JPH0314063U - - Google Patents
Info
- Publication number
- JPH0314063U JPH0314063U JP7378789U JP7378789U JPH0314063U JP H0314063 U JPH0314063 U JP H0314063U JP 7378789 U JP7378789 U JP 7378789U JP 7378789 U JP7378789 U JP 7378789U JP H0314063 U JPH0314063 U JP H0314063U
- Authority
- JP
- Japan
- Prior art keywords
- overflow ports
- solder solution
- soldering
- overflowing
- quantitatively
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第1図は本考案噴流式はんだ付け装置の一例を
その動作と共に示す構成図、第2図は本考案にか
かるノズル部の構成の一例を示す斜視図、第3図
は第2図に示すノズル部からのはんだ溶液の溢出
状態をP方向から見て示す説明図、第4図は従来
のはんだ付けの一例としてフローメータのターミ
ナルに対しはんだこてではんだ付けを実施する例
を示す説明図、第5図は第4図に示すターミナル
部分の詳細図、第6図は平坦なノズル口からのは
んだ溶液の溢出状態を示す説明図である。
10……噴流式はんだ付け装置、11……はん
だ槽、12……はんだ溶液、13……溶液循環系
部材、14……ノズル部、14A……ノズル口、
16……ベーン、17……モータ、20……分離
部材、21……フローメータ(被はんだ付け部材
)。
Fig. 1 is a configuration diagram showing an example of the jet soldering device of the present invention along with its operation, Fig. 2 is a perspective view showing an example of the configuration of the nozzle section of the invention, and Fig. 3 is the nozzle shown in Fig. 2. FIG. 4 is an explanatory diagram showing an example of conventional soldering in which a terminal of a flow meter is soldered with a soldering iron. FIG. 5 is a detailed view of the terminal portion shown in FIG. 4, and FIG. 6 is an explanatory view showing how the solder solution overflows from the flat nozzle opening. 10... Jet soldering device, 11... Solder bath, 12... Solder solution, 13... Solution circulation system member, 14... Nozzle section, 14A... Nozzle opening,
16... Vane, 17... Motor, 20... Separation member, 21... Flow meter (soldering member).
Claims (1)
数の溢出口のそれぞれから溶融したはんだ溶液を
定量的に溢出可能なノズル口と、該ノズル口から
前記はんだ溶液を定量的に溢出させる手段とを具
え、表面張力により前記溢出口のそれぞれから盛
上がつた状態に保たれる前記はんだ溶液の液流に
被はんだ付け部材の複数のはんだ付け部分を対応
させて接触させ、はんだ付けを行うようにしたこ
とを特徴とする噴流式はんだ付け装置。 A nozzle port which is separated into a plurality of overflow ports by a dividing member and is capable of quantitatively overflowing a molten solder solution from each of the plurality of overflow ports, and means for quantitatively overflowing the solder solution from the nozzle port. and a plurality of soldering parts of a member to be soldered are brought into contact with the flow of the solder solution which is maintained in a raised state from each of the overflow ports due to surface tension, thereby performing soldering. A jet soldering device that is characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7378789U JPH0314063U (en) | 1989-06-24 | 1989-06-24 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7378789U JPH0314063U (en) | 1989-06-24 | 1989-06-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0314063U true JPH0314063U (en) | 1991-02-13 |
Family
ID=31612902
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7378789U Pending JPH0314063U (en) | 1989-06-24 | 1989-06-24 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0314063U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52163035U (en) * | 1976-05-31 | 1977-12-10 | ||
JPS52163036U (en) * | 1976-05-31 | 1977-12-10 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5853184B2 (en) * | 1975-03-17 | 1983-11-28 | 日産自動車株式会社 | Engine fuel control device and its adjustment method |
JPS6261773A (en) * | 1985-09-09 | 1987-03-18 | Toshio Hiji | Solder tank device for soldering |
JPH01113169A (en) * | 1987-10-23 | 1989-05-01 | Tokin Corp | Method for soldering pin terminal of electronic part |
-
1989
- 1989-06-24 JP JP7378789U patent/JPH0314063U/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5853184B2 (en) * | 1975-03-17 | 1983-11-28 | 日産自動車株式会社 | Engine fuel control device and its adjustment method |
JPS6261773A (en) * | 1985-09-09 | 1987-03-18 | Toshio Hiji | Solder tank device for soldering |
JPH01113169A (en) * | 1987-10-23 | 1989-05-01 | Tokin Corp | Method for soldering pin terminal of electronic part |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52163035U (en) * | 1976-05-31 | 1977-12-10 | ||
JPS52163036U (en) * | 1976-05-31 | 1977-12-10 | ||
JPS5720040Y2 (en) * | 1976-05-31 | 1982-04-28 |
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