermost layer surface of the hot melt solder 1, and usually the oxide film is a sol-gel in which fine particles are partially condensed or dispersed on the outermost layer of the hot melt solder 1 In the inner layer, only the hot-melt solder 1 is flowing at a relatively high temperature. Therefore, the outermost layer maintains a kind of equilibrium state although the inner layer is flowing.

First, as shown in FIG. 3 (a), at the start of the soldering operation, the hot melt solder 1 springs upwardly through the inside of the cylindrical jet nozzle 3. At that time, a part or all of the outermost layer of the hot-melt solder 1 is covered with a thin oxide film 1a generated during the soldering operation or with time.

As shown in FIG. 3B, when the hot melt solder 1 reaches the opening 3 b of the jet nozzle 3 and springs up, the overflow hot melt solder 1 returns to the upper tank 2 along the surface of the jet nozzle 3. At that time, the overflowing hot melt solder 1 passes through a region where the groove 3a is present, so that a partial change occurs in the flow velocity flowing on the surface of the jet nozzle 3 and an uneven flow occurs.

As shown in FIG. 3C, the oxide film 1 a generated on the surface of the hot melt solder 1 flows down due to the uneven flow of the hot melt solder 1 generated on the surface of the jet nozzle 3.

From the above, as shown in FIG. 3D, fresh hot-melt solder 1 suitable for the soldering quality is generated in the upper surface opening 3b of the jet nozzle 3, and the soldering operation can be started or continued.

Next, the structure of the groove 3a that serves to partially change the flow rate of the hot melt solder 1 will be described. It is preferable that the depth (D1) of the groove 3a is a groove 3a that is cut from the outer surface of the jet nozzle 3 by about 0.5 mm to 3 mm. The depth (D1) of the groove 3a varies depending on the opening diameter (d1) of the jet nozzle 3, and also varies depending on the alloy composition of the molten solder material forming the hot-melt solder 1.

FIG. 4 is a diagram for explaining the relationship between the inner dimension of the cylindrical jet nozzle of the solder jet device according to Embodiment 1 of the present invention and the groove depth. In FIG. 4, the relationship between the inner diameter (d1) of the jet nozzle 3 and the depth (D1) of the groove 3a of the jet nozzle 3 is displayed separately for each type (composition) of the solder material. Since lead-free Sn-Ag and Sn-Cu systems are generally more viscous than eutectic solder, for example, focusing on the lower limit value of the optimum groove depth (D1) of the jet nozzle 3, FIG. As shown in FIG. 5, it is understood that the groove depth (D1) may be shallower as the solder material has a lower viscosity, and the groove depth (D1) needs to be deeper as the inner diameter (d1) of the jet nozzle 3 increases. . The outer diameter (d2) −the inner diameter (d1) of the jet nozzle 3 is constant.

As a condition for determining an appropriate value of the groove depth (D1), it is necessary to cut two grooves 3a on the surface of the jet nozzle 3. In addition, it is preferable that the grooves 3a are arranged so as to maintain a narrow angle (θ) with respect to the top opening 3b. If the number of the grooves 3a is one, a point is set, and the oxide film 1a does not flow down stably. Even when the number of the grooves 3a is two, the oxide film 1a does not flow down stably when they are separated by a wide angle of 40 degrees or more. The length (L1) of the groove 3a does not directly affect the alloy composition of the hot melt solder 1 and the opening diameter (inner diameter) of the jet nozzle 3, and there is no problem as long as the length is 10 mm to 40 mm. If it is 10 mm or less, the oxide film 1a does not flow down stably.

Further, the width (W1) of the groove 3a does not directly affect the alloy composition of the hot melt solder 1 or the opening diameter (d1) of the jet nozzle 3, and may be about 1 mm to 2 mm. If the area is less than 1 mm, the oxide film 1a region is relatively small and does not flow down. If the area is 2 mm or more, the surface condition of the hot-melt solder 1 flowing on the surface of the jet nozzle 3 is rough, and good soldering is achieved. Work may be difficult. That is, it is preferable to make the width (W1) in consideration of the particle diameter and region of the oxide film 1a.

From the above, by arranging a plurality of narrow grooves 3a close to each other, the oxide film 1a is removed by attracting the oxide film 1a in a relatively far position to the groove 3a side to release the equilibrium state. The removed oxide film 1a passes through the gap between the outside of the jet nozzle 3 and the outer wall 4 of the upper tank 2 and then flows back. The thin oxide film 1a is in a dispersed state. 1 can be considered.

In the first embodiment, the number of the grooves 3a is two. However, if the two grooves 3a at the outermost positions are in a narrow-angle relationship, a narrow groove 3a is additionally provided on the inner side. However, the same effect can be obtained if the width is about 1 mm to 2 mm.

According to the solder jet apparatus according to the first embodiment of the present invention, the two grooves 3a are provided at the narrow angle on the outer surface of the cylindrical jet nozzle 3, so that the oxide film 1a on the surface of the jet nozzle 3 is an electronic component. Since it does not adhere to the 10 soldering sites (lead portions) 10a, the quality, reliability and workability during soldering can be improved.

Embodiment 2. FIG.
The second embodiment of the present invention will be described below with reference to the drawings. FIG. 6 is an external view of a solder (solder) jet apparatus according to Embodiment 1 of the present invention. 1 is a liquid hot-melt solder obtained by melting a rod-shaped solder (solder) by heat, 2 is a cylindrical upper tank (solder tank) containing a flowing hot-melt solder 1, and 30 is an upper tank 2 is a jet nozzle in which the upper part of the cavity is conical (conical) and the lower part is cylindrical, and 30a is an elongated groove provided at the upper end of the jet nozzle 30. Reference numeral 30b denotes a hollow area at the tip of the jet nozzle 30 and is referred to as an upper surface opening (tip).

4 is installed in the vicinity of the jet nozzle 30 and constitutes the upper tank 2 and the outer wall of the upper tank 2 for fixing the jet nozzle 30 appropriately. 5 is provided in a part of the hollow area of the bottom surface of the upper tank 2. 30 is an injection hole through which hot-melt solder 1 is fed into the nozzle 30 to eject the hot-melt solder 1 from the upper surface opening 30b at the tip of the jet nozzle 30; A lower tank (solder tank) 7 for sending the hot melt solder 1 to the upper tank 2, 7 is installed in the lower tank 6, and a flow rate adjusting means 8 for adjusting the flow rate of the hot melt solder 1 in the lower tank 6 with a rotating propeller; Heating means 9 for maintaining the hot-melt solder 1 in the lower tank 6 in the heat-melted state, and 9 a flow rate adjusting means 7 for adjusting the flow rate of the hot-melted solder 1 and a heating means 8 for maintaining the heat-melted state of the hot-melt solder 1 Flow velocity pipe Control unit for performing and temperature control is a (control box).

Reference numeral 10 denotes an electronic component made up of a lead insertion type component, a surface mount component, and the like. Reference numeral 10a denotes each lead terminal (lead portion) of the electronic component 10, and the lead terminal 10a protruding from the package and the electronic component 10 are solidified. Electrical connection is made with molten solder 1. Reference numeral 11 denotes a substrate on which an electronic component 10 is placed and is constituted by a printed wiring board or the like that is relatively movable in the transport direction over the base material surface by a transport means (not shown). D1 indicates the inner diameter (inner dimension) of the jet nozzle 30, and d2 indicates the outer diameter (outer dimension) of the upper surface opening 30b in which the upper part of the jet nozzle 30 is a conical portion. In the figure, the same reference numerals as those in FIG. 1 denote the same or corresponding parts.

7 is an explanatory view of a jet nozzle of a solder jet device according to Embodiment 2 of the present invention, FIG. 7 (a) is an external view of the jet nozzle, and FIG. 7 (b) is a plan view of the jet nozzle. In FIG. 7A, L1 indicates the length (dimension) of the groove 30a provided in the jet nozzle 30. In FIG. 7 (b), W1 is the width of the groove 30a of the jet nozzle 30, D1 is the depth of the groove 30a of the jet nozzle 30, and θ is an angle with respect to the tip inner diameter center of the jet nozzle 30 between the two arranged grooves 30a. is there. In the figure, the same reference numerals as those in FIG. 1 or 6 denote the same or corresponding parts.

Next, the operation will be described with reference to FIGS. A cylindrical jet nozzle 30 having an open front end (upper surface) is provided inside the upper tank 2, and the jet nozzle 30 slightly protrudes upward from the upper tank 2. On the outer surface of the jet nozzle 30, a groove 30a is linearly cut into the surface of the jet nozzle 30 from the edge of the upper surface opening 30b to the lower part. This groove 30a causes the flow rate of the hot melt solder 1 to partially flow when the hot melt solder 1 swells from the cavity region of the jet nozzle 30 and overflows, and then flows into the upper tank 2 along the outer surface of the jet nozzle 30. Take the role of changing. That is, the heat-melted solder 1 generated on the surface of the heat-melting solder 1 is not required by making the heat-melting state of the heat-melting solder 1 in the soldering region of the lead portion 10a placed on the surface of the substrate 11 uneven. Allow foreign material to flow down. In this way, an oxidation reaction occurs on the outermost surface of the flowing hot-melt solder 1, and the surface oxide film of the hot-melt solder 1 generated by this reaction is removed.

The configuration of the second embodiment of the present invention is the same as that of the solder jet apparatus described in the first embodiment except for the conical nozzle 30 that is opened in a conical shape. Further, the removal procedure of the hot melt solder oxide film of the solder jet device and the relationship between the inner dimension of the cylindrical jet nozzle 30 and the groove depth are the same as those of the solder jet device described in the first embodiment, and thus the description thereof is omitted. .

Next, the structure of the groove 30a that serves to partially change the flow rate of the hot melt solder 1 will be described. It is preferable that the depth (D1) of the groove 30a is a groove 30a that is cut from the outer surface of the jet nozzle 30 by about 0.5 mm to 3 mm. The depth (D1) of the groove 30a varies depending on the opening diameter (d1) of the jet nozzle 30, and also varies depending on the alloy composition of the molten solder material forming the hot-melt solder 1.

As a condition for determining an appropriate value of the groove depth (D1), it is necessary to cut two grooves 30a on the surface of the jet nozzle 30. Further, it is preferable that the respective grooves 30a are arranged with a narrow angle (θ) maintained around the opening 30b. When the number of the grooves 30a is one, the oxide film 1a does not flow stably. Even if the number of the grooves 30a is two, the oxide film 1a does not flow down stably when they are separated by a wide angle of 40 degrees or more. The length (L1) of the groove 30a does not directly affect the alloy composition of the hot melt solder 1 and the opening diameter (inner diameter) of the jet nozzle 30, and there is no problem as long as the length is 10 mm to 40 mm. If it is 10 mm or less, the oxide film 1a does not flow down stably.

Further, the width (W1) of the groove 30a does not directly affect the alloy composition of the hot melt solder 1 or the opening diameter (d1) of the jet nozzle 30 and may be about 1 mm to 2 mm. If the area is less than 1 mm, the oxide film 1a region is relatively small and does not flow down. If the area is 2 mm or more, the surface condition of the hot-melt solder 1 flowing on the surface of the jet nozzle 3 is rough, and good soldering is achieved. Work may be difficult. That is, it is preferable to make the width (W1) in consideration of the particle diameter and region of the oxide film 1a.

From the above, by arranging a plurality of narrow grooves 30a close to each other, the oxide film 1a is removed by attracting the oxide film 1a in a relatively far position to the groove 30a side to release the equilibrium state. The removed oxide film 1a passes through the gap between the outside of the jet nozzle 30 and the outer wall 4 of the upper tank 2 and then flows back. The thin oxide film 1a is in a dispersed state. 1 can be considered.

According to the solder jet apparatus according to the second embodiment of the present invention, since the two grooves 3a are provided at a narrow angle on the outer surface of the conical jet nozzle 30, the oxide film 1a on the surface of the jet nozzle 30 is formed. Since it does not adhere to the soldering part (lead part) 10a of the electronic component 10, it is possible to improve the quality, reliability and workability during soldering.

In the second embodiment, the jet nozzle 30 is a jet nozzle that combines a conical nozzle at the top and a nozzle on the cylinder at the bottom. However, the flow velocity adjusting means 7 having a large driving torque and the heating means 8 having a large heat capacity are used. By using it, the same effect can be obtained even if the entire jet nozzle 30 is conical.

In the first and second embodiments, the solder tank is divided into the upper tank 2 and the lower tank 6, but the solder tanks 2 and 6 may be integrated, and the jet nozzles 3 and 30 are added to the integrated structure. You may do it.

1 ・ ・ Hot-melting solder 1a ・ ・ Oxide film 2 ・ ・ Upper tank (solder tank)
3. Jet nozzle 3a Groove 3b Upper surface opening (tip)
4. Outer wall 5. Ejection hole 6. Lower tank (solder tank) 7. Flow rate adjusting means 8. Heating means 9. Control unit 10. Electronic parts 10a ... Lead part 11. Substrate (printed) Wiring board)
30 .. Jet nozzle 30a .. Groove 30b .. Upper surface opening (tip)

Claims (4)

An electronic component having a lead portion is placed, and the lead portion is electrically connected while moving relatively, a solder bath having an outer wall for storing flowing hot-melt solder, and the solder bath on the side of the substrate A cylindrical jet nozzle having a tip protruding and housed therein and a hollow inside, and a plurality of elongated grooves provided on the outer surface of the jet nozzle and provided close to each other starting from the tip and ending in the middle And a flow rate adjusting means for pumping the hot melt solder from the tip portion to the lead portion by being pumped into the jet nozzle, and the heat spouted including an oxide generated by an oxidation reaction of the hot melt solder A solder jet apparatus comprising: a jet nozzle for refluxing molten solder to the solder tank; and a gap provided between an outer wall of the solder tank. 2. The solder jet device according to claim 1, wherein the plurality of grooves provided furthest from each other are arranged at a narrow angle with respect to a center of the tip of the jet nozzle. An electronic component having a lead portion is placed, and the lead portion is electrically connected while moving relatively, a solder bath having an outer wall for storing flowing hot-melt solder, and the solder bath on the side of the substrate A conical jet nozzle having a tip protruding and housed inside, and a plurality of elongated grooves provided on the outer surface of the jet nozzle and provided close to each other starting from the tip and ending in the middle And a flow rate adjusting means for pumping the hot melt solder from the tip portion to the lead portion by being pumped into the jet nozzle, and the heat spouted including an oxide generated by an oxidation reaction of the hot melt solder A solder jet apparatus comprising: a jet nozzle for refluxing molten solder to the solder tank; and a gap provided between an outer wall of the solder tank. The solder jet apparatus according to claim 3, wherein the plurality of grooves provided furthest from each other are arranged at a narrow angle with respect to the center of the tip of the jet nozzle.

Images