JPS6410361U - - Google Patents

Info

Publication number
JPS6410361U
JPS6410361U JP10211087U JP10211087U JPS6410361U JP S6410361 U JPS6410361 U JP S6410361U JP 10211087 U JP10211087 U JP 10211087U JP 10211087 U JP10211087 U JP 10211087U JP S6410361 U JPS6410361 U JP S6410361U
Authority
JP
Japan
Prior art keywords
nozzle
solder
jet
soldering apparatus
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10211087U
Other languages
Japanese (ja)
Other versions
JPH0534849Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987102110U priority Critical patent/JPH0534849Y2/ja
Publication of JPS6410361U publication Critical patent/JPS6410361U/ja
Application granted granted Critical
Publication of JPH0534849Y2 publication Critical patent/JPH0534849Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の噴流式はんだ付け装置の一実
施例を示す断面図、第２図はその１次槽の一部断
面図、第３図はそのノズル部分の平面図である。 Ｗ…被はんだ付け物、１１…はんだ槽、１３…
ポンプ、２９…ノズル、３７…整流板、４１…は
んだ流路。 FIG. 1 is a sectional view showing an embodiment of the jet soldering apparatus of the present invention, FIG. 2 is a partial sectional view of the primary tank thereof, and FIG. 3 is a plan view of the nozzle portion thereof. W...Object to be soldered, 11...Solder bath, 13...
Pump, 29... nozzle, 37... rectifier plate, 41... solder channel.

Claims (1)

【実用新案登録請求の範囲】 (1) はんだ槽内にてポンプから圧送される溶融
はんだがノズルから噴流され、この噴流はんだに
よつて前記ノズル上の被はんだ付け物にはんだ付
けがなされる噴流式はんだ付け装置において、 前記ノズルの内側に、断面略コ字状の複数の整
流板をノズル内のはんだ流路が蛇行するように組
合せて設けたことを特徴とする噴流式はんだ付け
装置。 (2) 前記整流板は、多孔板により形成したこと
を特徴とする実用新案登録請求の範囲第１項記載
の噴流式はんだ付け装置。[Claims for Utility Model Registration] (1) Molten solder pumped from a pump in a soldering tank is jetted from a nozzle, and the solder jet is used to solder an object on the nozzle to be soldered. A jet type soldering apparatus, characterized in that a plurality of rectifying plates each having a substantially U-shaped cross section are provided inside the nozzle in combination so that a solder flow path within the nozzle meanders. (2) The jet soldering apparatus according to claim 1, wherein the current plate is formed of a perforated plate.
JP1987102110U 1987-07-02 1987-07-02 Expired - Lifetime JPH0534849Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987102110U JPH0534849Y2 (en) 1987-07-02 1987-07-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987102110U JPH0534849Y2 (en) 1987-07-02 1987-07-02

Publications (2)

Publication Number Publication Date
JPS6410361U true JPS6410361U (en) 1989-01-19
JPH0534849Y2 JPH0534849Y2 (en) 1993-09-03

Family

ID=31331713

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987102110U Expired - Lifetime JPH0534849Y2 (en) 1987-07-02 1987-07-02

Country Status (1)

Country Link
JP (1) JPH0534849Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110385498A (en) * 2018-04-20 2019-10-29 欧姆龙株式会社 Jet type welding apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS561264A (en) * 1979-06-14 1981-01-08 Matsushita Electric Ind Co Ltd Soldering device
JPS6141459U (en) * 1984-08-18 1986-03-17 クラリオン株式会社 Jet flow automatic soldering device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55114042A (en) * 1979-02-23 1980-09-03 Nec Corp Training sequence discrimination circuit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS561264A (en) * 1979-06-14 1981-01-08 Matsushita Electric Ind Co Ltd Soldering device
JPS6141459U (en) * 1984-08-18 1986-03-17 クラリオン株式会社 Jet flow automatic soldering device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110385498A (en) * 2018-04-20 2019-10-29 欧姆龙株式会社 Jet type welding apparatus
JP2019188416A (en) * 2018-04-20 2019-10-31 オムロン株式会社 Jet soldering device

Also Published As

Publication number Publication date
JPH0534849Y2 (en) 1993-09-03

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