JP2009212249A - Apparatus and method for forming wiring pattern - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for forming wiring patterns and a manufacturing method thereof that can simplify manufacturing processes and reduce waste of resources to contribute to environmental protection measures, while improving the product reliability. <P>SOLUTION: The apparatus 1 for forming wiring patterns includes a vessel 2 for storing a liquid wiring pattern material P, a material ejector 3 for ejecting the liquid wiring pattern material P stored in the vessel 2 as a minuscule droplet p, a base mount 5 disposed below the material ejector 3 for mounting an insulating substrate 4, a memory 6 for storing predefined wiring pattern design data, a horizontal driver 7 for moving at least one of the material ejector 3 and the base mount 5 within the same plane, and a control circuit section 8 for controlling an ejection timing of the material ejector 3 and driving of the horizontal driver 7 on the basis of the wiring pattern design data stored in the memory 6. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a wiring pattern forming apparatus and a forming method for a printed wiring board in which a conductive circuit (wiring pattern) is formed on the surface of an insulating substrate.

JP 2006-114807 A JP 2002-155305 A Japanese Patent No. 3375652

  Conventionally, printed wiring boards on which electronic components are mounted are installed in various electrical devices.

  This printed wiring board is generally manufactured by a method in which an insulating substrate with a copper foil applied to the entire surface is mainly removed by etching, leaving only the wiring pattern region and dissolving and removing other excess copper foil portions.

  However, in the subtractive process of removing the material and forming the wiring pattern of the printed wiring board, the area of the copper foil portion to be dissolved and removed by etching is much larger than the area of the wiring pattern portion. In addition to waste, there are many work steps such as etching resist film formation and etching steps, and further, a step of removing the etching resist film, which is a complicated and inefficient production method.

  Further, in such a subtractive process, since a large amount of etching waste liquid is discharged, it is a high-cost production technique that requires a large amount of money for the construction of a wastewater treatment facility considering environmental protection measures.

  For this reason, a method of forming only a necessary wiring pattern portion by an electroless plating method has been conventionally proposed.

  As one such method, a wiring pattern is printed on an insulating substrate using ink containing an electroless plating activator and an adhesive (binder), and the substrate surface is fixed by heating or other means. A technique for forming a conductive circuit by immersing the substrate in an electroless plating bath after activation and forming a metal layer only in the wiring pattern region is well known.

  Such a conductive circuit forming technique is suitable for mass production of printed wiring boards having the same wiring pattern because the wiring pattern is printed using a plate printing method. Further, since the plate printing method can contain a heat-resistant adhesive in the ink, for example, it is also possible to produce a highly practical printed wiring board that can withstand the soldering temperature.

  However, in recent years, it has become necessary to respond to rapidly changing market needs without delay in order to cope with the higher functionality of the printed circuit board on which the information communication device is mounted with higher functionality. As a manufacturing process suitable for high-mix low-volume production that replaces the plate printing method, a printed wiring board manufacturing technique for forming a wiring pattern or a solder resist by an ink jet drawing method has attracted attention (for example, see Patent Document 1).

  The circuit formation technology by direct drawing of the ink jet drawing method includes a functional material by ejecting minute ink droplets from an ink-jet head and landing the droplets on necessary positions on the substrate according to the wiring pattern. A liquid pattern is drawn, and droplets that have landed on the substrate wet and spread on the substrate according to the interfacial energy between the substrate and the ink, and then evaporate the solvent of the ink (for example, firing at 150 to 200 ° C.) By doing so, a film pattern (wiring pattern) made of a functional material is formed.

As a result, in contrast to the subtractive process described above, the ink jet method is an additive process in which materials are added only where necessary, so that the manufacturing process can be simplified and the waste of resources can be suppressed. In addition to being able to contribute to environmental protection measures, not only can it be adapted to low-volume production of various varieties, but also the formation of fine wiring by using metal nano ink as the ink material (for example, line width 10 μm) Can also be realized.
On the other hand, the technique described in patent document 2, 3 is provided as a manufacturing apparatus of a metal sphere.

  By the way, in the manufacturing method of the printed wiring board using the inkjet method described above, metal nano ink is used as the ink material, but metal nano ink is suppressed while suppressing occurrence of nozzle clogging due to metal nanoparticles contained in the metal nano ink. If the bonding relationship between the particles is not ensured, the conductivity as the electric wiring after firing is not ensured, and as a result, it is difficult to achieve the above-described simplification of the manufacturing process, waste of resources, environmental protection measures, etc. In addition, there is a problem that the reliability of the product is inferior.

  In order to solve the above problems, the present invention can simplify the manufacturing process, reduce waste of resources, contribute to environmental protection measures, and improve product reliability. An object of the present invention is to provide a wiring pattern forming apparatus for a printed wiring board.

  In order to achieve the object, the wiring pattern forming apparatus according to claim 1 generates a predetermined displacement by a container that stores a molten wiring pattern material, a nozzle portion provided in the container, and a pulse pressure. A material ejection device that transmits a pressure actuator, a displacement of the pressure actuator, and ejects minute droplets from the ejection port of the container including a cylinder head that is inserted into the nozzle portion, and is disposed below the ejection port. And a horizontal driving device for moving at least one of the material ejection device or the base in accordance with predetermined wiring pattern design data.

The wiring pattern forming method according to claim 12, wherein the wiring pattern material is melted in a container, a pulse pressure is applied to the molten wiring pattern material to eject fine droplets from the ejection port of the container, and A wiring pattern is formed on the substrate according to data while relatively moving the substrate disposed below the outlet.
According to the wiring pattern forming apparatus according to claim 1 and the wiring pattern forming method according to claim 12, the molten wiring pattern material stored in the container is applied to the microdroplet from the jet nozzle by applying a pulse pressure. As a result, it is possible to form a wiring pattern on the substrate by a simple additive process step that is ejected onto the substrate, thereby simplifying the manufacturing process and reducing waste of resources, and also for environmental protection measures. You can contribute. Further, since the liquid wiring pattern material stored in the container is only ejected from the jet outlet as fine droplets, clogging of the liquid wiring pattern material is unlikely to occur, and the reliability of the product can be improved.
The wiring pattern forming apparatus according to claim 2 is a container that stores a molten wiring pattern material, and a pulse pressure is applied to the molten wiring pattern material to eject fine droplets from an outlet of the container. A material ejection device, a base placed under the ejection port and on which a substrate is placed, a storage unit storing predetermined wiring pattern design data, and at least one of the material ejection device and the base are moved. A horizontal drive device and a control circuit unit that controls ejection timing of the material ejection device and driving of the horizontal drive device based on wiring pattern design data stored in the storage unit are provided. .

  Further, according to the wiring pattern forming apparatus of the second aspect, while the ejection timing of the material ejection device and the driving of the horizontal driving device are controlled by the control circuit unit based on the wiring pattern design data stored in the storage unit, The liquid wiring pattern material stored in the container can be formed on the insulating substrate by a simple additive process step in which a pulse pressure is applied to eject the liquid wiring pattern material as fine droplets from the ejection port onto the insulating substrate. In addition to simplifying the manufacturing process, waste of resources can be suppressed, contributing to environmental protection measures. In addition, since the liquid wiring pattern material stored in the container is only ejected as fine droplets from the ejection port, clogging of the molten wiring pattern material is difficult to occur, and the reliability of the product can be improved. it can.

  The invention according to claim 3 is the wiring pattern forming apparatus according to claim 1 or 2, further comprising an elevating drive device for moving at least one of the material ejection device or the base toward and away from the other. is there.

By providing an elevating drive device that moves at least one of the material ejection device or the base toward and away from the other, depending on the type of molten wiring pattern material stored in the container, etc., from the ejection port The drying time and viscosity of the ejected fine droplets can be adjusted.
A fourth aspect of the present invention is the wiring pattern forming apparatus according to any one of the first to third aspects, wherein the jet nozzle has a diameter of 1 to 200 μm.

Although the diameter of the ejection outlet is not particularly limited, a plurality of wiring patterns with minute intervals and minute wires can be formed by ejecting minute droplets having a diameter of 10 to 200 μm.
The invention according to claim 5 is the wiring pattern forming apparatus according to any one of claims 1 to 4, wherein the substrate is formed with a groove that matches a shape of the wiring pattern. .

On the other hand, by forming a groove that matches the shape of the wiring pattern on the insulating substrate, the width and depth of the wiring pattern can be defined by the ejected minute droplets.
The invention according to claim 6 is the wiring pattern forming apparatus according to claim 5, wherein the diameter of the micro droplet is smaller than the groove width.

Further, by setting the diameter of the fine droplets to be smaller than the width of the groove, the protrusion from the groove can be suppressed.
According to a seventh aspect of the invention, the vertical distance between the material ejection device and the substrate is such that micro droplets land on the substrate surface after landing from the material ejection device to the substrate. The wiring pattern forming apparatus according to claim 1, wherein the wiring pattern forming apparatus is set to a distance.
By causing the droplets to spread on the substrate surface after landing, the wiring pattern material can reach the pattern formed by the droplets that have fallen before. That is, if the separation distance is too large, the droplets solidify before landing and there is a possibility that a discontinuous wiring pattern is formed. In addition, when landing in the semi-solid state, the liquid droplets slightly spread, but the amount of expansion is less than that in the molten state, and in order to form a discontinuous wiring pattern, the volume of the liquid droplets In addition, precision is required for controlling the ejection timing of droplets.
The separation distance for achieving the spread on the substrate surface after landing depends on the temperature of the molten material at the time of ejection, the atmospheric temperature, the ejection speed, the substrate temperature, etc., so that these conditions are appropriately changed. It may be obtained by experiment in advance. The separation distance may be variable.
The invention according to claim 8 is provided with a heating section for heating the liquid wiring pattern material stored in the container around the container. It is a wiring pattern formation apparatus of description.

By providing a heating section for heating the liquid wiring pattern material stored in the container around the container, it is possible to eject fine droplets having a stable size and viscosity.

The invention according to claim 9 is the wiring pattern forming apparatus according to any one of claims 1 to 8, wherein means for heating the substrate is provided.
According to a tenth aspect of the present invention, the wiring pattern material is melted in a container, a pulse pressure is applied to the molten wiring pattern material, and a fine droplet is ejected from the ejection port of the container, and is disposed below the ejection port. This is a method for manufacturing a base material having a wiring pattern in which a wiring pattern is formed on the substrate according to data while relatively moving the substrate.
The invention according to claim 11 is the method for producing a substrate having a wiring pattern according to claim 10, wherein the wiring pattern is formed while at least one of the material jetting device or the base is moved closer to or away from the other.
The invention according to claim 12 is the method for manufacturing a base material having a wiring pattern according to claim 10 or 11, wherein the diameter of the ejection port is 1 to 200 μm.
A thirteenth aspect of the present invention is a method for manufacturing a substrate having a wiring pattern according to any one of the tenth to twelfth aspects, wherein a groove matching the shape of the wiring pattern is formed in the substrate. .
The invention according to claim 14 is the method for producing a substrate having a wiring pattern according to claim 13, wherein the droplet spreads in the longitudinal direction of the groove after landing on the substrate surface to form a continuous wiring. is there.
The invention according to claim 15 is a method for producing a substrate having a wiring pattern according to claim 13 or 14, wherein the start and stop of relative movement between the substrate and the container are repeated in small increments for each operation of ejection (so-called inching movement). is there.

At this time, the horizontal driving device moves the material ejecting device in an inching manner, so that the landing position of the droplet is stabilized, and therefore, a more reliable wiring pattern can be formed. It is possible to reliably prevent discontinuous wiring or incomplete wiring without increasing the volume of the droplet.
According to the sixteenth aspect of the present invention, when the cross-sectional area of the longitudinal section of the groove is (S) and the relative movement distance between the container and the substrate is (L), S × L is 80 to 100 of the volume of the droplet. It is a manufacturing method of the base material which has a wiring pattern of any one of Claim 13 thru | or 15 made into%.
By setting S × L to 80 to 100% of the volume of the droplet, it is possible to form a wiring pattern that is continuous and has little overlap.
When the liquid droplets land and become solidified or semi-solidified, the tip of the formed wiring pattern 61 has an inclined portion 60 as shown in FIG. When the next droplet p2 reaches the substrate, the droplet p2 spreads so as to cover the inclined portion 60. At that time, when S × L is controlled to 80 to 100% of the volume of the droplet p2, the droplet does not exceed the inclined portion 60 and becomes almost the same as the height of the formed wiring pattern 61. Form. Therefore, it is possible to form a wiring pattern with less unevenness.
The invention according to claim 17 is the wiring according to any one of claims 10 to 16, wherein the wiring pattern is formed by heating the temperature of the substrate to (Tm-50 ° C) to (Tm-30 ° C). It is a manufacturing method of the base material which has a pattern.
Tm: Melting point of wiring pattern material (° C)
When the substrate is heated to such a temperature, the wettability is improved, and when the droplets land, it is possible to prevent the whole from immediately solidifying. Therefore, it is possible to increase the amount of spreading of the droplets.
Furthermore, when the substrate is heated, it is possible to prevent the occurrence of convection between the jet outlet and the substrate, and it is possible to prevent the droplets from being shifted due to the convection. Therefore, according to the invention according to the present claim, it is possible to land at a position within 20%, further within a position within 3% from the aimed landing position.
When the substrate temperature is (Tm−50 ° C.) to (Tm−30 ° C.), it is possible to ensure a good spread of the droplet after landing without strictly controlling the droplet temperature and other conditions, and is high. A wiring pattern having no discontinuity in yield and excellent surface flatness can be formed with high yield. If the substrate temperature is outside this range, the yield is significantly reduced.
The invention according to claim 18 has the pattern according to any one of claims 10 to 17, wherein a landing position of the droplet is set to a position within 20% of a diameter of the jet port from the center of the jet port. It is a manufacturing method of a base material.
The invention according to claim 19 is the method for producing a substrate having a pattern according to any one of claims 10 to 18, wherein an atmosphere from the jet nozzle to the substrate is an inert gas atmosphere or a vacuum atmosphere. Thereby, it becomes possible to prevent the wiring from being oxidized.
The invention according to claim 20 is the method for producing a substrate having a pattern according to claim 19, wherein the inert gas is heated.
Rapid solidification of droplets can be prevented, wettability can be improved, and the amount of spread after landing can be increased.

  Further, the horizontal driving device can prevent the wiring pattern from being disconnected by moving the material ejection device within the same plane at a distance shorter than the diameter of the micro droplet.

At this time, by forming the width and depth of the groove with reference to 90 to 98% of the volume of the fine droplet, the volume obtained by multiplying the cross-sectional area by the horizontal driving distance, Depth can be defined.

  Further, the distance between the material ejection device and the insulating substrate in the vertical direction is such that the liquid wiring pattern material is semi-fixed while micro droplets are ejected from the material ejection device to the insulating substrate, In addition, by setting the distance to be fixed immediately after landing on the insulating substrate, it is possible to reduce the formation time of the wiring pattern and to easily adhere to the fine droplets ejected next. Can be secured.

  According to the printed wiring board of the present invention, it is possible to simplify the manufacturing process, reduce waste of resources, contribute to environmental protection measures, and improve product reliability. Can do.

  Next, an embodiment of the wiring pattern forming apparatus of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1 is a cross-sectional view showing a first embodiment of a wiring pattern forming apparatus of the present invention.

In FIG. 1, a wiring pattern forming apparatus 1 includes a container 2 that stores a liquid wiring pattern material P, and applies a pulse pressure to the liquid wiring pattern material P to generate microdroplets p from an ejection port (not shown) of the container 2. The material ejection device 3 that ejects, the base 5 that is disposed below the ejection port and on which the insulating substrate 4 is mounted, and at least one of the material ejection device 3 or the base 5 is moved according to predetermined wiring pattern design data And a horizontal driving device 7

  According to such a configuration, a simple addition method in which the molten (liquid) wiring pattern material P stored in the container 2 is ejected as fine droplets p from the ejection port onto the insulating substrate 4 by applying a pulse pressure. A wiring pattern can be formed on the insulating substrate 4 in the process step, so that the manufacturing process can be simplified, waste of resources can be suppressed, and environmental protection measures can be contributed. Further, since the liquid wiring pattern material P stored in the container 2 is only ejected from the ejection port as the fine droplets p, clogging of the liquid wiring pattern material P hardly occurs and the reliability of the product is improved. be able to.

  In addition, the wiring pattern forming apparatus 1 applies a pulse pressure to the container 2 storing the liquid wiring pattern material P and the liquid wiring pattern material P, and ejects microdroplets p from an ejection port (not shown) of the container 2. At least one of the material ejection device 3, the base 5 disposed below the ejection port and on which the insulating substrate 4 is placed, the storage unit 6 storing predetermined wiring pattern design data, and at least the material ejection device 3 or the base 5 A horizontal driving device 7 for moving one of them, and a control circuit unit 8 for controlling the ejection timing of the material ejection device 3 and the driving of the horizontal driving device 7 based on the wiring pattern design data stored in the storage unit 5. Yes.

  According to such a configuration, the control circuit unit 8 controls the ejection timing of the material ejection device 3 and the drive of the horizontal driving device 7 based on the wiring pattern design data stored in the storage unit 6, while storing in the container 2. The applied wiring pattern material P can be formed on the insulating substrate 4 by a simple additive process step in which the liquid wiring pattern material P is ejected as fine droplets p from the ejection port onto the insulating substrate 4 by applying a pulse pressure. In addition to simplifying the manufacturing process, waste of resources can be suppressed, contributing to environmental protection measures. Further, since the liquid wiring pattern material P stored in the container 2 is only ejected from the ejection port as the fine droplets p, clogging of the liquid wiring pattern material P hardly occurs and the reliability of the product is improved. be able to.

Furthermore, the wiring pattern forming apparatus 1 includes a lifting / lowering drive device 9 that moves at least one of the material jetting device 3 or the base 5 toward and away from the other, so that the drying time of the ejected microdroplets can be reduced. The viscosity can be adjusted.
As the material ejection device, the devices described in Patent Documents 2 and 3 can also be used.
What is necessary is just to add a horizontal displacement apparatus etc. to these apparatuses, for example, the following apparatus can also be used.
A flowable material storage container for storing the flowable material, a supply pipe serving as a path for supplying the flowable material storage container to the flowable material from the material container, and a diaphragm in close contact with the flowable material storage container; A device comprising an orifice provided at the bottom of the fluid material storage container, a piezoelectric actuator for generating a predetermined pulse pressure, and a transmission rod for transmitting the pulse pressure of the piezoelectric actuator to the diaphragm.
A flowable material storage container for storing the flowable material, a supply pipe for supplying the flowable material storage container with the flowable material from the material container, and a nozzle portion provided in the flowable material storage container An orifice provided in the nozzle portion for injecting the flowable material in the flowable material storage container, a piezoelectric actuator for generating a predetermined displacement, and the displacement of the piezoelectric actuator is inserted into the nozzle portion. A device having a transmission rod that transmits the displacement of the cylinder rod to the nozzle portion.
A first container for storing molten metal; a second container for replenishing the first container with the molten metal; a heating device provided on an outer periphery of the second container; A replenishment conduit communicating the second container and the second container, an orifice provided at the bottom of the first container for injecting molten metal one by one as monodisperse particles, and a single orifice below the orifice. A chamber for generating an inert gas flow for spheroidizing dispersed particles, an introduction pipe for introducing an inert gas into the chamber, a piezoelectric actuator for generating a predetermined pulse pressure, and a transmission rod for transmitting the pulse pressure And is attached integrally to the tip of the transmission rod, and in close contact with the molten metal in the first container to apply the pulse pressure to the molten metal so as to keep the first container liquid-tight. Diaf And a beam, wherein the application of the pulse pressure by the piezoelectric actuator is displaced above the critical displacement of the diaphragm to the molten metal side apparatus which ejects droplets one by one the molten metal from the orifice.

(Example)
Hereinafter, the wiring pattern forming apparatus 1 according to the first embodiment of the present invention will be described in detail.

  The container 2 is configured in a substantially bottomed cylindrical multilayer structure, and a material storage portion 10 for storing the liquid wiring pattern material P is provided therein. Further, the bottom of the container 2 includes a nozzle 11 that communicates with the lower portion of the material reservoir 10 and an orifice plate 12 that is disposed at the lower end of the nozzle 11 and has one or more orifices (spout ports). The material reservoir 10 is supplied with an inert gas for pressurization. In addition, the container 2 can be provided with a stirring member such as a rod or a screw that stirs the liquid wiring pattern material P in the material reservoir 10. Furthermore, by providing a heater (heating unit) for heating or keeping the temperature of the liquid wiring pattern material P around the outer periphery of the container 2, it is possible to eject fine droplets p having a stable size and viscosity.

  The nozzle 11 is formed with a funnel portion 11a that contracts downward, and the liquid wiring pattern material P stored in the funnel portion 11a is supplied to the lower orifice plate 12.

  The orifice plate 12 is held by a support member 13 that is fitted or adhered to the bottomed portion of the container 2 and has a central opening. The material constituting the orifice plate 12 is appropriately determined according to the type of the liquid wiring pattern material P and the like, and the wettability with the liquid wiring pattern material P can be adjusted by appropriately selecting the constituent material. it can. In addition, when the wettability between the orifice plate 12 and the liquid wiring pattern material P is very good and the liquid wiring pattern material P flows out (leaks) along the surface of the orifice plate 12, the constituent material of the orifice plate 12 is changed. In addition to selection as appropriate, silicon grease or the like may be applied to the surface of the orifice plate 12 to reduce wettability. Furthermore, the orifice shape and orifice diameter formed in the orifice plate 12 can be appropriately determined according to the particle size of the microdroplet p. For example, in the present embodiment, the diameter 1 to 1 of the microdroplet p is set. Considering 200 μm, a diameter of about 1 to 300 μm is preferable, and a diameter of about 10 to 200 μm is more preferable.

  The material ejection device 3 includes a piezoelectric actuator unit 15 fixed to the base flange 14, a transmission rod 17 connected to the piezoelectric actuator unit 15 via a holder block 16, and a diaphragm 18 attached to the tip of the transmission rod 17. And a guide tube portion 19 held by the base flange 14 so as to cover the constituent members from the piezoelectric actuator unit 15 to the diaphragm 18.

  For example, a multilayer piezoelectric element is used for the piezoelectric actuator unit 15. The piezoelectric actuator unit 15 is connected to a function generator for generating a short waveform of a predetermined frequency and a power amplifier (both not shown) for amplifying the short waveform, and generated and amplified by these function generator and power amplifier. When a short waveform is applied, a predetermined frequency variation is generated. The displacement of the piezoelectric actuator unit 15 is transmitted to the diaphragm 18 through the transmission rod 17.

  As a result, the diaphragm 18 transmits the displacement to the liquid wiring pattern material P stored in the material storage unit 10 and ejects a micro droplet p having a diameter substantially equal to the orifice diameter.

  The guide cylinder part 19 is interposed between the cylinder parts 20 and 21, an upper cylinder part 20 that covers the upper and lower portions of the holder block 16, a lower cylinder part 21 that covers the lower side of the transmission rod 17 and the periphery of the diaphragm 18, and And an intermediate guide plate 22 through which the transmission rod 17 passes.

  The base 5 is connected to a lift drive device 9 such as a lifter, and is provided with a pressing member or the like (not shown) so as to hold the insulating substrate 4 on the upper surface.

  For example, a large capacity hard disk drive (HDD) is used for the storage unit 6, and wiring pattern design data (XY plot data, etc.) designed using wiring pattern design software installed in a personal computer (not shown) or the like. ) Is stored by transfer or the like. The data structure, data format, etc. of the wiring pattern design data are arbitrary.

  A known XY table mechanism or the like is used for the horizontal drive device 7, and the container 2 is held integrally with the material ejection device 3 by the XY stage 23.

  As a result, as shown in FIGS. 2 and 3, the container 2 insulates the minute droplets p from the material ejection device 3 while horizontally moving integrally with the material ejection device 3 in conjunction with the horizontal movement of the XY stage 23. 4 can be ejected to the upper surface.

  The control circuit unit 8 executes various controls including driving of the horizontal driving device 7 and the lifting / lowering driving device 9 based on the ROM 24 storing various control programs related to the overall wiring pattern forming process of the wiring pattern design device 1. . Thus, the control circuit unit 8 and the ROM 24 constitute a microcomputer that executes the wiring pattern forming process according to the present invention. The storage unit 6, the control circuit unit 8, and the ROM 24 may use the personal computer described above, or may be configured as a computer unique to the wiring pattern design apparatus 1.

  By the way, a well-known thing is used for the insulating substrate 4, The shape and thickness, and the formation layer (single side | surface, both surfaces, multilayer, etc.) of a wiring pattern are arbitrary. At this time, a chip, a wafer, or the like can be used as the insulating substrate 4 in addition to a known insulating substrate for a printed wiring board. Further, as shown in FIG. 4, a groove 4a that matches the shape of the wiring pattern is formed on the surface of the insulating substrate 4 so that the width and depth of the wiring pattern are defined by the ejected micro droplets p. can do. Note that the diameter D of the microdroplet p is smaller than the width W, so that the protrusion from the groove 4a can be suppressed.

  Further, as shown in FIG. 5, the vertical separation distance H between the material ejection device 3 and the insulating substrate 4 is such that the liquid droplet p is ejected from the material ejection device 3 to the insulating substrate 4. The wiring pattern material P is maintained in a liquid state, or is semi-solid (solid-liquid coexistence state), and is set to a distance that solidifies immediately after landing on the insulating substrate 4 to shorten the wiring pattern formation time. In addition, it is possible to easily ensure adhesion with the next ejected microdroplet p. Good spread after landing (to the extent that a continuous wiring pattern that extends to the part that was patterned by previous landing can be formed), good overlapping condition (inclined part of the part that was patterned by previous landing) It is preferable to control the distance so that it can land in a liquid state or a solid-liquid coexistence state having a higher viscosity than the liquid state, so that it can land with a viscosity that can achieve a degree that does not overlap.

  Further, as the liquid wiring pattern material P, any pure metal, alloy, or the like can be used as long as it has conductivity, such as gold, silver, copper, tin, (all including an alloy).

  Therefore, as shown in FIG. 6, the microdroplet p ejected to the insulating substrate 4 is viewed in plan (see FIG. 6B) due to the overlap between the continuous ejection and the solidified state due to the time difference. In, it becomes substantially scaly. Thereby, although conductivity is secured, surface polishing or the like may be performed from the viewpoint of improving appearance.

  In addition, the material ejection device 3 insulates the wiring pattern 25 of the minute wire W2 (for example, 1 to 200 μm, 10 to 200 μm) as shown in FIG. 7 by ejecting a minute droplet p having a diameter of 1 to 200 μm. It can be formed on the substrate 4.

  The horizontal driving device 7 can prevent the wiring pattern from being disconnected by moving the material ejection device 3 within the same plane at a distance shorter than the diameter of the micro droplet p. At this time, the horizontal driving device 7 can form a more reliable wiring pattern by moving the material ejection device 3 in an inching movement (intermittent movement).

  Next, the process of forming a wiring pattern on the printed wiring board will be described in order.

  First, the liquid wiring pattern material P is adjusted. As the liquid wiring pattern material P, a material in which a desired metal or alloy is melted in consideration of the insulating substrate 4 and the type (length, thickness, etc.) of the wiring pattern, cost, and the like is used.

  That is, the viscosity as the liquid wiring pattern material P, the viscosity as the microdroplet p, and the quick drying property are appropriately selected. Moreover, in order to optimize these characteristics in the liquid wiring pattern material P, additives such as a dispersant or a binder can be appropriately added. Further, in order to remove bubbles of the liquid wiring pattern material P, vacuum defoaming may be performed.

  Next, when the material ejection device 3 is detached from the container 2 and the material storage part 10 is filled with the liquid wiring pattern material P, the funnel part 11a is reached, but air may be vented here.

  After the liquid wiring pattern material P is filled to the whole material storage part 10 or to a predetermined position, the material jetting device 3 is mounted on the container 2, and then a short waveform with a predetermined frequency is generated by the function generator and amplified by the power amplifier. After that, the voltage is applied to the piezoelectric actuator unit 15.

  At this time, the shape and frequency of the short waveform to be generated are appropriately selected according to the viscosity and the like of the liquid wiring pattern material P.

  The piezoelectric actuator unit 15 generates a vibration having a predetermined frequency and a predetermined amplitude, and this vibration is transmitted to the diaphragm 18 via the transmission rod 17.

  The diaphragm 18 vibrates with a pulse having the same frequency as that of the piezoelectric actuator unit 15 and generates a pulse pressure wave in the liquid wiring pattern material P in contact therewith.

  The liquid wiring pattern material P in the material reservoir 10 is ejected from the orifice on the orifice plate 12 as a fine droplet p for each period of the pulse pressure wave generated in this way.

  The minute droplets p land on the surface of the insulating substrate 4 in a semi-fixed state while freely falling onto the surface of the insulating substrate 4.

  Thereafter, the control circuit unit 8 controls the ejection timing of the material ejection device 3 and the drive of the horizontal driving device 7 based on the wiring pattern design data stored in the storage unit 6, and the liquid wiring pattern material stored in the container 2. A desired wiring pattern 25 can be formed by ejecting P as fine droplets p onto the insulating substrate 4 at regular intervals.

(Embodiment 2)
FIG. 8 is a cross-sectional view of an essential part showing Embodiment 2 of the wiring pattern forming apparatus of the present invention.

  In FIG. 8, the wiring pattern forming device 31 applies a pulse pressure to the container 32 in which the liquid wiring pattern material P is stored, and the liquid wiring pattern material P from the outlet (not shown) of the container 2 to form a microdroplet p. , A base 5 on which the insulating substrate 4 is placed, the storage unit 6 storing predetermined wiring pattern design data, and the material jet 33 or the base A horizontal drive device 7 that moves at least one of the control circuit unit 5, a control circuit unit 8 that controls the ejection timing of the material ejection device 33 and the drive of the horizontal drive device 7 based on the wiring pattern design data stored in the storage unit 6; It has.

  According to such a configuration, the control circuit unit 8 controls the ejection timing of the material ejection device 33 and the drive of the horizontal drive device 7 based on the wiring pattern design data stored in the storage unit 6, while storing in the container 32. It is possible to form a wiring pattern on the insulating substrate 4 by a simple additive process step in which the liquid wiring pattern material P thus formed is ejected as fine droplets p onto the insulating substrate 4 at regular intervals, thereby simplifying the manufacturing process. In addition to being able to reduce waste of resources, it can also contribute to environmental protection measures. Further, since the liquid wiring pattern material P stored in the container 3 is only ejected as fine droplets p, clogging of the liquid wiring pattern material P is unlikely to occur, and the reliability of the product can be improved. .

  Further, the wiring pattern forming device 31 includes the elevating drive device 9 that moves at least one of the material ejection device 33 or the base 5 toward and away from the other, so that the drying time of the ejected microdroplets p is increased. And the viscosity can be adjusted.

(Example)
Hereinafter, the wiring pattern forming apparatus 31 according to the second embodiment of the present invention will be described in detail.

  The container 32 is made of a material (for example, a quartz crucible selected according to the wiring material configured in a substantially bottomed cylindrical shape, and a material storage portion 34 for storing the liquid wiring pattern material P therein. In addition, the bottom of the container 32 includes a nozzle 35 communicating with the lower portion of the material reservoir 34, and an orifice plate 36 disposed at the lower end of the nozzle 35 and having one or more orifices. In addition, an inert gas for pressurization is supplied to the material storage unit 34. Further, the container 32 is provided with a stirring member such as a rod or screw that stirs the liquid wiring pattern material P into the material storage unit 34. In addition, by providing a heating device 37 for heating or keeping the temperature of the liquid wiring pattern material P on the outer periphery of the container 32, micro droplets having a stable size and viscosity can be provided. It can be ejected. The tip end portion of the transmission rod 17 is fitted into the nozzle 35.

  The heating device 37 includes a carbon susceptor 38 that covers the outer wall of the quartz container 32 that holds the heated and melted liquid wiring pattern material P together with the nozzle 35 in a separated state, a heat insulating material 39 disposed on the outer periphery thereof, and an outer periphery thereof. The protective tube 40 is disposed, a heating coil 41 for high-frequency heating disposed on the outer periphery of the protective tube 40, and a lid 42 for heat insulation straddling the upper portion thereof. The lid 42 is supported by the XY stage 43. Further, the heating device 37 heats the carbon constituting the carbon susceptor 38 by the high frequency generated by exciting the heating coil 41 located on the outermost periphery, and by this heating, the container 32 of the inner layer of the carbon susceptor 38 and its The liquid wiring pattern material P put in is heated.

  On the other hand, above the container 32, a material supply in which a material supply port 44a for supplying the liquid wiring pattern material P to the container 32 and an inert gas introduction pipe 44b in communication with a material supply pipe (not shown) is formed. A portion 44 is provided.

  Further, on the outer periphery of the transmission rod 17 covered by the inner wall of the material supply unit 44, a reflector 45 for preventing the temperature in the container 32 and releasing heat to the outside and a thermocouple 46 for temperature measurement are provided. ing.

  The reflector 45 has metal thin plates (not shown) on the upper and lower sides, and the upper and lower thin plates are connected by a wire-like connecting member. Note that the transmission rod 17 passes through the reflector 45.

  The wiring pattern forming apparatus 31 shown in the second embodiment also has substantially the same operations and effects as the wiring pattern forming apparatus 1 shown in the first embodiment.

It is explanatory drawing of the principal part which shows the wiring pattern formation apparatus which concerns on Embodiment 1 of this invention. It is an operation explanatory view of the front direction which shows the wiring pattern formation device concerning Embodiment 1 of the present invention. It is action | operation explanatory drawing of the plane direction which shows the wiring pattern formation apparatus which concerns on Embodiment 1 of this invention. The wiring pattern formation apparatus which concerns on Embodiment 1 of this invention is shown, (A)-(C) is explanatory drawing of the relationship between a microdroplet and a groove | channel. FIG. 3 is a diagram illustrating a wiring pattern forming apparatus according to the first embodiment of the present invention and an explanatory diagram of a state change when a fine droplet is ejected. The wiring pattern which the wiring pattern formation apparatus concerning Embodiment 1 of this invention formed is shown, (A), (B) is explanatory drawing of the continuity of a microdroplet. BRIEF DESCRIPTION OF THE DRAWINGS It is explanatory drawing of a wiring pattern which shows the wiring pattern formation apparatus which concerns on Embodiment 1 of this invention. It is explanatory drawing of the principal part which shows the wiring pattern formation apparatus which concerns on Embodiment 2 of this invention. It is a conceptual diagram which shows the wiring pattern formed in the modification of Embodiment 1 of this invention.

Explanation of symbols

P ... Liquid wiring pattern material p ... Micro droplet 1 ... Wiring pattern forming device 2 ... Container 3 ... Material ejection device 4 ... Insulating substrate 5 ... Base 6 ... Storage unit 7 ... Horizontal drive device 8 ... Control circuit unit 9 ... Lifting Drive device 10 ... Material storage part 11 ... Nozzle 11a ... Funnel part 12 ... Orifice plate 13 ... Support member 14 ... Base flange 15 ... Piezoelectric actuator unit 16 ... Holder block 17 ... Transmission rod 18 ... Diaphragm 19 ... Guide cylinder part 20 ... Upper part Tube portion 21 ... Lower tube portion 22 ... Intermediate guide plate 23 ... XY stage 24 ... ROM
DESCRIPTION OF SYMBOLS 25 ... Wiring pattern 31 ... Wiring pattern formation apparatus 32 ... Container 33 ... Material ejection apparatus 34 ... Material storage part 35 ... Nozzle 36 ... Orifice plate 37 ... Heating device 38 ... Carbon susceptor 39 ... Heat insulating material 40 ... Protection tube 41 ... Heating coil DESCRIPTION OF SYMBOLS 42 ... Cover body 43 ... XY stage 44 ... Material supply part 44a ... Raw material supply port 44b ... Introducing pipe 45 ... Reflector 46 ... Thermocouple 60 Wiring pattern 61 Inclination part

Claims (20)

A container storing molten wiring pattern material, a nozzle portion provided in the container, a pressure actuator that generates a predetermined displacement by a pulse pressure, and a displacement of the pressure actuator is transmitted and inserted into the nozzle portion. A material jetting device for jetting fine droplets from the jetting port of the container comprising a cylinder head, a base on which a substrate is placed and placed under the jetting port, and according to predetermined wiring pattern design data A wiring pattern forming apparatus comprising: a material ejection device or a horizontal driving device that moves at least one of the base. A container that stores molten wiring pattern material, a material jetting device that applies pulse pressure to the molten wiring pattern material to eject micro droplets from the jetting port of the container, and is disposed below the jetting port. A base on which a substrate is placed, a storage unit storing predetermined wiring pattern design data, a horizontal driving device for moving at least one of the material ejection device or the base, and a wiring pattern stored in the storage unit A wiring pattern forming apparatus comprising: a control circuit unit that controls ejection timing of the material ejection device and driving of the horizontal driving device based on design data. The wiring pattern formation apparatus of Claim 1 or Claim 2 provided with the raising / lowering drive device which makes at least one of the said material ejection apparatus or the said base approach / separate with respect to the other. The wiring pattern forming apparatus according to claim 1, wherein the diameter of the jet port is 1 to 200 μm. 5. The wiring pattern forming apparatus according to claim 1, wherein a groove that matches a shape of the wiring pattern is formed in the substrate. 6. The wiring pattern forming apparatus according to claim 5, wherein the diameter of the fine droplet is smaller than the groove width. The vertical separation distance between the material ejection device and the substrate is such that a micro droplet can land on the substrate surface after the droplet has landed on the substrate from the material ejection device. The wiring pattern forming apparatus according to claim 1, wherein the wiring pattern forming apparatus is set. The wiring pattern forming apparatus according to any one of claims 1 to 10, further comprising a heating unit that heats the liquid wiring pattern material stored in the container around the container. 9. The wiring pattern forming apparatus according to claim 1, further comprising a means for heating the substrate. The wiring pattern material is melted in the container, a pulse pressure is applied to the molten wiring pattern material to eject fine droplets from the ejection port of the container, and the substrate disposed below the ejection port is relatively moved. A method of manufacturing a base material having a wiring pattern that forms a wiring pattern on the substrate according to data. The manufacturing method of the base material which has a wiring pattern of Claim 10 which forms a wiring pattern, making at least one of the said material ejection apparatus or the said base approach / separate with respect to the other. The method for producing a substrate having a wiring pattern according to claim 10 or 11, wherein a diameter of the jet port is 1 to 200 µm. The manufacturing method of the base material which has a wiring pattern of any one of Claim 10 thru | or 12 which forms the groove | channel corresponding to the shape of a wiring pattern in the said board | substrate. 14. The method for producing a substrate having a wiring pattern according to claim 13, wherein the droplet spreads in the longitudinal direction of the groove after landing on the substrate surface to form a continuous wiring. The manufacturing method of the base material which has a wiring pattern of Claim 13 or 14 which repeats on / off of the relative motion of a board | substrate and a container for every 1 operation of ejection. The S × L is 80 to 100% of the deposition of droplets, where (S) is the cross-sectional area of the longitudinal section of the groove and (L) is the relative movement distance between the container and the substrate. Item 16. A method for producing a substrate having the wiring pattern according to any one of items 15 to 15. The manufacturing method of the base material which has a wiring pattern of any one of Claim 10 thru | or 16 which heats the temperature of a board | substrate to (Tm-50 degreeC)-(Tm-30 degreeC), and forms a wiring pattern. .
Tm: Melting point of wiring pattern material (° C) The method for producing a substrate having a pattern according to any one of claims 10 to 17, wherein a landing position of the droplet is set to a position within 20% of a diameter of the ejection port from a center of the ejection port. The manufacturing method of the base material which has a pattern of any one of Claims 10 thru | or 18 which made the atmosphere from the said jet nozzle to the said board | substrate the inert gas atmosphere or the vacuum atmosphere. The manufacturing method of the base material which has a pattern of Claim 19 which heats the said inert gas.

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