JPH05259632A - Printed wiring board and manufacture thereof - Google Patents
Printed wiring board and manufacture thereofInfo
- Publication number
- JPH05259632A JPH05259632A JP5159392A JP5159392A JPH05259632A JP H05259632 A JPH05259632 A JP H05259632A JP 5159392 A JP5159392 A JP 5159392A JP 5159392 A JP5159392 A JP 5159392A JP H05259632 A JPH05259632 A JP H05259632A
- Authority
- JP
- Japan
- Prior art keywords
- solder layer
- solder
- lead
- tin
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、エレクトロニクス機
器に用いるプリント配線板に関し、特に表面装着部品を
両面にはんだ付けするプリント配線板およびその製造方
法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board used in electronic equipment, and more particularly to a printed wiring board having surface-mounted components soldered on both sides and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】従来、両面へのリフローはんだ付け用の
プリント配線板には、金，銀，銅，ニッケル等からなる
箔状の導体パターンがはんだ付けランドとして用いられ
ている。そして、はんだの材料としては、被はんだ付け
性を高めるために、錫−鉛系はんだ（錫−鉛 63/37,60/
40）の共晶または共晶に近い溶融温度をもつものが用い
られてきた。なお、デイップはんだ付け用のはんだや表
面実装部品の電極のコート用はんだなどの材料も大部分
が同様である。これらのはんだ材料が汎用であることの
理由は、作業温度，価格，信頼性などに求められる。2. Description of the Related Art Conventionally, a foil-shaped conductor pattern made of gold, silver, copper, nickel or the like has been used as a soldering land in a printed wiring board for reflow soldering on both sides. And as the material of the solder, tin-lead solder (tin-lead 63 / 37,60 /
A eutectic of 40) or one having a melting temperature close to that of eutectic has been used. Most of the materials such as the solder for dip soldering and the solder for coating the electrode of the surface mount component are similar. The reason why these solder materials are used in general is required for working temperature, price, reliability and the like.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら上記従来
の両面へのリフローはんだ付け用のプリント配線板に、
まずＡ面（一面）へのはんだ付けを行い、つぎにＢ面
（他面）へのはんだ付けを行って部品を装着する場合、
はんだの接合強度が低下する。すなわち、Ａ面の導体パ
ターン（はんだ付けランド）に一定の加熱温度ではんだ
接合を行った後、同じ加熱温度でＢ面の導体パターンに
はんだ接合を行うと、Ａ面のはんだが再溶融し、Ａ面の
はんだ接合強度が低下し、部品の位置ずれや落下が生
じ、また、長期信頼性も大幅に低下する。However, in the above-mentioned conventional printed wiring board for reflow soldering on both sides,
When soldering to surface A (one surface) first and then to surface B (other surface) to mount components,
The solder joint strength is reduced. That is, when solder bonding is performed on the conductor pattern (solder land) on the A surface at a constant heating temperature and then solder bonding is performed on the conductor pattern on the B surface at the same heating temperature, the solder on the A surface is remelted, The solder joint strength of the surface A is reduced, the components are displaced or dropped, and the long-term reliability is also significantly reduced.
【０００４】これを解決する方法として、はんだ接合時
の加熱温度（作業温度）の異なるはんだ材料をＡ面とＢ
面に用いることが考えられる。しかし、現状では、１０
０〜３００℃に融点のある軟ろう合金は限られている。
例えば、錫−鉛二元合金にカドミウムかビスマスを用い
たはんだは、約１４５℃の作業温度となるが、高価格な
うえに、はんだ付け性，接合強度の保全信頼性がよくな
い。また、錫−銀合金では、３１０℃の作業温度とな
り、共晶ではないが錫−鉛（90/10 ）合金も２８５℃の
作業温度となり、いずれも作業温度として高すぎるもの
である。はんだ付けの作業温度としては、プリント配線
板の絶縁素体と、それに被着される導体の耐熱接着との
両要件によって、２００〜２６０℃の範囲内に限定され
るとみてよい。As a method for solving this, solder materials having different heating temperatures (working temperatures) at the time of solder joining are used for A surface and B surface.
It can be used for the surface. However, at present, 10
Soft brazing alloys with a melting point of 0 to 300 ° C are limited.
For example, a solder using cadmium or bismuth as a tin-lead binary alloy has a working temperature of about 145 ° C., but it is expensive, and the solderability and the joint reliability of joint strength are not good. Further, the tin-silver alloy has a working temperature of 310 ° C., and the tin-lead (90/10) alloy, which is not a eutectic, also has a working temperature of 285 ° C., both of which are too high working temperatures. The working temperature of soldering may be limited to the range of 200 to 260 ° C. depending on both requirements of the insulating element of the printed wiring board and the heat resistant adhesion of the conductor adhered thereto.
【０００５】他の解決方法として、両面リフローはんだ
付けを、同時両面リフロー方式により、同組成のはんだ
を両面に用いて同時加熱で行うことが試みられている
が、下面の部品が離脱し易く、接着剤の追加印刷を必要
としていた。この発明の目的は、両面に装着する部品の
はんだ接合強度を向上させ、部品の位置づれや落下を防
止できるプリント配線板およびその製造方法を提供する
ことである。As another solution, it has been attempted to carry out double-sided reflow soldering by simultaneous simultaneous double-sided reflow soldering using the same composition of solder on both sides, but the parts on the lower surface easily come off. Needed additional printing of adhesive. An object of the present invention is to provide a printed wiring board that can improve the solder joint strength of components mounted on both surfaces and prevent the components from being misaligned or dropped, and a method of manufacturing the same.
【０００６】[0006]
【課題を解決するための手段】請求項１記載のプリント
配線板は、一面の導体の上に第１のはんだ層を設け、他
面の導体の上に第２のはんだ層を設け、第１のはんだ層
の融点を第２のはんだ層の融点よりも高くしたことを特
徴とする。請求項２記載のプリント配線板は、請求項１
記載のプリント配線板において、第１のはんだ層を錫の
金属間化合物と鉛との合金とし、第２のはんだ層を錫と
鉛の合金としている。According to a first aspect of the present invention, there is provided a printed wiring board having a first solder layer on a conductor on one surface and a second solder layer on a conductor on the other surface. The melting point of the solder layer is higher than the melting point of the second solder layer. The printed wiring board according to claim 2 is characterized in that
In the printed wiring board described above, the first solder layer is an alloy of an intermetallic compound of tin and lead, and the second solder layer is an alloy of tin and lead.
【０００７】請求項３記載のプリント配線板の製造方法
は、基板の一面と他面の両面に形成したはんだ付けする
ための導体上に同一組成の錫と鉛の合金からなるはんだ
層を形成する工程と、一面に形成したはんだ層に不活性
ガスまたは液体を媒体として加熱処理を行い、一面に形
成したはんだ層を錫の金属間化合物と鉛との合金に変化
させる工程とを含んでいる。In the method of manufacturing a printed wiring board according to a third aspect of the present invention, a solder layer made of an alloy of tin and lead having the same composition is formed on conductors for soldering formed on both one surface and the other surface of the substrate. And a step of subjecting the solder layer formed on one surface to a heat treatment using an inert gas or a liquid as a medium to change the solder layer formed on one surface into an alloy of an intermetallic compound of tin and lead.
【０００８】[0008]
【作用】この発明のプリント配線板によれば、一面の導
体の上に設けた第１のはんだ層（錫の金属間化合物と鉛
との合金）の融点が、他面の導体の上に設けた第２のは
んだ層（錫と鉛の合金）の融点よりも高い。そのため、
部品を装着する際、まず、一面に第１のはんだ層を溶融
して装着部品のはんだ付けを行い、つぎに、一面を下に
して他面に装着部品のはんだ付けを行うとき第２のはん
だ層を溶融させるが、この際の温度で下にした一面の装
着部品の接合部分が溶融することはない。したがって、
装着部品の位置づれや落下もなく、はんだ接合強度が向
上し、長期信頼性が大幅に向上する。According to the printed wiring board of the present invention, the melting point of the first solder layer (an alloy of tin intermetallic compound and lead) provided on the conductor on one surface is provided on the conductor on the other surface. And the melting point of the second solder layer (an alloy of tin and lead). for that reason,
When mounting the component, first, the first solder layer is melted on one surface to solder the mounted component, and then, when the soldered component is soldered on the other surface with one surface facing down, the second solder The layer is melted, but at this temperature the joint portion of the one-side mounted component that is lowered is not melted. Therefore,
Solder joint strength is improved, and long-term reliability is greatly improved, with no misalignment or drop of mounted parts.
【０００９】この発明のプリント配線板の製造方法によ
れば、基板の両面に形成した導体上に同一組成の錫と鉛
の合金からなるはんだ層を形成し、加熱処理により一面
に形成したはんだ層を錫の金属間化合物と鉛との合金に
変化させることにより、一面に形成したはんだ層の融点
が他面に形成したはんだ層の融点よりも高くなる。According to the method for manufacturing a printed wiring board of the present invention, a solder layer made of an alloy of tin and lead having the same composition is formed on conductors formed on both surfaces of a substrate, and the solder layer is formed on one surface by heat treatment. By changing to an alloy of tin intermetallic compound and lead, the melting point of the solder layer formed on one surface becomes higher than the melting point of the solder layer formed on the other surface.
【００１０】[0010]
【実施例】この発明の一実施例を図面に基づいて説明す
る。図１はこの発明の一実施例のプリント配線板の製造
方法を示す工程断面図である。このプリント配線板は、
図１(e) に示すように、基板１の両面に装着部品をはん
だ付けするための銅箔パターンの導体（はんだ付けラン
ド）２を備え、さらに、Ａ面（一面）の導体２の上に錫
の金属間化合物と鉛のはんだ層（第１のはんだ層）５を
設け、Ｂ面（他面）の導体２の上に錫−鉛系（錫−鉛 6
3/37）のはんだ層（第２のはんだ層）４を設け、Ａ面の
はんだ層５の融点（２２７℃）をＢ面のはんだ層４の融
点（１８３℃）よりも高くしている。なお、基板１とし
て、厚さ１．６ｍｍ，寸法５００×５００ｍｍのガラス
布基材エポキシ樹脂を用いている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a process sectional view showing a method for manufacturing a printed wiring board according to an embodiment of the present invention. This printed wiring board
As shown in Fig. 1 (e), copper foil pattern conductors (soldering lands) 2 for soldering mounting components are provided on both sides of the board 1, and further on the A side (one side) conductor 2 An intermetallic compound of tin and a solder layer (first solder layer) 5 of lead is provided, and a tin-lead system (tin-lead 6) is provided on the conductor 2 on the B side (other side).
(3/37) solder layer (second solder layer) 4 is provided, and the melting point (227 ° C.) of the A-side solder layer 5 is set higher than the melting point (183 ° C.) of the B-side solder layer 4. As the substrate 1, a glass cloth base epoxy resin having a thickness of 1.6 mm and dimensions of 500 × 500 mm is used.
【００１１】以下、このプリント配線板の製造方法につ
いて説明する。まず、図１(a) に示す両面に銅箔パター
ンの導体２を形成した基板１を、深いはんだ槽に浸漬
し、錫−鉛系（錫−鉛 63/37）の共晶はんだ３を導体２
にコートする（図１(b) ）。つぎに、２００℃，Ｎ2 に
てエアレベリングを行うことによって、共晶はんだ３を
厚さ２〜５ミクロンの平坦なはんだ層４にする（図１
(c)）。つぎに、Ａ面のはんだ層４に対し２５０℃の加
熱処理を施し、はんだ層４ａとする（図１(d) ）。A method of manufacturing this printed wiring board will be described below. First, as shown in FIG. 1 (a), the substrate 1 on which copper foil pattern conductors 2 are formed on both sides is immersed in a deep solder bath, and a tin-lead type (tin-lead 63/37) eutectic solder 3 is used as a conductor. Two
(Fig. 1 (b)). Next, air leveling is performed at 200 ° C. and N 2 to form the eutectic solder 3 into a flat solder layer 4 having a thickness of 2 to 5 μm (see FIG. 1).
(c)). Next, the soldering layer 4 on the A side is subjected to heat treatment at 250 ° C. to form a soldering layer 4a (FIG. 1 (d)).
【００１２】つぎに、Ｂ面をポリイミド粘着テープでマ
スクするか、Ｎ2 ・Ｈ2 ・アルゴン等を含む雰囲気中で
２５０℃，１０秒間加熱することにより、Ａ面のはんだ
層４ａを形成する組成の錫の全部または相当部分を、錫
の金属間化合物に変質させ、この金属間化合物（主とし
てＣｕ3 Ｓｎ，Ｃｕ6 Ｓｎ5 ）と鉛のはんだ層５を形成
する（図１(e) ）。このはんだ層５の融点は２２７℃と
なった。なお、Ｂ面にポリイミド粘着テープが残ってあ
ればそれを剥離する。Next, a composition for forming the solder layer 4a on the A side by masking the B side with a polyimide adhesive tape or by heating at 250 ° C. for 10 seconds in an atmosphere containing N 2 , H 2 , argon, etc. all or a substantial portion of the tin, is transformed into an intermetallic compound of tin, the intermetallic compound (mainly Cu 3 Sn, Cu 6 Sn 5 ) and forming the solder layer 5 of the lead (Fig. 1 (e)). The melting point of this solder layer 5 was 227 ° C. If the polyimide adhesive tape remains on the B side, peel it off.
【００１３】このように製造された図１(e) に示すプリ
ント配線板に部品を装着する方法について、さらに図２
を参照しながら説明する。図２(a) に示すように、プリ
ント配線板のＡ面に、はんだペースト（錫−鉛 63/37）
６を前記の金属間化合物と鉛のはんだ層５（融点；２２
７℃）上に印刷し、部品７を載置する。つづいて、２６
０±５℃でリフローし、部品７の電極８と導体２とをは
んだ接合する（図２(b) ）。なお、９は電極８と導体２
との接合部である。A method for mounting parts on the printed wiring board shown in FIG. 1 (e) manufactured in this manner will be further described with reference to FIG.
Will be described with reference to. As shown in Fig. 2 (a), solder paste (tin-lead 63/37) is applied to the A side of the printed wiring board.
6 is a solder layer 5 of the above-mentioned intermetallic compound and lead (melting point; 22
7 ° C.) and place component 7. Continuing, 26
Reflow is performed at 0 ± 5 ° C, and the electrode 8 of the component 7 and the conductor 2 are soldered (Fig. 2 (b)). In addition, 9 is the electrode 8 and the conductor 2.
It is a joint with.
【００１４】つぎに、図２(c) に示すように、Ｂ面を上
にして、はんだペースト（錫−鉛 63/37）１２をはんだ
層４（融点；１８３℃）に印刷し、部品１０を載置す
る。つづいて、２１５±２℃でリフローし、部品１０の
電極１１と導体２とをはんだ接合する（図２(d) ）。こ
の際、下面となるＡ面は、融点が２２７℃のはんだ層５
により部品７を接合しているため、接合部９が溶解する
ことはない。なお、１３は電極１１と導体２との接合部
である。Next, as shown in FIG. 2 (c), the solder paste (tin-lead 63/37) 12 is printed on the solder layer 4 (melting point: 183 ° C.) with the B side facing up, and the component 10 is printed. To place. Then, reflow is performed at 215 ± 2 ° C. to solder-bond the electrode 11 of the component 10 and the conductor 2 (FIG. 2 (d)). At this time, the lower surface A is the solder layer 5 having a melting point of 227 ° C.
Since the parts 7 are joined by the above, the joint portion 9 does not melt. In addition, 13 is a joint between the electrode 11 and the conductor 2.
【００１５】表１に、この実施例のプリント配線板（図
１(e) ）および従来のプリント配線板に、装着部品をは
んだ付けした場合の結果を示す。なお、表１において、
第１の従来例は、両面とも同じ組成のはんだ材料によ
り、Ａ面（一面）のはんだ付けを行った後、Ｂ面（他
面）のはんだ付けを行った場合であり、第２の従来例
は、両面とも同じ組成のはんだ材料により、両面同時に
はんだ付けを行った場合である。また、部品脱落率は、
実施例および第１，第２の従来例それぞれ１０２８０個
について、はんだ付け作業中において下面となる部品の
脱落率である。接合強度は、実施例および第１，第２の
従来例それぞれ１０２８０個について、両面に部品を装
着後、１２５℃中において、部品の脱落が５０％に達す
る時間である。Table 1 shows the results when the mounting components were soldered to the printed wiring board of this embodiment (FIG. 1 (e)) and the conventional printed wiring board. In addition, in Table 1,
The first conventional example is a case where the A side (one side) is soldered with the solder material having the same composition on both sides, and then the B side (other side) is soldered, and the second conventional example. Shows the case where both surfaces are simultaneously soldered with the solder material having the same composition. The dropout rate of parts is
It is the dropout rate of the parts which are the lower surface during the soldering work for 10280 pieces of each of the embodiment and the first and second conventional examples. The bonding strength is the time at which the detachment of the components reaches 50% at 125 ° C. after mounting the components on both sides of the 10280 examples and the first and second conventional examples.
【００１６】[0016]
【表１】 [Table 1]
【００１７】表１より、この実施例によれば、第１およ
び第２の従来例に比べ、部品装着中における部品脱落率
は激減し、部品装着後のはんだの接合強度は非常に向上
している。以上のようにこの実施例のプリント配線板
は、Ａ面に融点（２２７℃）の高い金属間化合物と鉛の
はんだ層５を設け、Ｂ面に融点（１８３℃）の低い錫−
鉛系（錫−鉛 63/37）のはんだ層４を設けているため、
まず、Ａ面にはんだ層５を溶融して装着部品のはんだ付
けを行い、つぎに、Ａ面を下にしてＢ面に装着部品のは
んだ付けを行うときはんだ層４を溶融させるが、この際
の温度で下にしたＡ面の装着部品の接合部分が溶融する
ことはない。したがって、装着部品の位置づれや落下も
なく、はんだ接合強度が向上し、長期信頼性が大幅に向
上する。From Table 1, according to this embodiment, the component drop-off rate during component mounting is drastically reduced and the joint strength of the solder after component mounting is greatly improved as compared with the first and second conventional examples. There is. As described above, in the printed wiring board of this embodiment, the solder layer 5 of the intermetallic compound having a high melting point (227 ° C.) and lead is provided on the A surface, and the tin layer having a low melting point (183 ° C.) is provided on the B surface.
Since the lead-based (tin-lead 63/37) solder layer 4 is provided,
First, the solder layer 5 is melted on the A surface to solder the mounted component, and then the solder layer 4 is melted when the mounted component is soldered on the B surface with the A surface facing downward. The joint portion of the mounted component on the side A which is lowered at the temperature of 1 does not melt. Therefore, the solder joint strength is improved and the long-term reliability is significantly improved without any positional deviation or drop of the mounted component.
【００１８】なお、基板１として、厚さ０．０５〜４．
０ｍｍのポリイミドフィルム，エポキシ樹脂含浸アーラ
ミド繊維紙を用いてもよい。また、Ａ面のはんだ層４を
錫の金属間化合物と鉛のはんだ層５に変化させる際に、
Ｎ2 ・Ｈ2 ・アルゴン等の雰囲気中で加熱処理を行った
が、他の不活性ガスまたはフラックスの性質を有するフ
ロロカーボン・ロジンオイル・樹脂酸等の液体を媒体と
して加熱処理を行うようにしてもよい。The substrate 1 has a thickness of 0.05-4.
A 0 mm polyimide film or epoxy resin impregnated aramide fiber paper may be used. When the solder layer 4 on the A side is changed to the tin intermetallic compound and the lead solder layer 5,
The heat treatment was carried out in an atmosphere of N 2 , H 2 , argon, etc., but the heat treatment was carried out by using a liquid such as fluorocarbon, rosin oil, resin acid or the like having other inert gas or flux properties as a medium. Good.
【００１９】[0019]
【発明の効果】この発明のプリント配線板は、一面の導
体の上に設けた第１のはんだ層（錫の金属間化合物と鉛
との合金）の融点が、他面の導体の上に設けた第２のは
んだ層（錫と鉛の合金）の融点よりも高い。そのため、
部品を装着する際、まず、一面に第１のはんだ層を溶融
して装着部品のはんだ付けを行い、つぎに、一面を下に
して他面に装着部品のはんだ付けを行うとき第２のはん
だ層を溶融させるが、この際の温度で下にした一面の装
着部品の接合部分が溶融することはない。したがって、
装着部品の位置づれや落下もなく、はんだ接合強度が向
上し、長期信頼性が大幅に向上する。According to the printed wiring board of the present invention, the melting point of the first solder layer (the alloy of tin intermetallic compound and lead) provided on the conductor on one surface is provided on the conductor on the other surface. And the melting point of the second solder layer (an alloy of tin and lead). for that reason,
When mounting the component, first, the first solder layer is melted on one surface to solder the mounted component, and then, when the soldered component is soldered on the other surface with one surface facing down, the second solder The layer is melted, but at this temperature the joint portion of the one-side mounted component that is lowered is not melted. Therefore,
Solder joint strength is improved, and long-term reliability is greatly improved, with no misalignment or drop of mounted parts.
【００２０】この発明のプリント配線板の製造方法は、
基板の両面に形成した導体上に同一組成の錫と鉛の合金
からなるはんだ層を形成し、加熱処理により一面に形成
したはんだ層を錫の金属間化合物と鉛との合金に変化さ
せることにより、一面に形成したはんだ層の融点が他面
に形成したはんだ層の融点よりも高くなる。したがっ
て、この製造方法により作製したプリント配線板への部
品の装着では、まず、一面にはんだ付けを行い、つぎ
に、一面を下にして他面にはんだ付けを行うときに一面
の装着部品の接合部分が溶融することはなく、装着部品
の位置づれや落下もなく、はんだ接合強度が向上し、長
期信頼性が大幅に向上する。The method of manufacturing a printed wiring board according to the present invention comprises:
By forming a solder layer consisting of an alloy of tin and lead of the same composition on the conductors formed on both sides of the board and changing the solder layer formed on one surface by heat treatment to an alloy of tin intermetallic compound and lead The melting point of the solder layer formed on one surface is higher than the melting point of the solder layer formed on the other surface. Therefore, when mounting a component on a printed wiring board manufactured by this manufacturing method, first solder one surface, and then solder the mounted component on one surface when soldering the other surface with one surface facing down. The parts do not melt, the mounted parts are not misaligned and fall, the solder joint strength is improved, and the long-term reliability is greatly improved.
【図１】この発明の一実施例のプリント配線板の製造方
法を示す工程断面図である。FIG. 1 is a process sectional view showing a method of manufacturing a printed wiring board according to an embodiment of the present invention.
【図２】同実施例のプリント配線板の部品の装着工程を
示す断面図である。FIG. 2 is a cross-sectional view showing a process of mounting components of the printed wiring board of the same example.
１ 基板 ２ 導体 ４ 錫−鉛系のはんだ層（第２のはんだ層） ５ 錫の金属間化合物と鉛のはんだ層（第１のはんだ
層）1 Substrate 2 Conductor 4 Tin-lead solder layer (second solder layer) 5 Tin intermetallic compound and lead solder layer (first solder layer)
Claims (3)
の導体を備えたプリント配線板であって、 一面の前記導体の上に第１のはんだ層を設け、他面の前
記導体の上に第２のはんだ層を設け、前記第１のはんだ
層の融点を前記第２のはんだ層の融点よりも高くしたこ
とを特徴とするプリント配線板。1. A printed wiring board having conductors for soldering components on both sides of a substrate, wherein a first solder layer is provided on the conductor on one surface, and a conductor is provided on the conductor on the other surface. A printed wiring board comprising a second solder layer, wherein the melting point of the first solder layer is higher than the melting point of the second solder layer.
との合金とし、第２のはんだ層を錫と鉛の合金とした請
求項１記載のプリント配線板。2. The printed wiring board according to claim 1, wherein the first solder layer is an alloy of an intermetallic compound of tin and lead, and the second solder layer is an alloy of tin and lead.
だ付けするための導体上に同一組成の錫と鉛の合金から
なるはんだ層を形成する工程と、 前記一面に形成したはんだ層に不活性ガスまたは液体を
媒体として加熱処理を行い、前記一面に形成したはんだ
層を錫の金属間化合物と鉛との合金に変化させる工程と
を含むプリント配線板の製造方法。3. A step of forming a solder layer made of an alloy of tin and lead having the same composition on the conductors for soldering formed on both one surface and the other surface of the substrate, and the solder layer formed on the one surface. A method of manufacturing a printed wiring board, comprising the step of performing a heat treatment using an inert gas or a liquid as a medium to change the solder layer formed on the one surface into an alloy of an intermetallic compound of tin and lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5159392A JPH05259632A (en) | 1992-03-10 | 1992-03-10 | Printed wiring board and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5159392A JPH05259632A (en) | 1992-03-10 | 1992-03-10 | Printed wiring board and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05259632A true JPH05259632A (en) | 1993-10-08 |
Family
ID=12891213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5159392A Pending JPH05259632A (en) | 1992-03-10 | 1992-03-10 | Printed wiring board and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05259632A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6115515A (en) * | 1907-09-19 | 2000-09-05 | Nec Corporation | Optical device mounting board |
| EP3167992A1 (en) | 2015-09-11 | 2017-05-17 | NEC Space Technologies, Ltd. | Lead solder joint structure and manufacturing method thereof |
| US9877399B2 (en) | 2015-09-11 | 2018-01-23 | Nec Space Technologies, Ltd. | Lead solder joint structure and manufacturing method thereof |
-
1992
- 1992-03-10 JP JP5159392A patent/JPH05259632A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6115515A (en) * | 1907-09-19 | 2000-09-05 | Nec Corporation | Optical device mounting board |
| EP3167992A1 (en) | 2015-09-11 | 2017-05-17 | NEC Space Technologies, Ltd. | Lead solder joint structure and manufacturing method thereof |
| US9877399B2 (en) | 2015-09-11 | 2018-01-23 | Nec Space Technologies, Ltd. | Lead solder joint structure and manufacturing method thereof |
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