JPH0532466B2 - - Google Patents

Description

Detailed Description of the Invention (Industrial Application Field) This invention produces a plated wire having a uniform plating thickness by continuously immersing the metal wire in a molten metal bath or a molten alloy bath. The present invention relates to a melt plating device.

(Prior Art) Conventionally, an apparatus having a configuration as shown in FIG. 2 is known as an apparatus for plating metal wire by a hot-dip plating method. That is, a molten metal 2 is stored in a plating tank 1, a metal wire 9 is passed through the molten metal 2 by a sinker roll 41, and then a plating die floating or fixed in the molten metal 2 is placed. The metal wire 9 is inserted through the metal wire 40 and pulled out vertically upward as shown by the arrow, and the molten metal 2 adhering to the surface of the metal wire 9 is squeezed with the plating die 40 to obtain a constant plating thickness. ing.

However, in the case of the above device, the difference in cross-sectional area between the die 40 and the metal wire 9 is a major factor in controlling the supply amount of the molten metal 2 (adhesive plating thickness), and in order to generate plating with a uniform thickness, metal wire 9
needs to be positioned in the vertical direction so that it passes through the center of the hole in the die 40, but since the difference in cross-sectional area is extremely small, such positioning control is practically impossible. In particular, when the die 40 is suspended on the surface of the molten metal, the die 40 oscillates due to minute vibrations of the metal wire 9 and the resulting vibrations or ripples of the molten metal 2, which causes damage to the plating film. It is unavoidable that uneven thickness occurs. There is also the problem that the work of inserting the metal wire 9 into the die 40 is time-consuming.

The vibration or rippling phenomenon of the molten metal 2 is due to minute vibrations generated as the metal wire 9 runs, and the vibrations of the metal wire 9 are generated by rotating parts such as the sinker roll 41. As a result of various studies, it has become clear that the vibration of the molten metal 2 in the vicinity of the sinker roll 41 has an influence on the liquid level.

Generally, in the above-mentioned apparatus, a large number of metal wires 9 are plated at the same time, but even if the work is performed with the same wire diameter and the same linear speed, the tension of each metal wire 9 is slightly different. , a slight difference in wire diameter, etc. will affect the sinker roll 41 in the form of a difference in circumferential speed. Furthermore, conventionally, as the sinker roll 41, a single roller in which grooves are formed in the number of metal wires 9 is used, but when the metal wire 9 is guided to the sinker roll 41, It was also found that the difference in the values caused the vibration of the metal wire 9.

(Purpose of the invention) This invention was made to solve such conventional problems, and by eliminating as much as possible the causes of various adverse effects as described above,
An object of the present invention is to provide a melt galvanizing device capable of producing a melt galvanized wire having a plated layer with a uniform thickness.

(Structure of the Invention) This invention provides an apparatus for continuously melt-welding a plurality of metal wires, in which sinker rolls are installed individually so that they can rotate independently in accordance with the running of each metal wire. a plating bath vibration prevention section consisting of a surrounding wall that individually isolates the metal wire in the melting bath from the vicinity of the sinker roll to the vicinity of the outlet of the metal wire, and the inlet and outlet of the metal wire of the plating bath. and a gas seal section for supplying inert gas or reducing gas.

With the above configuration, the influence of vibration is removed by individually enclosing the metal wire that is pulled up into the plating bath, and the contamination of impurities at the part where the metal wire enters and exits the plating bath is prevented. There is.

(Example) In FIG. 1, molten solder (plating bath) 2 is stored in a molten plating tank 1, and a guide roll 3 and a sinker roll 4 are arranged at predetermined positions in the molten solder 2. There is. Then, the metal wire 9 is guided from a metal wire supply device (not shown) through a tension adjustment roller 12 and a guide roll 3 to a sinker roll 4, from which it is taken out vertically upward. The reason why the guide roll 3 is arranged is to prevent minute vibrations of the metal wire 9 generated between the metal wire supply device and the plating device from being transmitted to the sinker roll 4. Metal wire 9 is molten solder 2
A protective member 8 is placed on the liquid level that enters the inside, and an inert gas or reducing gas such as nitrogen or argon is sprayed onto the liquid level in the protective member 8 through a nozzle 80 to prevent the liquid level from oxidizing. This prevents foreign matter from adhering to the surface of the metal wire 9.

Antioxidant oil 22 is floated on the surface (liquid level) of the molten solder 2 so as to cover the entire bath surface of the molten solder 2 in order to prevent the formation of oxides. On the other hand, if this antioxidant oil 22 is also present in the part where the metal wire 9 enters from the bath surface and the part where it exits from the bath surface, it may adhere to the metal wire 9 and enter the bath, or the molten solder 2 It may happen that they are mixed inside. If this happens, not only will some unplated parts occur, but also impurities other than solder will accumulate in the molten solder 2, which will hinder the formation of a uniform plated layer. In order to prevent this, the area around the metal wire 9 is sealed with an inert gas, such as argon gas or nitrogen gas, at the part where the metal wire 9 enters the bath and the part where it exits from the bath surface. There is. Note that, instead of the inert gas, a reducing gas such as ammonia decomposition gas may be used. Regarding the pressure and flow rate of the gas, there is no need for particularly precise control, and the point is that it is sufficient to prevent the molten solder surface in the portion through which the metal wire 9 passes from being oxidized. Therefore, it is preferable to reduce the running cost by reducing the amount of gas used, and for this purpose, the area of the gas discharge port, that is, the area of the liquid surface in the protective member 8 and the surrounding wall 5, is reduced by the metal wire 9. , 90, it is desirable to keep it as narrow as possible without contacting it.

A surrounding wall (plating bath vibration prevention section) 5 is provided above the sinker roll 4 so as to surround the metal wire 9 that passes through the sinker roll 4 and moves upward, and the upper and lower ends of the surrounding wall 5 are Partition wall 6
and 60 are provided. The plated metal wire 90 is allowed to rise through the holes in the upper and lower partition walls 6, 60. This lower partition wall 60 is configured such that vibration of the molten solder 2 around it due to the rotation of the sinker roll 4 causes the molten metal 2 in the surrounding wall 5 to
It functions to prevent transmission from occurring. A nozzle 80 is formed in a part of the surrounding wall 5, through which an inert gas is supplied, and is discharged from the hole in the upper partition wall 6, thereby discharging the molten solder 2 inside the surrounding wall 5.
This is to prevent oxidation of the liquid level.

Although only one metal wire 9 is shown in the drawing, multiple metal wires 9 are shown in the direction perpendicular to the plane of the paper.
are arranged, each having the configuration shown in the figure. The surrounding wall 5 is formed in a cylindrical shape so as to surround each metal wire 9 (to isolate each metal wire 9 from each other), and prevents vibrations caused by movement of the metal wire 9 from reaching other metal wires 9. There is. Further, the guide roll 3 and the sinker roll 4 are configured to rotate independently of each other with respect to each metal wire 9.

A non-contact displacement sensor 10 is provided above the surrounding wall 5.
is provided, and the tension adjustment roller 12 is operated via the controller 11.

In the above device, waves and vibrations due to the rotation of the sinker roll 4 propagate through the molten solder 2, but
The molten solder 20 in the surrounding wall 5 has a surrounding wall 5 and a partition wall 6.
It is blocked by 0 and does not propagate. Also, guide roll 3
Since the sinker roll 4 is independent for each metal wire 9, the metal wire 9 rising from the sinker roll 4 is not affected by vibrations from other metal wires 9 and rises quietly in the surrounding wall 5. , therefore the metal wire 9
0 is plated to a uniform thickness. Note that if vibration occurs in the metal wire 90 for some reason, the vibration is detected by the non-contact displacement sensor 10, and the vibration is suppressed by operating the tension adjustment roller 12 via the controller 10. I'm trying to make it disappear.

Example 1 Using the apparatus of the above example, a metal wire 90 was manufactured by melt-plating an alloy of 37% lead and 63% tin on the surface of a copper wire with a diameter of 0.5 mm, and the thickness unevenness was measured. . The thickness unevenness was measured by measuring the cross-sectional plating thickness using an optical microscope, setting the maximum plating thickness to T, and the minimum plating thickness to t, and calculating it as (T-t)/T×100%.

As a result of comparison with solder-plated copper wire manufactured using conventional equipment as a comparative material, the thickness unevenness rate (%) of the conventional samples (3 pieces) was 65, 70, and 75, respectively.
The samples (3 pieces) of this invention were 25, 27, and 22.
As described above, it can be seen that according to the present invention, the thickness deviation of the plating is smaller than that of the conventional example, and the plating thickness is extremely uniform.

(Effects of the Invention) As explained above, the present invention provides a plating bath vibration prevention part in a hot-melting plating apparatus, and also provides a neutral or By providing a gas seal to maintain a reducing atmosphere, plating can be performed without being affected by vibrations.
It is possible to produce a melt-plated wire having a plated layer with a uniform thickness.

[Brief explanation of the drawing]

Fig. 1 is an explanatory diagram showing an embodiment of the present invention;
The figure is an explanatory diagram of a conventional device. DESCRIPTION OF SYMBOLS 1... Melt plating tank, 2... Molten solder, 3... Guide roll, 4... Sinker roll, 5... Surrounding wall, 8... Protective member, 9, 90... Metal wire.

Claims (1)

[Claims] 1. In a device that continuously melts and welds multiple metal wires, separate sinker rolls are provided so that they can rotate independently in accordance with the running of each metal wire, and from the vicinity of this sinker roll, a plating bath vibration prevention section consisting of a surrounding wall that individually isolates the metal wires in the melting plating tank up to the vicinity of the exit of the metal wires;
A fusion plating apparatus characterized in that a gas seal part is provided for supplying an inert gas or a reducing gas to an inlet part and an outlet part of a metal wire in a plating bath.