WO2012143967A1 - Solder jet nozzle, soldering device, and soldering method - Google Patents

Solder jet nozzle, soldering device, and soldering method Download PDF

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Publication number
WO2012143967A1
WO2012143967A1 PCT/JP2011/002258 JP2011002258W WO2012143967A1 WO 2012143967 A1 WO2012143967 A1 WO 2012143967A1 JP 2011002258 W JP2011002258 W JP 2011002258W WO 2012143967 A1 WO2012143967 A1 WO 2012143967A1
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WO
WIPO (PCT)
Prior art keywords
jet
molten solder
solder
port
reflux
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PCT/JP2011/002258
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French (fr)
Japanese (ja)
Inventor
秀樹 時本
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三菱電機株式会社
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Priority to PCT/JP2011/002258 priority Critical patent/WO2012143967A1/en
Publication of WO2012143967A1 publication Critical patent/WO2012143967A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Definitions

  • the present invention relates to a solder jet nozzle for jetting molten solder, and a soldering apparatus and a soldering method for soldering an electronic component to a printed circuit board using the solder jet nozzle.
  • the conventional solder jet nozzle raises the molten solder inside the nozzle to contact the soldered portion of the printed circuit board and also melts the solder outside the nozzle. (For example, refer to Patent Document 1).
  • the conventional solder jet nozzle has a configuration in which the molten solder is raised and flows in the nozzle, and therefore, when the molten solder is lowered below the nozzle after soldering, there is a problem that oxides and carbides of solder adhere to the inner wall of the nozzle. . Then, during the next soldering, the oxide and the carbide are jetted together with the molten solder and come into contact with the adjacent lead component or the soldering unnecessary portion, which causes a soldering failure such as a bridge.
  • the flux previously applied to the lead component or the printed circuit board is combined with the molten solder jetted from the nozzle port.
  • soldering is impeded, such as solder wettability being reduced, and soldering cannot be performed, or the soldered surface is not coated with the flux and is oxidized and carbonized.
  • the overflowed solder is difficult to fit due to oxidation and carbonization of the outer surface of the nozzle, it may be biased in the direction in which the molten solder jets, resulting in poor soldering.
  • the present invention has been made to solve the above-described problems, and an object thereof is to improve the quality of soldering by performing a stable jet and leaving the flux of the printed circuit board.
  • the solder jet nozzle according to the present invention includes a jet flow path that communicates with a molten solder supply path formed in a molten solder bath and that receives a supply of molten solder, opens at an end of the jet flow path, and goes inward toward the open end.
  • a jet port for jetting the molten solder flowing through the jet channel, a return port for opening the molten solder jetted from the jet port, and a jet channel And a reflux path that communicates with the reflux port and returns the molten solder flowing in from the reflux port to the molten solder tank.
  • the soldering apparatus of the present invention includes a molten solder tank for storing molten solder, a molten solder supply path formed in the molten solder tank, and the above-described solder jet nozzle.
  • soldering method of the present invention using the above-described solder jet nozzle, molten solder is jetted inward along the shape of the jet port, brought into contact with an object, soldered, and returned to the reflux port. Inflow.
  • a stable jet path can be secured by allowing the molten solder jetted from the jet port to flow into the inner reflux port, so that generation of oxides and carbides on the surface of the solder jet nozzle can be suppressed.
  • the molten solder jetted from the jet port flows into the reflux port while attracting the flux applied to the printed circuit board, so that the flux remains on the printed circuit board and can maintain wettability, and the soldered solder
  • the surface can be coated with a flux to prevent oxidation and carbonization. Therefore, the quality of soldering can be improved.
  • FIG. 3 is a perspective view showing an example of a solder jet nozzle used in the soldering apparatus according to Embodiment 1.
  • FIG. It is a perspective view which shows another example of the solder jet nozzle used for the soldering apparatus which concerns on Embodiment 1.
  • FIG. 3 is a perspective view showing an example of a solder jet nozzle used in the soldering apparatus according to Embodiment 1.
  • FIG. It is a perspective view which shows another example of the solder jet nozzle used for the soldering apparatus which concerns on Embodiment 1.
  • FIG. 1 A soldering apparatus 1 shown in FIG. 1 includes a molten solder tank 3 that stores molten solder 2 and a solder jet nozzle 10 that jets the molten solder 2.
  • a molten solder supply path (not shown) is formed in the molten solder tank 3, and the molten solder 2 is sent out to the molten solder supply path with a predetermined jet pressure by a jet generation drive device (for example, a pump) (not shown).
  • the soldering apparatus 1 may be configured to include a lid that covers the exposed surface of the molten solder 2 excluding, for example, the solder jet nozzle 10 of the molten solder bath 3.
  • FIG. 2 is a view for explaining a soldering method by the soldering apparatus 1, and shows a cross section of the solder jet nozzle 10 cut along the line AA shown in FIG.
  • the solder jet nozzle 10 is configured such that a second rectangular cylinder 12 smaller than the first rectangular cylinder 11 is disposed inside the first rectangular cylinder 11.
  • the jet channel 13 is formed by a gap surrounded by the first rectangular cylinder 11 and the second rectangular cylinder 12, and one end of the gap communicates with a molten solder supply path (not shown), from the molten solder supply path. Supply of molten solder 2 is received. The other end of the gap is opened to become a jet port 14, and the molten solder 2 flowing through the jet channel 13 is jetted from the jet port 14.
  • the reflux path 15 is configured by the second rectangular cylinder 12, and one end thereof communicates with the molten solder tank 3. The other end opens to the inside of the first rectangular cylinder 11 to become the reflux port 16, and the jet solder jetted from the jet port 14 flows into the reflux port 16.
  • the jet solder flowing into the reflux port 16 flows down the reflux path 15 by its own weight and returns to the molten solder tank 3.
  • the inner wall of the first rectangular cylinder 11 on the jet port 14 side is a tapered surface 17, and the jet channel 13 is tapered toward the jet port 14.
  • the flowing direction of the jet solder jetted from the jet port 14 is directed inward, so that it does not scatter outward or flow out to the outer surface of the nozzle, and easily flows into the reflux port 16.
  • the jet solder can easily flow into the reflux port 16. Thereby, the stable jet path of jet solder can be secured.
  • a lead component 103 having lead wires 104 and 105 inserted in the through holes 101 and 102 of the printed circuit board 100 is disposed at a position facing the jet port 14, and the through holes 101 and 102 are formed by jet solder jetted from the jet port 14.
  • the lead wires 104 and 105 are soldered. Since the jet solder flows along the path indicated by the black arrow in FIG. 2, it does not contact the adjacent lead parts, and defects such as bridges do not occur. Further, since the oxides and carbides of the solder hardly adhere to the inner walls of the jet passage 13 and the reflux passage 15, the deposits do not jet together with the molten solder 2 and adhere to the printed circuit board 100.
  • a flux layer 106 is formed by applying flux to the surface of the printed circuit board 100 before soldering.
  • the jet solder flowing from the jet port 14 to the reflux port 16 flows into the reflux port 16 while drawing the flux around the lead component 103 (indicated by a white arrow in FIG. 2).
  • the flux layer 106 tends to remain, the solder wettability of the printed circuit board 100 is maintained, and the soldering quality is improved.
  • the soldered solder surface is covered with the remaining flux, and oxidation and carbonization are suppressed.
  • the solder jet nozzle 10 shown in FIG. 3 is formed by installing two partition plates 18 inside the first rectangular cylinder 11.
  • the jet channel 13 is composed of two gaps surrounded by the first rectangular cylinder 11 and the two partition plates 18, and a jet port 14 is opened at one end of each of the two gaps.
  • the reflux path 15 is constituted by a gap between two partition plates 18, and a reflux port 16 is opened at one end of the gap.
  • the other end of the gap is provided with a jet guide surface 19 having a shape inclined so as to become lower from the center toward both ends.
  • the outlet 20 is formed in the region sandwiched between the two partition plates 18 on both end portions of the jet guide surface 19 which are inclined and lowered, that is, on the pair of opposing wall surfaces of the first rectangular cylinder 11. Open. Further, similarly to the solder jet nozzle 10 of FIG. 1, the tapered surface 17 is formed on the first rectangular cylinder 11, and the reflux port 16 is formed at a position lower than the jet port 14.
  • the jet solder that flows through the jet flow path 13 and jets from the jet port 14 flows into the inner reflux port 16 while drawing the flux applied to the printed circuit board, and flows down the reflux path 15. . And it guides to the discharge port 20 along the jet guide surface 19 of a bottom part, flows out of the discharge port 20, and recirculate
  • a spiral spiral guide path 21 is formed on the inner wall of the second rectangular cylinder 12 (or two partition plates 18) from the reflux port 16.
  • the jet solder that has flowed into the reflux path 15 may be configured to flow down spirally. In the case of this configuration, the time during which the jet solder stays in the reflux path 15 becomes long, and the temperature drop of the solder jet nozzle 10 can be suppressed. As a result, it is difficult for the molten solder 2 to have temperature unevenness inside the solder jet nozzle 10, and good soldering is possible.
  • the solder jet nozzle 10 used in the soldering apparatus 1 includes the jet channel 13 that communicates with the molten solder supply channel and receives the supply of the molten solder 2, and the end of the jet channel 13. And a jet port 14 that jets the molten solder 2 that has flowed through the jet channel 13 and opens at a lower position inside the jet port 14.
  • the jet solder is caused to flow from the jet port 14 to the inner reflux port 16 and a stable jet flow path can be secured, solder oxides and carbides do not adhere to the nozzle inner wall and outer wall, and the solder Generation
  • production of improper attachment can be suppressed.
  • the jet solder flows into the reflux port 16 while attracting the flux, the flux of the printed circuit board 100 is likely to remain, the wettability can be maintained, and the soldered solder surface is coated to be oxidized and carbonized. Can be suppressed. Therefore, the quality of soldering can be improved.
  • the reflux path 15 is configured to have the spiral guide path 21 that flows the jet solder flowing in from the reflux port 16 in a spiral manner, so that the temperature drop of the solder jet nozzle 10 is suppressed. be able to.
  • the solder jet nozzle 10 is formed in a rectangular parallelepiped shape.
  • the cylindrical solder jet nozzle 10 is formed by concentrically combining two cylinders having different diameters. May be.
  • the soldering apparatus 1 may be configured to include at least one of the molten solder bath 3, the molten solder supply path, and the solder jet nozzle 10, and the solder for point dip using the single solder jet nozzle 10 is used.
  • the soldering apparatus 1 may be configured, or the soldering apparatus 1 for multi-dip may be configured using a plurality of solder jet nozzles 10.
  • solder jet nozzle As described above, the solder jet nozzle according to the present invention enables soldering quality to be improved by jetting solder to the inside of the jet port, so that it is used for a local soldering apparatus for point dip and multi-dip use. Suitable for

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A solder jet nozzle (10) forms a jet path (13) and a jet aperture (14) on the nozzle outside and forms a recirculation path (15) and recirculation aperture (16) on the nozzle inside, jets molten solder from the jet aperture (14), and flows the solder to the recirculation aperture (16) on the inside while drawing in the flux layer (106) of a printed circuit board (100).

Description

はんだ噴流ノズル、はんだ付け装置およびはんだ付け方法Solder jet nozzle, soldering apparatus and soldering method
　この発明は、溶融はんだを噴出するはんだ噴流ノズル、ならびに当該はんだ噴流ノズルを用いてプリント基板に電子部品をはんだ付けするはんだ付け装置およびはんだ付け方法に関する。 The present invention relates to a solder jet nozzle for jetting molten solder, and a soldering apparatus and a soldering method for soldering an electronic component to a printed circuit board using the solder jet nozzle.
　従来のはんだ噴流ノズルは、プリント基板にコネクタおよびスイッチ等の複数のリード部品をはんだ付けするに際し、溶融はんだをノズル内で上昇させてプリント基板のはんだ付け部分に接触させると共に、ノズル外へ溶融はんだを噴流させていた（例えば、特許文献１参照）。 When soldering multiple lead parts such as connectors and switches to the printed circuit board, the conventional solder jet nozzle raises the molten solder inside the nozzle to contact the soldered portion of the printed circuit board and also melts the solder outside the nozzle. (For example, refer to Patent Document 1).
特開２００２－３６８４０４号公報JP 2002-368404 A
　従来のはんだ噴流ノズルは溶融はんだをノズル内で上昇させて流動させる構成のため、はんだ付け後に溶融はんだをノズルの下方に下げるとノズル内壁にはんだの酸化物および炭化物が付着するという課題があった。すると、次のはんだ付け時に酸化物および炭化物が溶融はんだと共に噴流して隣接するリード部品またははんだ付け不要部分に接触してしまい、ブリッジ等のはんだ付け不良が生じる等、はんだ付けが阻害される。 The conventional solder jet nozzle has a configuration in which the molten solder is raised and flows in the nozzle, and therefore, when the molten solder is lowered below the nozzle after soldering, there is a problem that oxides and carbides of solder adhere to the inner wall of the nozzle. . Then, during the next soldering, the oxide and the carbide are jetted together with the molten solder and come into contact with the adjacent lead component or the soldering unnecessary portion, which causes a soldering failure such as a bridge.
　また、従来のようにはんだ噴流ノズルのノズル口から外側へ溶融はんだを噴流してノズル外表面にオーバーフローさせる場合、リード部品またはプリント基板に予め塗布されたフラックスが、ノズル口から噴流した溶融はんだと共に洗い流されてしまうという課題があった。フラックスが洗い流されると、はんだ濡れ性が低下してはんだ付けができなくなったり、はんだ付けした表面がフラックスで被覆されずに酸化および炭化したりする等、はんだ付けが阻害される。さらに、ノズル外表面が酸化および炭化する等してオーバーフローしたはんだがなじみにくい箇所ができると、溶融はんだの噴流する方向に偏りができ、はんだ付け不良が生じてしまう場合もあった。 Also, when the molten solder is jetted from the nozzle port of the solder jet nozzle to the outside and overflowed to the outer surface of the nozzle as in the prior art, the flux previously applied to the lead component or the printed circuit board is combined with the molten solder jetted from the nozzle port. There was a problem of being washed away. When the flux is washed away, soldering is impeded, such as solder wettability being reduced, and soldering cannot be performed, or the soldered surface is not coated with the flux and is oxidized and carbonized. Furthermore, if the overflowed solder is difficult to fit due to oxidation and carbonization of the outer surface of the nozzle, it may be biased in the direction in which the molten solder jets, resulting in poor soldering.
　この発明は、上記のような課題を解決するためになされたもので、安定した噴流を行うと共にプリント基板のフラックスを残留させることにより、はんだ付けの品質向上を図ることを目的とする。 The present invention has been made to solve the above-described problems, and an object thereof is to improve the quality of soldering by performing a stable jet and leaving the flux of the printed circuit board.
　この発明のはんだ噴流ノズルは、溶融はんだ槽に形成された溶融はんだ供給路に連通して溶融はんだの供給を受ける噴流路と、噴流路の端部に開口し、当該開口端部に向かうにつれ内側にすぼまる形状であって、噴流路を流通した溶融はんだを噴流する噴流口と、噴流口の内側かつ低い位置に開口し、噴流口から噴流した溶融はんだを流入させる還流口と、噴流路の内側に形成されて還流口に連通し、還流口から流入する溶融はんだを溶融はんだ槽へ還流する還流路とを備えるものである。 The solder jet nozzle according to the present invention includes a jet flow path that communicates with a molten solder supply path formed in a molten solder bath and that receives a supply of molten solder, opens at an end of the jet flow path, and goes inward toward the open end. A jet port for jetting the molten solder flowing through the jet channel, a return port for opening the molten solder jetted from the jet port, and a jet channel And a reflux path that communicates with the reflux port and returns the molten solder flowing in from the reflux port to the molten solder tank.
　また、この発明のはんだ付け装置は、溶融はんだを貯留する溶融はんだ槽と、溶融はんだ槽に形成された溶融はんだ供給路と、上述のはんだ噴流ノズルとを備えるものである。 The soldering apparatus of the present invention includes a molten solder tank for storing molten solder, a molten solder supply path formed in the molten solder tank, and the above-described solder jet nozzle.
　さらに、この発明のはんだ付け方法は、上述のはんだ噴流ノズルを用いて、溶融はんだを噴流口の形状に沿わせて内側へ向けて噴流し、対象物に接触させてはんだ付けし、還流口へ流入させるものである。 Furthermore, in the soldering method of the present invention, using the above-described solder jet nozzle, molten solder is jetted inward along the shape of the jet port, brought into contact with an object, soldered, and returned to the reflux port. Inflow.
　この発明によれば、噴流口から噴流した溶融はんだを内側の還流口へ流入させるようにして安定した噴流経路を確保できるので、はんだ噴流ノズル表面における酸化物および炭化物の発生を抑制することができる。また、噴流口から噴流した溶融はんだが、プリント基板に塗布されたフラックスを引き寄せながら還流口へ流入するので、プリント基板にフラックスを残留させて濡れ性を保つことができ、かつ、はんだ付けしたはんだ表面をフラックスが被覆して酸化および炭化を抑制することができる。従って、はんだ付けの品質を向上させることができる。 According to the present invention, a stable jet path can be secured by allowing the molten solder jetted from the jet port to flow into the inner reflux port, so that generation of oxides and carbides on the surface of the solder jet nozzle can be suppressed. . Also, the molten solder jetted from the jet port flows into the reflux port while attracting the flux applied to the printed circuit board, so that the flux remains on the printed circuit board and can maintain wettability, and the soldered solder The surface can be coated with a flux to prevent oxidation and carbonization. Therefore, the quality of soldering can be improved.
この発明の実施の形態１に係るはんだ付け装置の構成を示す斜視図である。It is a perspective view which shows the structure of the soldering apparatus which concerns on Embodiment 1 of this invention. 実施の形態１に係るはんだ付け装置によるはんだ付け方法を説明する図である。It is a figure explaining the soldering method by the soldering apparatus which concerns on Embodiment 1. FIG. 実施の形態１に係るはんだ付け装置に用いるはんだ噴流ノズルの一例を示す斜視図である。3 is a perspective view showing an example of a solder jet nozzle used in the soldering apparatus according to Embodiment 1. FIG. 実施の形態１に係るはんだ付け装置に用いるはんだ噴流ノズルの別の例を示す斜視図である。It is a perspective view which shows another example of the solder jet nozzle used for the soldering apparatus which concerns on Embodiment 1. FIG.
　以下、この発明をより詳細に説明するために、この発明を実施するための形態について、添付の図面に従って説明する。
実施の形態１．
　図１に示すはんだ付け装置１は、溶融はんだ２を貯留する溶融はんだ槽３と、この溶融はんだ２を噴流するはんだ噴流ノズル１０とを備える。この溶融はんだ槽３には不図示の溶融はんだ供給路が形成され、不図示の噴流発生駆動装置（例えば、ポンプ）により所定の噴流圧力で溶融はんだ２が溶融はんだ供給路へ送り出される。
　なお、はんだ付け装置１は、例えば溶融はんだ槽３のはんだ噴流ノズル１０を除く溶融はんだ２の露出面を覆う蓋体を備える構成にしてもよい。 Hereinafter, in order to explain the present invention in more detail, modes for carrying out the present invention will be described with reference to the accompanying drawings.
Embodiment 1 FIG.
A soldering apparatus 1 shown in FIG. 1 includes a molten solder tank 3 that stores molten solder 2 and a solder jet nozzle 10 that jets the molten solder 2. A molten solder supply path (not shown) is formed in the molten solder tank 3, and the molten solder 2 is sent out to the molten solder supply path with a predetermined jet pressure by a jet generation drive device (for example, a pump) (not shown).
The soldering apparatus 1 may be configured to include a lid that covers the exposed surface of the molten solder 2 excluding, for example, the solder jet nozzle 10 of the molten solder bath 3.
　図２は、はんだ付け装置１によるはんだ付け方法を説明する図であり、図１に示すＡＡ線に沿って切断したはんだ噴流ノズル１０の断面を示す。このはんだ噴流ノズル１０は、第１の方形筒体１１の内側に、第１の方形筒体１１より小さい第２の方形筒体１２が配置されて成る。噴流路１３は、第１の方形筒体１１と第２の方形筒体１２に囲まれた隙間で構成され、隙間の一端が不図示の溶融はんだ供給路に連通して、溶融はんだ供給路から溶融はんだ２の供給を受ける。隙間の他端は開口して噴流口１４となり、噴流路１３を流通した溶融はんだ２を噴流口１４から噴流する。これ以降、噴流口１４から噴流した溶融はんだ２を噴流はんだと称する。
　還流路１５は、第２の方形筒体１２で構成され、その一端が溶融はんだ槽３に連通する。他端は第１の方形筒体１１の内側に開口して還流口１６となり、噴流口１４から噴流した噴流はんだを還流口１６へ流入させる。還流口１６に流入した噴流はんだは自重により還流路１５を流れ落ち、溶融はんだ槽３へ還流する。 FIG. 2 is a view for explaining a soldering method by the soldering apparatus 1, and shows a cross section of the solder jet nozzle 10 cut along the line AA shown in FIG. The solder jet nozzle 10 is configured such that a second rectangular cylinder 12 smaller than the first rectangular cylinder 11 is disposed inside the first rectangular cylinder 11. The jet channel 13 is formed by a gap surrounded by the first rectangular cylinder 11 and the second rectangular cylinder 12, and one end of the gap communicates with a molten solder supply path (not shown), from the molten solder supply path. Supply of molten solder 2 is received. The other end of the gap is opened to become a jet port 14, and the molten solder 2 flowing through the jet channel 13 is jetted from the jet port 14. Hereinafter, the molten solder 2 jetted from the jet port 14 is referred to as jet solder.
The reflux path 15 is configured by the second rectangular cylinder 12, and one end thereof communicates with the molten solder tank 3. The other end opens to the inside of the first rectangular cylinder 11 to become the reflux port 16, and the jet solder jetted from the jet port 14 flows into the reflux port 16. The jet solder flowing into the reflux port 16 flows down the reflux path 15 by its own weight and returns to the molten solder tank 3.
　第１の方形筒体１１の噴流口１４側の内壁をテーパ面１７にして、噴流路１３が噴流口１４へ向かうに従って内側にすぼまる形状にしている。これにより、噴流口１４から噴流した噴流はんだの流れる方向が内側に向き、外側に飛び散ったりノズル外表面に流れ出たりしないようにする共に還流口１６へ流入しやすくする。
　また、噴流口１４の開口位置より低い位置に還流口１６を開口させて、図２に示す高低差Δｈをつけることにより、噴流はんだを還流口１６へ流入しやすくする。
　これにより、噴流はんだの安定した噴流経路を確保できる。 The inner wall of the first rectangular cylinder 11 on the jet port 14 side is a tapered surface 17, and the jet channel 13 is tapered toward the jet port 14. As a result, the flowing direction of the jet solder jetted from the jet port 14 is directed inward, so that it does not scatter outward or flow out to the outer surface of the nozzle, and easily flows into the reflux port 16.
Further, by opening the reflux port 16 at a position lower than the opening position of the jet port 14 and giving the height difference Δh shown in FIG. 2, the jet solder can easily flow into the reflux port 16.
Thereby, the stable jet path of jet solder can be secured.
　噴流口１４に対面する位置には、プリント基板１００のスルーホール１０１，１０２にリード線１０４，１０５が挿入されたリード部品１０３が配置され、噴流口１４から噴流した噴流はんだでスルーホール１０１，１０２にリード線１０４，１０５がはんだ付けされる。噴流はんだは図２に黒色の矢印で示す経路を流れるので、隣接するリード部品に接触せず、ブリッジ等の不良が生じない。また、噴流路１３および還流路１５の内壁にはんだの酸化物および炭化物が付着しにくいので、付着物が溶融はんだ２と共に噴流してプリント基板１００に付着することもない。 A lead component 103 having lead wires 104 and 105 inserted in the through holes 101 and 102 of the printed circuit board 100 is disposed at a position facing the jet port 14, and the through holes 101 and 102 are formed by jet solder jetted from the jet port 14. The lead wires 104 and 105 are soldered. Since the jet solder flows along the path indicated by the black arrow in FIG. 2, it does not contact the adjacent lead parts, and defects such as bridges do not occur. Further, since the oxides and carbides of the solder hardly adhere to the inner walls of the jet passage 13 and the reflux passage 15, the deposits do not jet together with the molten solder 2 and adhere to the printed circuit board 100.
　通常、酸化防止およびはんだ濡れ性向上の目的で、はんだ付け前にプリント基板１００の表面にフラックスを塗布してフラックス層１０６を形成しておく。はんだ付けの際は、噴流口１４から還流口１６へ流れる噴流はんだが、リード部品１０３の周辺のフラックスを引き寄せながら還流口１６へ流入する（図２に白色の矢印で示す）。このため、フラックス層１０６が残留しやすくなり、プリント基板１００のはんだ濡れ性が保たれてはんだ付けの品質が良好になる。また、はんだ付けしたはんだ表面が残留したフラックスに被覆され、酸化および炭化が抑制される。さらに、噴流はんだと共にフラックス残渣が還流口１６へ流入するので、溶融はんだ供給路から溶融はんだ２の供給が停止している間、はんだ噴流ノズル１０内に残る溶融はんだ２の表面がフラックスに被覆され、酸化および炭化が抑制される。 Usually, for the purpose of preventing oxidation and improving solder wettability, a flux layer 106 is formed by applying flux to the surface of the printed circuit board 100 before soldering. During soldering, the jet solder flowing from the jet port 14 to the reflux port 16 flows into the reflux port 16 while drawing the flux around the lead component 103 (indicated by a white arrow in FIG. 2). For this reason, the flux layer 106 tends to remain, the solder wettability of the printed circuit board 100 is maintained, and the soldering quality is improved. Moreover, the soldered solder surface is covered with the remaining flux, and oxidation and carbonization are suppressed. Furthermore, since the flux residue flows into the reflux port 16 together with the jet solder, the surface of the molten solder 2 remaining in the solder jet nozzle 10 is covered with the flux while the supply of the molten solder 2 from the molten solder supply path is stopped. , Oxidation and carbonization are suppressed.
　次に、はんだ噴流ノズル１０の変形例を説明する。
　図３に示すはんだ噴流ノズル１０は、第１の方形筒体１１の内側に、２枚の仕切り板１８を設置して成る。噴流路１３は、第１の方形筒体１１と２枚の仕切り板１８に囲まれた２箇所の隙間で構成され、２箇所の隙間それぞれの一端に噴流口１４が開口している。還流路１５は、２枚の仕切り板１８同士の隙間で構成され、隙間の一端に還流口１６が開口している。隙間の他端には、中央から両端へ向かって低くなるよう傾斜した形状の噴流案内面１９が設けられている。さらに、この噴流案内面１９の傾斜して低くなった両端部分、即ち、第１の方形筒体１１の対向する一対の壁面の、２枚の仕切り板１８で挟まれた領域に、排出口２０を開設する。また、図１のはんだ噴流ノズル１０と同様に、第１の方形筒体１１にテーパ面１７を形成し、噴流口１４より低い位置に還流口１６を形成する。 Next, a modified example of the solder jet nozzle 10 will be described.
The solder jet nozzle 10 shown in FIG. 3 is formed by installing two partition plates 18 inside the first rectangular cylinder 11. The jet channel 13 is composed of two gaps surrounded by the first rectangular cylinder 11 and the two partition plates 18, and a jet port 14 is opened at one end of each of the two gaps. The reflux path 15 is constituted by a gap between two partition plates 18, and a reflux port 16 is opened at one end of the gap. The other end of the gap is provided with a jet guide surface 19 having a shape inclined so as to become lower from the center toward both ends. Further, the outlet 20 is formed in the region sandwiched between the two partition plates 18 on both end portions of the jet guide surface 19 which are inclined and lowered, that is, on the pair of opposing wall surfaces of the first rectangular cylinder 11. Open. Further, similarly to the solder jet nozzle 10 of FIG. 1, the tapered surface 17 is formed on the first rectangular cylinder 11, and the reflux port 16 is formed at a position lower than the jet port 14.
　図３に示すはんだ噴流ノズル１０において、噴流路１３を流れて噴流口１４から噴流した噴流はんだは、プリント基板に塗布されたフラックスを引き寄せながら内側の還流口１６へ流入して還流路１５を流れ落ちる。そして、底部の噴流案内面１９に沿って排出口２０へ案内され、排出口２０から流れ出て不図示の溶融はんだ槽へ還流する。 In the solder jet nozzle 10 shown in FIG. 3, the jet solder that flows through the jet flow path 13 and jets from the jet port 14 flows into the inner reflux port 16 while drawing the flux applied to the printed circuit board, and flows down the reflux path 15. . And it guides to the discharge port 20 along the jet guide surface 19 of a bottom part, flows out of the discharge port 20, and recirculate | refluxs to the molten solder tank not shown.
　なお、図１～図３に示すはんだ噴流ノズル１０において、第２の方形筒体１２（または２枚の仕切り板１８）の内壁に螺旋状の螺旋案内路２１を形成して、還流口１６から還流路１５へ流入した噴流はんだを螺旋状に流下させる構成にしてもよい。この構成の場合、噴流はんだが還流路１５に留まる時間が長くなり、はんだ噴流ノズル１０の温度低下を抑制できる。これにより、はんだ噴流ノズル１０の内部において溶融はんだ２に温度むらができにくく、良好なはんだ付けが可能となる。 In the solder jet nozzle 10 shown in FIGS. 1 to 3, a spiral spiral guide path 21 is formed on the inner wall of the second rectangular cylinder 12 (or two partition plates 18) from the reflux port 16. The jet solder that has flowed into the reflux path 15 may be configured to flow down spirally. In the case of this configuration, the time during which the jet solder stays in the reflux path 15 becomes long, and the temperature drop of the solder jet nozzle 10 can be suppressed. As a result, it is difficult for the molten solder 2 to have temperature unevenness inside the solder jet nozzle 10, and good soldering is possible.
　以上より、実施の形態１によれば、はんだ付け装置１に使用するはんだ噴流ノズル１０は、溶融はんだ供給路に連通して溶融はんだ２の供給を受ける噴流路１３と、噴流路１３の端部に開口し噴流口１４に向かうにつれ内側にすぼまる形状であって噴流路１３を流通した溶融はんだ２を噴流する噴流口１４と、噴流口１４の内側かつ低い位置に開口し、噴流口１４から噴流した噴流はんだを流入させる還流口１６と、噴流路１３の内側に形成されて還流口１６に連通し、還流口１６から流入する噴流はんだを溶融はんだ槽３へ還流する還流路１５とを備えるように構成した。これにより、噴流はんだを噴流口１４から内側の還流口１６へ流入させるようにして、安定した噴流経路を確保できるので、ノズル内壁および外壁にはんだの酸化物および炭化物が付着することがなく、はんだ付け不良の発生を抑制することができる。また、噴流はんだがフラックスを引き寄せながら還流口１６へ流入するので、プリント基板１００のフラックスが残留しやすくなり、濡れ性を保つことができ、かつ、はんだ付けしたはんだ表面を被覆して酸化および炭化を抑制することができる。従って、はんだ付けの品質を向上させることができる。 As described above, according to the first embodiment, the solder jet nozzle 10 used in the soldering apparatus 1 includes the jet channel 13 that communicates with the molten solder supply channel and receives the supply of the molten solder 2, and the end of the jet channel 13. And a jet port 14 that jets the molten solder 2 that has flowed through the jet channel 13 and opens at a lower position inside the jet port 14. A recirculation port 16 through which the jet solder spouted from the reflow port is formed, and a recirculation passage 15 that is formed inside the reflow channel 13 and communicates with the recirculation port 16 and recirculates the flow solder flowing from the recirculation port 16 to the molten solder bath 3. It was configured to provide. Accordingly, since the jet solder is caused to flow from the jet port 14 to the inner reflux port 16 and a stable jet flow path can be secured, solder oxides and carbides do not adhere to the nozzle inner wall and outer wall, and the solder Generation | occurrence | production of improper attachment can be suppressed. Further, since the jet solder flows into the reflux port 16 while attracting the flux, the flux of the printed circuit board 100 is likely to remain, the wettability can be maintained, and the soldered solder surface is coated to be oxidized and carbonized. Can be suppressed. Therefore, the quality of soldering can be improved.
　また、実施の形態１によれば、還流路１５は、還流口１６から流入した噴流はんだを螺旋状に流す螺旋案内路２１を有するように構成したので、はんだ噴流ノズル１０の温度低下を抑制することができる。 In addition, according to the first embodiment, the reflux path 15 is configured to have the spiral guide path 21 that flows the jet solder flowing in from the reflux port 16 in a spiral manner, so that the temperature drop of the solder jet nozzle 10 is suppressed. be able to.
　なお、図示例では、はんだ噴流ノズル１０を直方体状に形成したが、これに限定されるものではなく、例えば、直径の異なる２つの円筒を同心円状に組み合わせて円柱状のはんだ噴流ノズル１０を形成してもよい。
　また、はんだ付け装置１は、溶融はんだ槽３、溶融はんだ供給路およびはんだ噴流ノズル１０を少なくとも一つ以上備えた構成であればよく、一つのはんだ噴流ノズル１０を使用してポイントディップ用のはんだ付け装置１を構成してもよいし、複数のはんだ噴流ノズル１０を使用してマルチディップ用のはんだ付け装置１を構成してもよい。 In the illustrated example, the solder jet nozzle 10 is formed in a rectangular parallelepiped shape. However, the present invention is not limited to this. For example, the cylindrical solder jet nozzle 10 is formed by concentrically combining two cylinders having different diameters. May be.
The soldering apparatus 1 may be configured to include at least one of the molten solder bath 3, the molten solder supply path, and the solder jet nozzle 10, and the solder for point dip using the single solder jet nozzle 10 is used. The soldering apparatus 1 may be configured, or the soldering apparatus 1 for multi-dip may be configured using a plurality of solder jet nozzles 10.
　以上説明した以外にも、本願発明はその発明の範囲内において、実施の形態の任意の構成要素の変形、もしくは実施の形態の任意の構成要素の省略が可能である。 In addition to the above description, the present invention can be modified in any component in the embodiment or omitted in any component within the scope of the invention.
　以上のように、この発明に係るはんだ噴流ノズルは、噴流口の内側へはんだを噴流させてはんだ付けの品質向上を可能にしたので、ポイントディップ用およびマルチディップ用などの局所はんだ付け装置に用いるのに適している。 As described above, the solder jet nozzle according to the present invention enables soldering quality to be improved by jetting solder to the inside of the jet port, so that it is used for a local soldering apparatus for point dip and multi-dip use. Suitable for
　１　はんだ付け装置、２　溶融はんだ、３　溶融はんだ槽、１０　はんだ噴流ノズル、１１　第１の方形筒体、１２　第２の方形筒体、１３　噴流路、１４　噴流口、１５　還流路、１６　還流口、１７　テーパ面、１８　仕切り板、１９　噴流案内面、２０　排出口、２１　螺旋案内路、１００　プリント基板、１０１，１０２　スルーホール、１０３　リード部品、１０４，１０５　リード線、１０６　フラックス層。 DESCRIPTION OF SYMBOLS 1 Soldering apparatus, 2 Molten solder, 3 Molten solder tank, 10 Solder jet nozzle, 11 1st square cylinder, 12 2nd square cylinder, 13 jet channel, 14 jet port, 15 recirculation channel, 16 reflux port , 17 taper surface, 18 partition plate, 19 jet guide surface, 20 discharge port, 21 spiral guideway, 100 printed circuit board, 101, 102 through hole, 103 lead component, 104, 105 lead wire, 106 flux layer.

Claims (4)

  1. 　溶融はんだ槽に形成された溶融はんだ供給路に連通して溶融はんだの供給を受ける噴流路と、
    　前記噴流路の端部に開口し、当該開口端部に向かうにつれ内側にすぼまる形状であって、前記噴流路を流通した前記溶融はんだを噴流する噴流口と、
    　前記噴流口の内側かつ低い位置に開口し、前記噴流口から噴流した前記溶融はんだを流入させる還流口と、
    　前記噴流路の内側に形成されて前記還流口に連通し、前記還流口から流入する前記溶融はんだを前記溶融はんだ槽へ還流する還流路とを備えるはんだ噴流ノズル。     A jet passage that is connected to a molten solder supply passage formed in the molten solder tank and receives a supply of molten solder;
    A jet opening that opens at an end of the jet flow path and that squeezes inwardly toward the opening end, and jets the molten solder flowing through the jet flow path;
    A reflux port that opens at a lower position inside the jet port and into which the molten solder jetted from the jet port flows, and
    A solder jet nozzle comprising: a reflux path formed inside the jet flow path, communicating with the reflux port, and refluxing the molten solder flowing from the reflux port to the molten solder tank.
  2. 　還流路は、還流口から流入した溶融はんだを螺旋状に流す案内路を有することを特徴とする請求項１記載のはんだ噴流ノズル。 2. The solder jet nozzle according to claim 1, wherein the reflux path has a guide path for flowing the molten solder flowing in from the reflux port in a spiral shape.
  3. 　溶融はんだを貯留する溶融はんだ槽と、
    　前記溶融はんだ槽に形成された溶融はんだ供給路と、
    　前記溶融はんだ供給路に連通して溶融はんだの供給を受ける噴流路、前記噴流路の端部に開口し当該開口端部に向かうにつれ内側にすぼまる形状であって前記噴流路を流通した前記溶融はんだを噴流する噴流口、前記噴流口の内側かつ低い位置に開口し前記噴流口から噴流した前記溶融はんだを流入させる還流口、および噴流路の内側に形成されて前記還流口に連通し前記還流口から流入する前記溶融はんだを前記溶融はんだ槽へ還流する還流路を有するはんだ噴流ノズルとを備えるはんだ付け装置。     A molten solder tank for storing molten solder;
    A molten solder supply path formed in the molten solder tank;
    A jet passage that communicates with the molten solder supply passage and receives the supply of molten solder, has an opening at the end of the jet passage, and narrows inward toward the opening end, and flows through the jet passage. A jet port for jetting molten solder, a reflux port that opens at a low position inside the jet port and into which the molten solder jetted from the jet port flows, and is formed inside the jet channel and communicates with the reflux port A soldering apparatus comprising: a solder jet nozzle having a reflux path for returning the molten solder flowing in from a reflux port to the molten solder tank.
  4. 　溶融はんだ槽に形成された溶融はんだ供給路に連通して溶融はんだの供給を受ける噴流路と、
    　前記噴流路の端部に開口し、当該開口端部に向かうにつれ内側にすぼまる形状であって、前記噴流路を流通した前記溶融はんだを噴流する噴流口と、
    　前記噴流口の内側かつ低い位置に開口し、前記噴流口から噴流した前記溶融はんだを流入させる還流口と、
    　前記噴流路の内側に形成されて前記還流口に連通し、前記還流口から流入する前記溶融はんだを前記溶融はんだ槽へ還流する還流路とを備えるはんだ噴流ノズルを用いて、
    　溶融はんだを前記噴流口の形状に沿わせて内側へ向けて噴流し、対象物に接触させてはんだ付けし、前記還流口へ流入させることを特徴とするはんだ付け方法。     A jet passage that is connected to a molten solder supply passage formed in the molten solder tank and receives a supply of molten solder;
    A jet opening that opens at an end of the jet flow path and that squeezes inwardly toward the opening end, and jets the molten solder flowing through the jet flow path;
    A reflux port that opens at a lower position inside the jet port and into which the molten solder jetted from the jet port flows, and
    Using a solder jet nozzle that is formed inside the jet flow path, communicates with the reflux port, and has a reflux path for refluxing the molten solder flowing from the reflux port to the molten solder tank,
    A soldering method, characterized in that molten solder is jetted inward along the shape of the jet port, soldered in contact with an object, and allowed to flow into the reflux port.
PCT/JP2011/002258 2011-04-18 2011-04-18 Solder jet nozzle, soldering device, and soldering method WO2012143967A1 (en)

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KR20210027180A (en) * 2019-08-30 2021-03-10 세호 시스템테크니크 게엠베하 Soldering nozzle, method for the production thereof and method for the selective soldering of an assembly

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WO2019211998A1 (en) * 2018-05-01 2019-11-07 三菱電機株式会社 Soldering nozzle, soldering device, soldering method, and method for manufacturing printed wiring board
KR20210027180A (en) * 2019-08-30 2021-03-10 세호 시스템테크니크 게엠베하 Soldering nozzle, method for the production thereof and method for the selective soldering of an assembly
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