JPS6261773A - Solder tank device for soldering - Google Patents

Abstract

PURPOSE:To prevent the liquid level coating of oxidized layer and to adhere a trace quantity of solder correctly to the prescribed place by providing the overflow pass extending to the horizontal direction at the upper end part of a conduit path, by releasing the upper face of the tip part thereof and by forming the side end edge of the said released face sharply. CONSTITUTION:A melted solder 2 is press-fed from a suction port 6 to a conduit path 3 with its suction by operating the pump 4 providing a tank 1 and is overflowed from the outlet port 9b to the tank 1 via the part 9B extending in the horizontal direction of an overflow pass 9. The soldering is performed by dipping the metal needle P around which a coil C is twined, in case of a solenoid S, in the flow of the solder 2 on the releasing face 12 which is not covered by the cover plate 10 of the part 9B. The adhesion and deposition of oxides are checked even in case of the solder 2 coming into contact with the atmosphere on the released face 12 being oxidized by sharply forming the end edge 11 of the cover body directing for the released face 12. And it is preferable to form the passage area of the pass 9 smaller than the conduit path 3.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a five-solder bath device that performs soldering by immersion in molten solder, and includes a coil,
Used to connect electrical equipment such as electronic parts and other items.

For example, in the process of producing Tsuremade, which consists of winding a coil made of enamel-coated wire around a synthetic resin cylinder and soldering both ends to metal needles protruding from the cylinder, both ends of the coil are connected to metal needles. The semi-finished product soaked in water is coated with paste using an automatic working machine, and then undulated.

It is automatically transferred to each work position such as inspection.

Automatic work is being carried out.

In this process, the soldering work requires accurately adhering a small amount of solder to a predetermined location on a semi-finished product that is mechanically fed to a predetermined location, and the solder is applied to a large number of semi-finished products one after another. Therefore, soldering is performed by immersing only designated areas in molten solder.
method is adopted. In this case, the surface of the molten powder will come into contact with the atmosphere and form an oxidized layer, so if it is not left as it is, it will
It is impossible to attach the

Usually, a jet method is used.

In the jet method, as shown in the embodiment of the present invention in FIG.
By operating the pump 4 installed at the bottom of the conduit 3 from near the bottom to slightly above the surface 2a of the molten solder 2 with the prime mover 5, unoxidized molten solder 2 is spouted and overflowed from the upper end opening of the conduit 3. It is configured so that it flows,
This overflowing molten solder is made to adhere. however.

The upper end opening 3a of the conventional conduit 3 is simply opened upward as shown in FIG. Not only is it affected by pressure pulsations and it moves up and down, making it unstable, making it impossible to expect accurate soldering, but since it is exposed to the atmosphere over a fairly large area, it tends to form an oxidized layer, which must be removed between jobs. There is a hassle of having to do this.

The present invention is a jet-type solder bath device for soldering, in which the molten solder jetting out from the conduit maintains a stable liquid level without being subjected to pressure pulsations from the pump, and accurately attaches a small amount of solder to a predetermined location. It is an object of the present invention to provide a soldering device that allows soldering to be carried out without causing an oxide layer to cover the liquid level.

In order to solve the above problems and achieve the above objectives,
A soldering tank device for soldering, in which a conduit in which a pump is installed is provided in a cypress housing molten solder, and the molten solder pumped through the conduit by the pump overflows above the molten solder surface of the tank. A laterally extending overflow passage is provided at the upper end of the conduit, and the laterally extending overflow passage has an open top end and a closed top surface of the laterally extending portion. The edge of the wall portion on the open surface side is formed into a sharp shape.

Embodiments of the present invention will be described based on the drawings.

The outline of the apparatus shown in FIG. 1 is as described above, and the molten solder 2 sucked in from the suction port 6 opened at the bottom of the pump 4 is heated by an electric heating system placed at the bottom of the tank 1. The molten state is maintained by the vessel 7.

The conduit 3 is formed into an L-shape, and a block body 8 is tightly fitted into and fixed to the upwardly rising upper end of the conduit 3, as if inserted into a stopper. As shown in FIG. 2.3, this block body 8 is comprised of a vertically extending portion 9A and a laterally extending portion 9B, with an inlet 9& communicating with the conduit 3 and an outlet. Two overflow passages 9, 9b of which are laterally open, are provided in parallel. and,
The upper surface of the portion 9B extending in the lateral direction, except for the portion near the outlet 9b at the tip, is covered by a cover plate 10 stacked on the block body 8, and the edge 1) of the wall portion consisting of this cover plate 10 on the outlet side is It is shaped diagonally forward and downward and has a sharp point.

In this embodiment having such a configuration, the pump 4 is operated to pump unoxidized molten solder 2 from the suction port 6 to the conduit 3.
When the molten solder 2 is sucked in, pressurized, and pumped, the molten solder 2 flows into the conduit 3.
Two overflow passages with a smaller passage area than this 9.9
The water enters the tank, overflows from the outlet 9b into the tank l, and returns.

Soldering is performed on the open surface IHc of the laterally extending portion 9B which is not covered by the cover plate 10. FIG. 4 is a perspective view illustrating the situation, in which a coil C made of enamel-coated wire is wound around a cylindrical body T made of synthetic resin.

The semi-finished product of the solenoid S, whose both ends are entwined with a metal needle P protruding from the cylindrical body, is moved downward.

The metal needles P at both ends are immersed in two streams of melting powder and powder 2 from the open surface 12, and the entangled enamel coating of the coil C is melted and removed by heat, and the powder is attached and pulled up. The coil C and the metal needle P are fixed and electrically connected to each other by an attached solder.

FIG. 5 shows a different embodiment of the overflow passage 9, in which two parallel overflow passages 9 provided in the block body 8 each have one vertically extending portion 9^ and two opposite overflow passages 9. It has a laterally extending portion 9B, and an open surface 12 at the tip.
The end edge 1) of the lid 10 is formed into a sharp point. According to this configuration, the solenoids S can be soldered two at a time.

FIG. 6 shows a further embodiment of the overflow passage 9, in which the laterally extending portions 9B of the two overflow passages 9 are formed in opposite directions, and the respective open surfaces 12
The end edge 1) of the lid body 10 facing toward is formed into a sharp shape. According to this configuration, in addition to the solenoid S, two items to be soldered at only one location can be soldered at the same time.

FIG. 7.8 shows a further different embodiment of the overflow passage 9, in which the overflow passage 9 consists of only a portion 9B at the upper end of the conduit 3 which has a smaller passage area and extends laterally.
are integrally formed, and the edge 1) of the wall portion 13 that closes off the upper surface of the overflow passage 9 on the open surface 12 side is formed into a sharp shape.

The overflow passage 9 can have any cross-sectional shape, for example, a rectangular shape as shown in FIG.

゛Can be semicircular or triangular. Also.

The edge 1) of the wall part does not have to be knife-like (9).
For example, it can be rounded as shown in FIG. 10 (At (Bl) or have a trapezoidal cross section.

Note that the number of overflow passages 9 is not limited to one or two, but three or more can be provided depending on the items to be soldered, the structure of the automatic working machine, etc.

According to the present invention, in a jet type soldering bath device in which molten solder is forced to flow through a conduit by a pump, an overflow passage extending laterally is provided at the upper end of the conduit, and the open surface at the top of the tip is utilized. Since the product was heated for 5K by dipping a predetermined part of the product into the molten solder, when the molten solder in the conduit moves up and down due to pressure pulsations from the pump, the molten solder flowing laterally through the overflow passage will move upward and downward. affected ℃
Even if the flow rate fluctuates, the liquid level on the open surface will not move up or down (therefore, a stable liquid level can be maintained and a minute amount of solder can be deposited accurately at a predetermined location. Since the edge of the wall of the overflow passage on the open surface side is formed into a sharp shape, even if the molten solder exposed to the atmosphere on the open surface oxidizes, oxides will not adhere and accumulate. It does not cause the inconvenience of an oxide layer covering the open surface and making soldering impossible, and is suitable for soldering work using an automatic working machine.

It should be noted that if the passage area of the overflow passage is made smaller than that of the conduit passage as in the illustrated embodiment, there is an advantage that the molten solder flows at a high speed and is less likely to oxidize on the open surface.

[Brief explanation of the drawing]

Fig. 1 is a schematic cross-sectional view of a fir tree according to an embodiment of the present invention, Fig. 2 is an enlarged partial view of its main parts, Fig. 3 is a plan view of Fig. 2, and Fig. 4 is a perspective view explaining the soldering situation. Figures 5 and 6 are plan views showing different embodiments of the overflow passage, respectively;
FIG. 7 is a longitudinal sectional view of yet another embodiment of the overflow passage;
The figure is a side view of Figure 7, Figure 9 is a diagram showing the shape of the overflow passage, Figure 10 is a diagram showing the edge shape of the wall part, and Figure 1) is a vertical cross-section of the upper end of the conventional conduit. It is a front view. 1... Tank, 3... Conduit, 4...
··pump. 8...Block body, 9...Overflow passage +
9A...portion extending in the vertical direction +9B...
・Part extending in the horizontal direction, 10...Lid plate, 1)
...Edge, 12...Open surface, 13...
...Wall part. Figure λ

Claims (3)

[Claims] (1) For soldering, where a conduit in which a pump is installed is provided in a tank in which molten solder is stored, and the molten solder pumped through the conduit by the pump overflows above the molten solder surface of the tank. In the solder bath device, a laterally extending overflow passage is provided at the upper end of the conduit, and the laterally extending overflow passage has an open top end and an upper surface of the laterally extending portion. 1. A soldering bath device for soldering, characterized in that an edge of the closed wall portion on the open surface side is formed into a sharp shape. (2) The device according to claim (1), wherein the overflow passage has a smaller passage area than the conduit. (3) The device according to claim (1), wherein the overflow passage is formed in a block fixed to the upper end of the conduit.