JPS6055594B2 - Melt plating equipment - Google Patents
Melt plating equipmentInfo
- Publication number
- JPS6055594B2 JPS6055594B2 JP13838080A JP13838080A JPS6055594B2 JP S6055594 B2 JPS6055594 B2 JP S6055594B2 JP 13838080 A JP13838080 A JP 13838080A JP 13838080 A JP13838080 A JP 13838080A JP S6055594 B2 JPS6055594 B2 JP S6055594B2
- Authority
- JP
- Japan
- Prior art keywords
- molten metal
- wire
- jet
- tank
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 title claims description 7
- 239000002184 metal Substances 0.000 claims description 36
- 229910052751 metal Inorganic materials 0.000 claims description 36
- 238000004026 adhesive bonding Methods 0.000 claims description 9
- 238000005192 partition Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 101150095744 tin-9.1 gene Proteins 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- -1 degreasing Chemical compound 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
- C23C2/36—Elongated material
- C23C2/38—Wires; Tubes
Description
【発明の詳細な説明】 本発明は溶融めつき装置に関する。[Detailed description of the invention] TECHNICAL FIELD The present invention relates to a hot melt gluing apparatus.
一般に、ゴム絶縁の施される電線や、接続の際ハンダ付
けを要する電線に使用する銅線には、変色を防止したり
、ハンダ付けを容易にするために、その表面に錫めつき
を施すことが慣行されている。Generally, copper wires used for rubber-insulated wires or wires that require soldering for connection are tinned on the surface to prevent discoloration and to facilitate soldering. It is common practice.
従来、このような銅線上への錫めつきは、第１図イ、口
、ハで示すように、溶融した金属錫１を収容した箱形の
溶融金属槽２の一部に設けられた蓋（図示せず）を開け
、入口ダイス３と出口ダイス４に銅線５を線掛けした後
、蓋を閉め、シリンダ等（図示ぜず）を用いて上記銅線
５の軸線中心として溶融金属槽２を傾動することにより
銅線５を浸漬し、該銅線５を連続走行させることにより
行なわれている。Conventionally, such tin plating on copper wire has been carried out using a lid provided on a part of a box-shaped molten metal tank 2 containing molten metal tin 1, as shown in FIG. (not shown) is opened, the copper wire 5 is wired around the inlet die 3 and the outlet die 4, the lid is closed, and the axis of the copper wire 5 is set at the center of the molten metal bath using a cylinder or the like (not shown). The copper wire 5 is immersed by tilting the copper wire 2, and the copper wire 5 is continuously run.
しカルながら、かかる従来のめつき装置においては、銅
線の線掛けに手間がかかり、また線材が錫の表面近くを
通過するため、表面上の酸化錫をまき込み易い欠点があ
る。However, in such conventional plating apparatuses, it takes time and effort to wire the copper wire, and since the wire passes near the surface of the tin, there is a drawback that tin oxide on the surface is easily mixed in.
加えて、銅線へのめつきの前処理としての脱脂、酸洗い
、乾燥が不十分であると、入口ダイスおよび出口ダイス
に穿設された孔を中心に酸化物の付着が起こり、また水
分等の影響で錫が固まる為線材の走行中に線切れを起こ
しやすい。さらに、線材の太さや、線速の変更などによ
り、浸漬距離を変えたい場合には溶融金属槽を適宜交換
せざるを得ないため、作業性が悪いなどの難点を有して
いる。本発明はかかる難点を解消するためになされたも
ので、線材を溶融金属中に連続的に走行させて、該線材
の表面上に溶融めつきを施して出口ダイスから引出すよ
うに構成された溶融めつき装置において、前記溶融金属
を収容する溶融金属貯溜槽と、前記線材の走行方向に対
して移動自在な仕切板を有する噴流口の形成された溶融
金属噴流槽とを連通せしめ、前記溶融金属噴流槽の前記
噴流口へ噴流を形成するための圧送手段を前記溶融金属
噴流槽内に配設し、前記線材の走行方向に前記ダイスを
着脱自在に装着するためのダイス収納部を設けたことを
特徴とする溶融めつき装置を提供するものである。In addition, if the pre-treatments for plating copper wire such as degreasing, pickling, and drying are insufficient, oxides will adhere to the holes drilled in the inlet and outlet dies, and moisture etc. Because the tin hardens due to the influence of the wire rod, it is easy to break the wire while it is running. Furthermore, when it is desired to change the immersion distance by changing the thickness of the wire or the wire speed, the molten metal tank must be replaced as appropriate, which has the disadvantage of poor workability. The present invention has been made in order to solve such difficulties, and is a molten metal melting method configured to continuously run a wire rod through molten metal, apply melt gluing on the surface of the wire rod, and pull it out from an exit die. In the plating apparatus, a molten metal storage tank containing the molten metal and a molten metal jet tank in which a jet port is formed and has a partition plate that is movable with respect to the running direction of the wire rod are communicated, and the molten metal A pressure feeding means for forming a jet to the jet port of the jet tank is disposed in the molten metal jet tank, and a die storage part is provided for detachably mounting the die in the running direction of the wire rod. The present invention provides a melt gluing device characterized by the following.
以下図面に基づいて本発明の一実施例につき詳細に説明
する。An embodiment of the present invention will be described in detail below based on the drawings.
本発明に係る溶融めつき装置は、第２図に示すように、
溶融金属貯溜槽６と、溶融金属噴流槽７と、圧送手段８
とからなり、各部材はそれぞれ次のように構成されてい
る。As shown in FIG. 2, the melt gluing device according to the present invention has the following features:
Molten metal storage tank 6, molten metal jet tank 7, and pressure feeding means 8
Each member is constructed as follows.
溶融金属貯溜槽６は、溶融した金属錫９を収容するため
のもので、上面には該金属錫９の酸化を防止するための
蓋１０が設けられている。溶融金属噴流槽７は、上記溶
融金属貯溜槽６の内側に配設されると共に該金属貯溜槽
６に連通されている。そして上部には、第２図口の矢標
ａの向きに移動自在な仕切板１１を有する噴流口１２が
形成され、また該噴流口１２の外側には、第３図で示す
ように、ダイス１３を着脱自在に装着するためのダイス
収納部１４が取着されている。第３図において、１５は
線材たとえば銅線を表わしている。圧送手段８は、上記
溶融金属噴流槽７の中に配設され、モーター（図示せず
）に連動されるポンプ１６を使用している。続いて、か
かる装置を用いての溶融めつき方法；について言及する
。まず、銅線１５を入口ダイス１３に貫通させたのち、
蓋１０を開け、上記ダイス１３をダイス収納部１４に装
着する。The molten metal storage tank 6 is for storing molten metal tin 9, and is provided with a lid 10 on its upper surface to prevent oxidation of the metal tin 9. The molten metal jet tank 7 is disposed inside the molten metal storage tank 6 and is communicated with the metal storage tank 6. A jet port 12 having a partition plate 11 that is movable in the direction of the arrow a of the opening in FIG. A dice storage section 14 for detachably mounting the dice 13 is attached. In FIG. 3, 15 represents a wire, such as a copper wire. The pumping means 8 uses a pump 16 disposed in the molten metal jet tank 7 and linked to a motor (not shown). Next, a method of melting and gluing using such an apparatus will be described. First, after passing the copper wire 15 through the entrance die 13,
The lid 10 is opened and the dice 13 are mounted in the dice storage section 14.
その時には、まだ圧送手段８が作動されていない状態に
あり、溶融金属貯溜ｊ槽６と溶融金属噴流槽７との溶融
金属９の上面は同じ高さにある。次いで蓋１０を閉じ銅
線１５を矢標ｂ（第３図）の方向に連続的に走行させた
後、圧送手段８を作動させ、溶融金属噴流槽７に設けら
れた噴流口１２に噴流を形成して上記銅線１５を浸漬さ
せることにより、該銅線１５の表面上にめつきを施して
出口ダイス１３から引出す。以上の実施例からも明らか
なように本発明によれば、線材の貫通されたダイスをダ
イス収納部へ落し込むことで線材の装着ができるので、
線掛け”が極めて簡単となり、また入口側ダイスが不要
となるとともに溶融金属をたえず循環させているので、
線材は常に酸化されていない錫中にてメッキされるため
良好なメッキが得られる利点がある。さらに線材の太さ
や、線速などにより浸漬距離を変えたい場合には噴流口
に取着した仕切板を適宜移動するだけですむので、作業
性は極めて良くなる。尚、上記説明においては、銅線の
みについて記述してきたが、溶融めつきを施すことので
きる線材ならば種類を問わないし、また溶融金属として
は溶融錫以外のものでも良いことはもちろんである。At that time, the pumping means 8 is not yet in operation, and the upper surfaces of the molten metal 9 in the molten metal storage tank 6 and the molten metal jet tank 7 are at the same height. Next, the lid 10 is closed and the copper wire 15 is made to run continuously in the direction of arrow b (FIG. 3), and then the pressure feeding means 8 is activated to send a jet to the jet port 12 provided in the molten metal jet tank 7. By forming and dipping the copper wire 15, the surface of the copper wire 15 is plated and pulled out from the exit die 13. As is clear from the above embodiments, according to the present invention, the wire can be attached by dropping the die through which the wire has been passed into the die storage section.
``Wire hooking'' is extremely easy, and there is no need for a die on the inlet side, and the molten metal is constantly circulated.
Since the wire rod is always plated in unoxidized tin, there is an advantage that good plating can be obtained. Furthermore, when it is desired to change the immersion distance depending on the thickness of the wire, the wire speed, etc., it is only necessary to move the partition plate attached to the jet port as appropriate, so the workability is extremely improved. In the above description, only copper wire has been described, but any type of wire can be used as long as it can be hot-melted, and it goes without saying that the molten metal may be other than molten tin.
さらに、溶融金属の酸化をさらに減少させるためＮ２な
どの不活性ガスを充満させても良い。Additionally, it may be filled with an inert gas such as N2 to further reduce oxidation of the molten metal.
第１図イ，口，ハは従来の溶融めつき装置の説明図、第
２図イ，口は本発明に係る溶融めつき装置の説明図、第
３図は第２図の装置の噴流口およびダイス収納部を示し
ている。
６・・・・・・溶融金属貯溜槽、７・・・・・・溶融金
属噴流槽、８・・・・・・圧送手段。Figure 1 A, mouth and C are explanatory diagrams of a conventional melting gluing device, Figure 2 A and mouth are explanatory diagrams of a melting gluing device according to the present invention, and Figure 3 is a jet port of the equipment shown in Figure 2. and the dice storage section. 6... Molten metal storage tank, 7... Molten metal jet tank, 8... Pressure feeding means.
Claims (1)
表面上に溶融めつきを施して出口ダイスから引出すよう
に構成された溶融めつき装置において、前記溶融金属を
収容する溶融金属貯溜槽と、前記線材の走行方向に対し
て移動自在な仕切板を有する、噴流口の形成された溶融
金属噴流槽とを連通せしめ、前記溶融金属噴流槽の前記
噴流口へ噴流を形成するための圧送手段を前記溶融金属
噴流槽内に配設し、前記線材の走行方向に前記ダイスを
着脱自在に装着するためのダイス収納部を設けたことを
特徴とする溶融めつき装置。1. A molten metal reservoir that stores the molten metal in a molten metal gluing device configured to continuously run a wire through molten metal, apply molten gluing onto the surface of the wire, and pull it out from an exit die. The tank is connected to a molten metal jet tank in which a jet port is formed and has a partition plate that is movable with respect to the running direction of the wire rod, and for forming a jet flow to the jet port of the molten metal jet tank. A molten plating apparatus, characterized in that a pressure feeding means is disposed in the molten metal jet tank, and a die storage section is provided in which the die is detachably mounted in the running direction of the wire rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13838080A JPS6055594B2 (en) | 1980-10-03 | 1980-10-03 | Melt plating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13838080A JPS6055594B2 (en) | 1980-10-03 | 1980-10-03 | Melt plating equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5763674A JPS5763674A (en) | 1982-04-17 |
| JPS6055594B2 true JPS6055594B2 (en) | 1985-12-05 |
Family
ID=15220573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13838080A Expired JPS6055594B2 (en) | 1980-10-03 | 1980-10-03 | Melt plating equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6055594B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS641915Y2 (en) * | 1984-03-07 | 1989-01-17 |
-
1980
- 1980-10-03 JP JP13838080A patent/JPS6055594B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS641915Y2 (en) * | 1984-03-07 | 1989-01-17 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5763674A (en) | 1982-04-17 |
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