WO2012143966A1

WO2012143966A1 - Solder jet nozzle and soldering device

Info

Publication number: WO2012143966A1
Application number: PCT/JP2011/002257
Authority: WO
Inventors: 秀樹時本; 匡司松田
Original assignee: 三菱電機株式会社
Priority date: 2011-04-18
Filing date: 2011-04-18
Publication date: 2012-10-26

Abstract

A solder jet nozzle (10) suppresses jet turbulence by being provided with a groove structure of at least one type of groove from among: a groove (21) provided uniformly to the entire margin of a jet aperture (11); a vertical groove (22) on the outer surface (13) having a shape running along the direction that the solder jetting from the jet aperture (11) flows due to the dead weight of the solder; and a transverse groove (23) on the outer surface (13) having a shape running along the direction roughly perpendicular to the vertical groove (22).

Description

Solder jet nozzle and soldering device

The present invention relates to a solder jet nozzle that jets molten solder, and a soldering apparatus that jets molten solder from the solder jet nozzle and solders electronic components to a printed circuit board.

The conventional solder jet nozzle has a problem that when a lead component such as a connector and a switch is locally soldered to a printed circuit board, an overflow flow from the solder jet nozzle contacts a lead wire of an adjacent component. Thus, for example, in the jet nozzle structure according to Patent Document 1, the molten solder blows up inside the cylindrical body of the jet nozzle to the opening edge, and is discharged to the side wall of the cylindrical body that is appropriately lowered from the opening edge. By opening the mouth, the released solder was prevented from contacting the lead wires of adjacent components.

Japanese Patent Laid-Open No. 2003-290913

Since the conventional solder jet nozzle is configured as described above, an oxide film is formed on the surface of the molten solder blown to the opening edge of the cylindrical body, and foreign matters such as dross, oxide and carbide are accumulated. In other words, there was a problem of inhibiting soldering.

In addition, when an overflow flow is caused to flow while being in contact with the outer surface of the solder jet nozzle, particularly in a configuration in which the overflow flow is caused to flow over the entire outer surface of the nozzle, the overflowed solder is caused by partial oxidation and carbonization of the nozzle outer surface. It becomes difficult to fit in the part, corrodes and blackens, and the jet flows in an uncontrollable direction, which becomes an obstacle to soldering.

The present invention has been made to solve the above-described problems, and minimizes the influence of disturbance caused by at least one of solder oxidation, carbonization, and jet fluctuation on the outer surface of the solder jet nozzle. The purpose is to suppress jet turbulence and improve the quality of soldering.

The solder jet nozzle of the present invention jets the molten solder supplied from the molten solder flow path from the jet opening through the internal flow path, and is applied to one or both of the entire periphery of the jet opening and the outer surface. A groove is provided.

The soldering apparatus of the present invention comprises a molten solder tank for storing molten solder, a molten solder flow path formed in the molten solder tank, and the above-described solder jet nozzle.

According to the present invention, the groove structure provided in the solder jet nozzle can minimize the influence of disturbance caused by at least one of solder oxidation, carbonization, and jet fluctuation on the outer surface. Disturbance is suppressed and the quality of soldering can be improved.

It is a perspective view which shows the structure of the soldering apparatus which concerns on Embodiment 1 of this invention. It is a figure explaining the soldering method by the soldering apparatus which concerns on Embodiment 1. FIG. 3 is a perspective view showing an example of a solder jet nozzle used in the soldering apparatus according to Embodiment 1. FIG. It is a perspective view which shows another example of the solder jet nozzle used for the soldering apparatus which concerns on Embodiment 1. FIG. It is a perspective view which shows another example of the solder jet nozzle used for the soldering apparatus which concerns on Embodiment 1. FIG. It is a perspective view which shows another example of the solder jet nozzle used for the soldering apparatus which concerns on Embodiment 1. FIG. 3 is a perspective view showing an example of a pyramid-shaped solder jet nozzle used in the soldering apparatus according to Embodiment 1. FIG. 3 is a perspective view showing an example of a cylindrical solder jet nozzle used in the soldering apparatus according to Embodiment 1. FIG.

Hereinafter, in order to explain the present invention in more detail, modes for carrying out the present invention will be described with reference to the accompanying drawings.
Embodiment 1 FIG.
A soldering apparatus 1 shown in FIG. 1 includes a molten solder tank 3 that stores molten solder 2, a molten solder flow path component 4 that has a molten solder flow path 5 in which molten solder 2 circulates, and a molten solder flow path. A solder jet nozzle 10 attached to the component 4 and jetting the molten solder 2. The solder jet nozzle 10 has a substantially conical shape, a jet port 11 is opened at the apex, and an internal flow path 12 communicating with the molten solder flow path 5 is formed inside. FIG. 1 shows an example in which a plurality of grooves 21 are formed uniformly over the entire periphery of the jet port 11. Details of the groove structure will be described later.

FIG. 2 is a view for explaining a soldering method by the soldering apparatus 1 and shows a cross section of the solder jet nozzle 10 and the molten solder flow path component 4. An attachment base 14 is provided on the bottom surface side of the cone of the solder jet nozzle 10, and the attachment base 14 is attached to the end of the molten solder flow path component 4 to communicate the internal flow path 12 and the molten solder flow path 5. . The attachment method may be any method such as screw fastening.
The molten solder 2 is sent to the molten solder flow path component 4 at a predetermined jet pressure by a jet generation drive device (for example, a pump) (not shown) provided in the molten solder tank 3 and supplied to the solder jet nozzle 10. The supplied molten solder 2 flows through the internal flow path 12 and jets from the jet port 11, and the overflowed solder flows down the outer surface 13 by its own weight and returns to the molten solder tank 3 again. Hereinafter, the molten solder 2 that has jetted from the jet port 11 and overflowed is referred to as jet solder.

A lead component 103 in which

lead wires

104 and 105 are inserted into the through

holes

101 and 102 of the printed circuit board 100 is disposed at a position facing the jet port 11, and the through

holes

101 and 102 are formed by jet solder jetted from the jet port 11. The

lead wires

104 and 105 are soldered.

In the first embodiment, in order to control the flow of the jet solder jetted from the jet port 11, a groove is provided in one or both of the entire periphery of the jet port 11 of the solder jet nozzle 10 and the outer surface 13. Hereinafter, a configuration example of the groove will be described.

On the outer surface 13 of the solder jet nozzle 10 shown in FIG. 3A, a plurality of vertical grooves 22 that run along the direction in which the solder jetted from the jet port 11 flows by its own weight are evenly provided in the circumferential direction. In addition, a plurality of lateral grooves 23 are provided that run in a direction substantially orthogonal to the direction of flow due to the dead weight. In addition to this, similarly to FIGS. 1 and 2, a plurality of grooves 21 are equally provided on the entire periphery of the jet port 11.
FIG.3 (b) is sectional drawing which cut | disconnected the solder jet nozzle 10 along the AA line shown to Fig.3 (a), and shows a mode that a jet solder flows with an arrow. By providing the groove 21 in the jet port 11, the jet solder is likely to be accumulated in the groove 21, so that it is difficult to oxidize and carbonize at this position. Moreover, since solder becomes easy to adjust when the jet solder accumulates in the groove 21, the overflow flow can flow in the entire circumferential direction without flowing only in a specific direction from the jet port 11, and the jet solder can flow at the edge of the jet port 11. It does not spread greatly when played. Therefore, the jet solder does not oxidize and carbonize by entraining the outside air, and the jet solder does not come into contact with the adjacent parts when the lead part 103 is soldered.
As shown in FIGS. 1 and 2, the same effect can be obtained even in the case where only the groove 21 is provided in the solder jet nozzle 10.

By providing the vertical groove 22 on the outer surface 13, the vertical groove 22 becomes a path through which the jet solder overflowed. Since this solder jet nozzle 10 has a conical shape, its outer surface area increases as it goes downward. However, a vertical groove 22 is provided partway from the jet port 11 so that the outer surface area is adjusted to be the same between the upper and lower nozzles. Therefore, the thickness in the vertical direction of the overflow flow layer flowing on the outer surface 13 can be kept constant to some extent. Therefore, the overflow flow is not interrupted at a part of the outer surface 13, and oxidation and carbonization of the outer surface 13 at the interrupted portion can be suppressed. Therefore, corrosion and blackening of the outer surface 13 can also be prevented.
In addition, since the flow passage cross section of the vertical groove 22 is small, the flow velocity of the solder flowing therethrough increases, so that the solder flowing from the jet port 11 and flowing through the outer surface 13 is stable while being pulled by the solder flowing through the vertical groove 22. Then it starts to flow down.

By providing the lateral groove 23 on the outer surface 13, jet solder is likely to be accumulated in the lateral groove 23, so that it is difficult to oxidize and carbonize at this position. Further, when the jet solder accumulates in the lateral groove 23, the overflowed solder solder becomes easy to be adapted, and the solder accumulated in the lateral groove 23 is transferred and flows down. As a result, the overflow flow is not interrupted at a part of the outer surface 13, and oxidation and carbonization of the outer surface 13, and consequently corrosion and blackening can be suppressed.

In the example of FIG. 3, the solder jet nozzle 10 is provided with three types of grooves, that is, the groove 21, the longitudinal groove 22, and the lateral groove 23. Alternatively, a plurality of types of grooves may be provided in combination.
FIG. 4A shows a configuration example in which the groove 21 of the jet port 11 and the vertical groove 22 of the outer surface 13 are provided, and FIG. 4B shows a cross-sectional view and how the jet solder flows. Also in the solder jet nozzle 10 having the configuration shown in FIG. 4, the same effects as those of the groove 21 and the vertical groove 22 described above can be obtained.
FIG. 5A shows a configuration example in which the lateral grooves 23 of the outer surface 13 are provided, and FIG. 5B shows a cross-sectional view and a state in which the jet solder flows. Also in the solder jet nozzle 10 having the configuration shown in FIG. 5, the same effect as that of the lateral groove 23 described above can be obtained.

3 to 5, the outer surface 13 of the solder jet nozzle 10 is provided with one or both of the longitudinal grooves 22 and the lateral grooves 23, but the present invention is not limited to this, and the spiral grooves are not limited thereto. May be provided.
The solder jet nozzle 10 shown in FIG. 6 is provided with a spiral groove 24 having a shape that runs spirally on the outer surface 13. By providing the spiral groove 24 on the outer surface 13, when the amount of jet solder overflowing from the jet port 11 is small, the outer surface 13 flows down spirally along the spiral groove 24. When the amount of the jet solder that overflows is large, the jet solder that flows down the outer surface 13 flows down while being pulled by the jet solder that flows through the spiral groove 24. Therefore, the overflow flow is not interrupted at a part of the outer surface 13, and oxidation and carbonization of the outer surface 13 can be suppressed.
Although not shown, the groove 21 of the jet port 11 may be combined with the spiral groove 24 of the outer surface 13.

1 to 6, the solder jet nozzle 10 has a conical shape. However, the present invention is not limited to this, and may be a pyramid shape such as a triangular pyramid or a quadrangular pyramid. Further, the solder jet nozzle 10 may be a column such as a cylinder or a prism instead of a cone.
FIG. 7 shows a configuration example when the solder jet nozzle 10 has a quadrangular pyramid shape. This solder jet nozzle 10 has a quadrangular pyramid shape with an internal flow path 12, a jet port 11 is provided at the apex, a groove 21 is formed, an attachment base 14 is formed on the bottom surface, and each of the four surfaces of the outer surface 13. A vertical groove 22 and a horizontal groove 23 are formed in the upper part.
FIG. 8 shows a configuration example when the solder jet nozzle 10 is formed in a cylindrical shape. The solder jet nozzle 10 has a cylindrical shape (cylindrical shape) in which an internal flow path 12 is formed. The solder jet nozzle 10 is provided with a jet port 11 at one end to form a groove 21, an attachment base 14 at the other end, and an outer surface 13. A vertical groove 22 and a horizontal groove 23 are formed in the upper part.
Although illustration is omitted, in the case of any shape of a cone and a column, at least one of the four types of grooves of the groove 21, the vertical groove 22, the horizontal groove 23, and the spiral groove 24 may be provided. Alternatively, a plurality of types of grooves may be provided in combination. Even in the case of a cone and a column, the same effect as described above can be obtained by providing a groove.

1 to 8, the outer surface 13 of the solder jet nozzle 10 may be solder-plated. As a result, the overflowing solder flows easily into the outer surface 13, and the overflow flow is difficult to be interrupted at a part of the outer surface 13, thereby suppressing oxidation and carbonization.
Further, the grooves (vertical grooves 22, lateral grooves 23, and spiral grooves 24) formed on the outer surface 13 may be formed on a part of the outer surface 13 or on the entire surface.

As described above, according to the first embodiment, the solder jet nozzle 10 used in the soldering apparatus 1 is configured so as to provide a groove in one or both of the entire peripheral edge of the jet port 11 and the outer surface 13. With this groove structure, it is possible to minimize the influence of disturbance caused by oxidation or carbonization of the outer surface 13 or fluctuation of jet solder, and to suppress jet turbulence. As a result, it is possible to improve the soldering quality. In addition, since the occurrence of oxidation and carbonization of the outer surface 13, and thus corrosion and blackening can be suppressed, the frequency of maintenance of the solder jet nozzle can be reduced, and workability can be improved.

The soldering apparatus 1 may be configured to include at least one of the molten solder bath 3, the molten solder flow path component 4, and the solder jet nozzle 10, and is used for point dip by using one solder jet nozzle 10. The soldering apparatus 1 may be configured, or a plurality of solder jet nozzles 10 may be used to configure the multi-dip soldering apparatus 1.

In addition to the above description, the present invention can be modified in any component in the embodiment or omitted in any component within the scope of the invention.

As described above, the solder jet nozzle according to the present invention suppresses jet turbulence from the jet port and improves the quality of soldering. Therefore, the solder jet nozzle is used for a local soldering apparatus for point dip and multi-dip use. Suitable for

DESCRIPTION OF SYMBOLS 1 Soldering apparatus, 2 Molten solder, 3 Molten solder tank, 4 Molten solder flow path component, 5 Molten solder flow path, 10 Solder jet nozzle, 11 Jet port, 12 Internal flow path, 13 Outer surface, 14 Mounting base, 21 Groove, 22 longitudinal groove, 23 transverse groove, 24 spiral groove, 100 printed circuit board, 101, 102 through hole, 103 lead component, 104, 105 lead wire.

Claims

A solder jet nozzle that communicates with a molten solder flow path formed in a molten solder tank and jets the molten solder supplied from the molten solder flow path from a jet port through an internal flow path,
A solder jet nozzle characterized in that a groove is provided in the entire periphery of the jet port.
2. A solder jet nozzle according to claim 1, wherein a groove is also provided on the outer surface.
The groove on the outer surface is provided on a part or all of the outer surface, and has either a shape along the direction in which the molten solder jetted from the jet port flows by its own weight or a shape along a direction substantially perpendicular to the direction in which the molten solder flows. 3. The solder jet nozzle according to claim 2, wherein the solder jet nozzle is one or both of them.
3. The solder jet nozzle according to claim 2, wherein the groove on the outer surface is provided in a part or all of the outer surface and has a spiral shape.
2. The solder jet nozzle according to claim 1, wherein the solder jet nozzle has a cone shape, and a jet port is formed at an apex portion. 3.
The solder jet nozzle according to claim 1, wherein the solder jet nozzle has a columnar shape, and a jet port is formed at one end.
A solder jet nozzle that communicates with a molten solder flow path formed in a molten solder tank and jets the molten solder supplied from the molten solder flow path from a jet port through an internal flow path,
A solder jet nozzle, characterized in that a groove is provided on the outer surface.
The solder jet nozzle according to claim 7, wherein a groove is also provided in the entire periphery of the jet port.
A molten solder tank for storing molten solder;
A molten solder flow path formed in the molten solder bath;
There is a jet port that communicates with the molten solder flow path and jets the molten solder supplied from the molten solder flow path through an internal flow path, and either or both of the entire periphery and the outer surface of the jet port A soldering apparatus comprising a solder jet nozzle provided with a groove.