JPH01114165U - - Google Patents
Info
- Publication number
- JPH01114165U JPH01114165U JP950788U JP950788U JPH01114165U JP H01114165 U JPH01114165 U JP H01114165U JP 950788 U JP950788 U JP 950788U JP 950788 U JP950788 U JP 950788U JP H01114165 U JPH01114165 U JP H01114165U
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- duct
- jet
- bath
- wide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims 1
- 230000009466 transformation Effects 0.000 description 1
Description
第１図は本考案噴流はんだ槽の正面断面図、第
２図は第１図Ａ―Ａ線断面図、第３図は第１図Ｂ
―Ｂ線断面図、第４図は変流板の拡大斜視図であ
る。
１……噴流はんだ槽、２……ノズル口、３……
ノズル本体、４……ポンプ、５……ダクト、７，
８，９……変流板、１０……ダクト出口。
Figure 1 is a front sectional view of the jet solder bath of the present invention, Figure 2 is a sectional view taken along line A-A in Figure 1, and Figure 3 is Figure 1 B.
-A sectional view taken along line B, and FIG. 4 is an enlarged perspective view of the current transformation plate. 1... Jet solder bath, 2... Nozzle opening, 3...
Nozzle body, 4...Pump, 5...Duct, 7,
8, 9...Current variable plate, 10...Duct outlet.
Claims (1)
ズル本体内に流入した後ノズル口から噴流する噴
流はんだ槽において、ノズル底面には横巾の異な
る複数の変流板がダクト出口からノズル奥方に向
かつて順次横巾が広くなるようにして設置されて
いることを特徴とする噴流はんだ槽。 In the jet solder bath, in which molten solder pumped by a pump flows from the duct into the nozzle body and then jets out from the nozzle opening, a plurality of flow-changing plates with different widths are installed on the bottom of the nozzle in order from the duct outlet toward the back of the nozzle. A jet soldering bath characterized by being installed so that its width is wide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988009507U JPH0641722Y2 (en) | 1988-01-29 | 1988-01-29 | Jet solder bath |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988009507U JPH0641722Y2 (en) | 1988-01-29 | 1988-01-29 | Jet solder bath |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01114165U true JPH01114165U (en) | 1989-08-01 |
| JPH0641722Y2 JPH0641722Y2 (en) | 1994-11-02 |
Family
ID=31216305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988009507U Expired - Lifetime JPH0641722Y2 (en) | 1988-01-29 | 1988-01-29 | Jet solder bath |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0641722Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007116853A1 (en) * | 2006-04-05 | 2007-10-18 | Senju Metal Industry Co., Ltd. | Jet solder bath |
| WO2013161453A1 (en) | 2012-04-27 | 2013-10-31 | 千住金属工業株式会社 | Drift plate and jet device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5010433U (en) * | 1973-05-29 | 1975-02-03 |
-
1988
- 1988-01-29 JP JP1988009507U patent/JPH0641722Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5010433U (en) * | 1973-05-29 | 1975-02-03 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007116853A1 (en) * | 2006-04-05 | 2007-10-18 | Senju Metal Industry Co., Ltd. | Jet solder bath |
| WO2013161453A1 (en) | 2012-04-27 | 2013-10-31 | 千住金属工業株式会社 | Drift plate and jet device |
| US9622395B2 (en) | 2012-04-27 | 2017-04-11 | Senju Metal Industry Co., Ltd. | Guide vane and jetting apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0641722Y2 (en) | 1994-11-02 |