JPS59189069A - Device and method for coating solder on terminal - Google Patents

Device and method for coating solder on terminal

Info

Publication number
JPS59189069A
JPS59189069A JP6437283A JP6437283A JPS59189069A JP S59189069 A JPS59189069 A JP S59189069A JP 6437283 A JP6437283 A JP 6437283A JP 6437283 A JP6437283 A JP 6437283A JP S59189069 A JPS59189069 A JP S59189069A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
solder
plate
terminals
parts
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6437283A
Other versions
JPS6243784B2 (en )
Inventor
Takamichi Fukuya
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/08Soldering by means of dipping in molten solder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions ; Methods of application thereof

Abstract

PURPOSE:To provide a titled device which coats satisfactorily solder on terminal parts by inserting the terminals of parts to the combination of a liquid draining plate having holes for inserting the terminal parts and poor wettability and a strip plate, brazing the terminals by a solder liquid and allowing the solder liquid to ascend along the strip plate. CONSTITUTION:A strip plate 11 is superposed, with sliding pins 13 as a guide, on a liquid draining plate 12 which is formed of titanium, tungsten, aluminum, etc. having poor wettability with solder and has holes 17 for inserting terminals of electronic parts. Terminals 18 of the electronic parts of which the surfaces are preliminarily activated by a flux, etc. are inserted into the holes 17 and are dipped in a solder liquid 5. The ascent of the solder material to the unnecessary part is prevented by the plate 12 having poor wettability so that the solder material ascends along the strip plate 11 having projecting parts 16. The excess brazing material is wiped away and the solder is coated on the terminals 18 in a satisfactory condition. The plate 12 prevents contamination of the electronic parts 2 by solder.
JP6437283A 1983-04-12 1983-04-12 Expired JPS6243784B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6437283A JPS6243784B2 (en) 1983-04-12 1983-04-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6437283A JPS6243784B2 (en) 1983-04-12 1983-04-12

Publications (2)

Publication Number Publication Date
JPS59189069A true true JPS59189069A (en) 1984-10-26
JPS6243784B2 JPS6243784B2 (en) 1987-09-16

Family

ID=13256387

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6437283A Expired JPS6243784B2 (en) 1983-04-12 1983-04-12

Country Status (1)

Country Link
JP (1) JPS6243784B2 (en)

Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4739919A (en) * 1987-06-15 1988-04-26 Northern Telecom Limited Masking of circuit boards for wave soldering
JPH0235450U (en) * 1988-08-30 1990-03-07
US6476487B2 (en) 1992-10-30 2002-11-05 Showa Denko K.K. Solder circuit
US9095074B2 (en) 2012-12-20 2015-07-28 Invensas Corporation Structure for microelectronic packaging with bond elements to encapsulation surface
US9093435B2 (en) 2011-05-03 2015-07-28 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US9646917B2 (en) 2014-05-29 2017-05-09 Invensas Corporation Low CTE component with wire bond interconnects
US9659848B1 (en) 2015-11-18 2017-05-23 Invensas Corporation Stiffened wires for offset BVA
US9685365B2 (en) 2013-08-08 2017-06-20 Invensas Corporation Method of forming a wire bond having a free end
US9691731B2 (en) 2011-05-03 2017-06-27 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US9691679B2 (en) 2012-02-24 2017-06-27 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US9728527B2 (en) 2013-11-22 2017-08-08 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9735084B2 (en) 2014-12-11 2017-08-15 Invensas Corporation Bond via array for thermal conductivity
US9761558B2 (en) 2011-10-17 2017-09-12 Invensas Corporation Package-on-package assembly with wire bond vias
US9761554B2 (en) 2015-05-07 2017-09-12 Invensas Corporation Ball bonding metal wire bond wires to metal pads
US9812402B2 (en) 2015-10-12 2017-11-07 Invensas Corporation Wire bond wires for interference shielding
US9837330B2 (en) 2014-01-17 2017-12-05 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
US9842745B2 (en) 2012-02-17 2017-12-12 Invensas Corporation Heat spreading substrate with embedded interconnects
US9852969B2 (en) 2013-11-22 2017-12-26 Invensas Corporation Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
US9888579B2 (en) 2015-03-05 2018-02-06 Invensas Corporation Pressing of wire bond wire tips to provide bent-over tips
US9911718B2 (en) 2015-11-17 2018-03-06 Invensas Corporation ‘RDL-First’ packaged microelectronic device for a package-on-package device
US9917073B2 (en) 2012-07-31 2018-03-13 Invensas Corporation Reconstituted wafer-level package dram with conductive interconnects formed in encapsulant at periphery of the package
US9935075B2 (en) 2016-07-29 2018-04-03 Invensas Corporation Wire bonding method and apparatus for electromagnetic interference shielding
US9947641B2 (en) 2014-05-30 2018-04-17 Invensas Corporation Wire bond support structure and microelectronic package including wire bonds therefrom
US9953914B2 (en) 2012-05-22 2018-04-24 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US9984901B2 (en) 2005-12-23 2018-05-29 Tessera, Inc. Method for making a microelectronic assembly having conductive elements
US9984992B2 (en) 2015-12-30 2018-05-29 Invensas Corporation Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
US10008469B2 (en) 2015-04-30 2018-06-26 Invensas Corporation Wafer-level packaging using wire bond wires in place of a redistribution layer
US10008477B2 (en) 2013-09-16 2018-06-26 Invensas Corporation Microelectronic element with bond elements to encapsulation surface
US10026717B2 (en) 2013-11-22 2018-07-17 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US10115678B2 (en) 2017-11-06 2018-10-30 Invensas Corporation Wire bond wires for interference shielding

Cited By (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4739919A (en) * 1987-06-15 1988-04-26 Northern Telecom Limited Masking of circuit boards for wave soldering
JPH0235450U (en) * 1988-08-30 1990-03-07
US6476487B2 (en) 1992-10-30 2002-11-05 Showa Denko K.K. Solder circuit
US9984901B2 (en) 2005-12-23 2018-05-29 Tessera, Inc. Method for making a microelectronic assembly having conductive elements
US10062661B2 (en) 2011-05-03 2018-08-28 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US9093435B2 (en) 2011-05-03 2015-07-28 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US9691731B2 (en) 2011-05-03 2017-06-27 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US9761558B2 (en) 2011-10-17 2017-09-12 Invensas Corporation Package-on-package assembly with wire bond vias
US9842745B2 (en) 2012-02-17 2017-12-12 Invensas Corporation Heat spreading substrate with embedded interconnects
US9691679B2 (en) 2012-02-24 2017-06-27 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US9953914B2 (en) 2012-05-22 2018-04-24 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US9917073B2 (en) 2012-07-31 2018-03-13 Invensas Corporation Reconstituted wafer-level package dram with conductive interconnects formed in encapsulant at periphery of the package
US9095074B2 (en) 2012-12-20 2015-07-28 Invensas Corporation Structure for microelectronic packaging with bond elements to encapsulation surface
US9615456B2 (en) 2012-12-20 2017-04-04 Invensas Corporation Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface
US9685365B2 (en) 2013-08-08 2017-06-20 Invensas Corporation Method of forming a wire bond having a free end
US10008477B2 (en) 2013-09-16 2018-06-26 Invensas Corporation Microelectronic element with bond elements to encapsulation surface
US9852969B2 (en) 2013-11-22 2017-12-26 Invensas Corporation Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
US9728527B2 (en) 2013-11-22 2017-08-08 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US10026717B2 (en) 2013-11-22 2018-07-17 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9837330B2 (en) 2014-01-17 2017-12-05 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
US10032647B2 (en) 2014-05-29 2018-07-24 Invensas Corporation Low CTE component with wire bond interconnects
US9646917B2 (en) 2014-05-29 2017-05-09 Invensas Corporation Low CTE component with wire bond interconnects
US9947641B2 (en) 2014-05-30 2018-04-17 Invensas Corporation Wire bond support structure and microelectronic package including wire bonds therefrom
US9735084B2 (en) 2014-12-11 2017-08-15 Invensas Corporation Bond via array for thermal conductivity
US9888579B2 (en) 2015-03-05 2018-02-06 Invensas Corporation Pressing of wire bond wire tips to provide bent-over tips
US10008469B2 (en) 2015-04-30 2018-06-26 Invensas Corporation Wafer-level packaging using wire bond wires in place of a redistribution layer
US9761554B2 (en) 2015-05-07 2017-09-12 Invensas Corporation Ball bonding metal wire bond wires to metal pads
US9812402B2 (en) 2015-10-12 2017-11-07 Invensas Corporation Wire bond wires for interference shielding
US9911718B2 (en) 2015-11-17 2018-03-06 Invensas Corporation ‘RDL-First’ packaged microelectronic device for a package-on-package device
US10043779B2 (en) 2015-11-17 2018-08-07 Invensas Corporation Packaged microelectronic device for a package-on-package device
US9659848B1 (en) 2015-11-18 2017-05-23 Invensas Corporation Stiffened wires for offset BVA
US9984992B2 (en) 2015-12-30 2018-05-29 Invensas Corporation Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
US9935075B2 (en) 2016-07-29 2018-04-03 Invensas Corporation Wire bonding method and apparatus for electromagnetic interference shielding
US10115678B2 (en) 2017-11-06 2018-10-30 Invensas Corporation Wire bond wires for interference shielding

Also Published As

Publication number Publication date Type
JPS6243784B2 (en) 1987-09-16 grant

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