JPS59189069A - Device and method for coating solder on terminal - Google Patents

Abstract

PURPOSE:To provide a titled device which coats satisfactorily solder on terminal parts by inserting the terminals of parts to the combination of a liquid draining plate having holes for inserting the terminal parts and poor wettability and a strip plate, brazing the terminals by a solder liquid and allowing the solder liquid to ascend along the strip plate. CONSTITUTION:A strip plate 11 is superposed, with sliding pins 13 as a guide, on a liquid draining plate 12 which is formed of titanium, tungsten, aluminum, etc. having poor wettability with solder and has holes 17 for inserting terminals of electronic parts. Terminals 18 of the electronic parts of which the surfaces are preliminarily activated by a flux, etc. are inserted into the holes 17 and are dipped in a solder liquid 5. The ascent of the solder material to the unnecessary part is prevented by the plate 12 having poor wettability so that the solder material ascends along the strip plate 11 having projecting parts 16. The excess brazing material is wiped away and the solder is coated on the terminals 18 in a satisfactory condition. The plate 12 prevents contamination of the electronic parts 2 by solder.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus and method for applying solder to a terminal of a mechanical component, and when the terminal part is immersed in a molten solder liquid, the bridge of solder between the terminals and the solder applied to the terminal are To provide a solder cloth device and a method for applying solder which can obtain a uniform solder height and coating thickness without thickening of the solder, and without flying or adhering the solder to areas other than terminal parts. With the goal.

Hereinafter, the present invention will be explained based on the drawings.

Figures 1 to 3 show a conventional example, where (1) is a component support line, which is attached to the mounting base, and a 1L gas component (2) is placed on the component support line (1), and elution is performed. ...In Noda liquid (5),
Remove the l'jul connector (3) coated with flux (4) (see Figure 2), or solder Ij! All parts except the part to be clothed were immersed and soldered and soldered to the terminal part (3).

However, in these methods, molten solder liquid (5)
When immersed in the liquid, the bottom surface of the parts other than the terminal part (3) to be soldered is exposed as shown in Fig. 3, and solder particles (i6) are also formed on the surface other than the terminal part during immersion. This may cause poor conduction, etc. Furthermore, these methods also have differences in the surface activity of the terminal surfaces, dipping direction, and welding 1@! Due to disturbances in solder/metal liquid, solder bridges between terminals (7) and solder thickening on crystals (8) tend to occur, and the height of the solder rises often varies. The present invention has been made in consideration of these points, and its feature is that after an electrical component is placed on a liquid cutter plate having a plurality of small holes through which terminals can be inserted into the small holes, After being immersed in the molten solder, a strip plate that is movable up and down relative to the liquid cutter plate is pulled.The second step is to pull up the Y width portion from the small hole in the liquid cutter plate.

4 to 9 show examples of the present invention. Note that, in these drawings, the same members as those in the prior art are designated by the same reference numerals, and the description thereof will be omitted.

FIG. 4 shows an example of a device according to the invention, in which 02 is an electric g
It is a liquid cutting plate having a plurality of small holes q into which the terminal part (8) of the 4S product (2) can be inserted, and slide bins 03 are installed at the upper four corners. (111 is a strip plate, and its four corners are provided with engagement holes 14) that engage with the slide pins 3 described in F)'lI and allow the strip plate (11) to move up and down. . String 1,1 knob plate ul) has 11″
Hole (l) into which all terminal parts (3) of L parts (2) are inserted.
A hole 05 is drilled, and a protrusion α (
9 is set so that the electrical component (2) will get caught. The cutting plate is made of a material with poor solderability, such as titanium, tungsten, aluminum, or Teflon-coated metal.

Next, the soldering method will be explained.

First, the slide pin (19 and the retaining hole 114) are engaged, and the liquid cutter plate (one and the strip 4htill) are engaged.
From above, place the soldered 'r+': gas part 2) on the y:i'1 child part (3) into the small hole α'I), and press the liquid drain (from 12 onwards). , make sure that only the part of the terminal to which you want to apply solder is exposed. (See Figure 5) After activating the surface of the terminal gas (8) with flux (4) etc., apply solder to the molten surface I (5). When immersed in the solder, the soldering liquid will form a small hole αη due to
It penetrates only at a certain height of solder rising height of 08 cm and is pushed back. In fact, scattering pieces of solder caused by sudden changes in the surface temperature of the solder liquid or transient reactions with the flux during immersion are blocked by the liquid cutter and do not adhere to anything other than the terminals of electrical components. Then, when immersed, by separating the strip plate Uυ from the liquid September anti-σ, the hole in the liquid cutting plate vr is removed. When you remove it from the J-ri,
Excess solder applied to the terminals is wiped off from the 1-year-old liquid solder. After this, by lifting the entire device 6 from the bath melting solder liquid level, it is easy to obtain a uniform solder rise D/゛7 area without bridges between solder terminals or thickening. It will be done.

The present invention has the great advantage of allowing good hunter application with a very simple installation and in a very simple manner.

[Brief explanation of drawings]

Figure 1 shows an overview of an example of a conventional device. Figures 2 and 3 show examples of the conventional method. Figure 2 shows the state before immersion in solder liquid, Figures 3 (a) and (b) show the state after solder liquid M IJT, and (a) shows the state after immersion in solder liquid. Wound view, (b) is a front view. FIG. 4 shows an overview of an example of the device 1 of the present invention. 5 to 8, FIG. 5(a) is an explanatory diagram showing an example of the method according to the present invention, and is before immersion in solder liquid. Figure 6 shows a little more than one immersed in solder liquid, and Figure 7 shows how the strip plate is pulled out from the liquid cutting plate.
Figure 8 shows the entire device raised above the solder liquid level. (1): Parts supply? # line (2):'l! Parts (8): 'j#, i part (4): Flux (5): Solder #I powder (6): Solder grains (
7) Ni bridge (8): Thick solder (old) solder, plate υ: Liquid cutting plate 03 Ni slide pin 114): Engagement hole α6: Hole
(li9° protrusion 071: small hole θ
Dirt: Solder build-up, island/section 2 Figure 3 (θ) <b) Figure 4 I Figure 73-1

Claims (2)

[Claims] (1) A liquid cutting plate having multiple small holes into which terminal parts can be inserted;
Solder application and installation of terminals consisting of a strip plate installed movably up and down with respect to the Ida cutting plate. (2) The terminal part is inserted into the small hole of the liquid cutter plate, immersed in the molten solder liquid, and then the strip plate is pulled up and the terminal part is pulled up from the small hole of the liquid cutter plate. ::(How to apply Child Hunter.