JPS593572U - Device for removing soldered electronic components from printed circuit boards, etc. - Google Patents
Device for removing soldered electronic components from printed circuit boards, etc.Info
- Publication number
- JPS593572U JPS593572U JP9923282U JP9923282U JPS593572U JP S593572 U JPS593572 U JP S593572U JP 9923282 U JP9923282 U JP 9923282U JP 9923282 U JP9923282 U JP 9923282U JP S593572 U JPS593572 U JP S593572U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- electronic components
- circuit boards
- soldered electronic
- removing soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案−実施例の装置の上面斜視図、第2図は
第1図■−■線の断面図である。図で、14はハンダ槽
凹所、16.18は溝を示す。FIG. 1 is a top perspective view of a device according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line 1--2 in FIG. In the figure, 14 indicates a solder tank recess, and 16.18 indicates a groove.
Claims (1)
上面に凹所を設けてハンダ槽を形成し、プリント基板等
にハンダ付けされた取外すべき電子部品の接続ピン群の
パターンに対応する形態の深溝を上記凹所内に形成して
なるプリント基板等よりハンダ付けされた電子部品を取
外すための装置。An integrally molded metal product connected to a heating means, with a recess formed on its top surface to form a solder bath, corresponding to the pattern of a group of connection pins of an electronic component to be removed soldered to a printed circuit board, etc. A device for removing soldered electronic components from a printed circuit board, etc., in which a deep groove is formed in the recess.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9923282U JPS593572U (en) | 1982-06-30 | 1982-06-30 | Device for removing soldered electronic components from printed circuit boards, etc. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9923282U JPS593572U (en) | 1982-06-30 | 1982-06-30 | Device for removing soldered electronic components from printed circuit boards, etc. |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS593572U true JPS593572U (en) | 1984-01-11 |
Family
ID=30235253
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9923282U Pending JPS593572U (en) | 1982-06-30 | 1982-06-30 | Device for removing soldered electronic components from printed circuit boards, etc. |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS593572U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62248955A (en) * | 1986-04-21 | 1987-10-29 | Matsushita Electric Ind Co Ltd | Hot water supplier equipped with additional burning function |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5019928B1 (en) * | 1968-01-31 | 1975-07-10 |
-
1982
- 1982-06-30 JP JP9923282U patent/JPS593572U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5019928B1 (en) * | 1968-01-31 | 1975-07-10 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62248955A (en) * | 1986-04-21 | 1987-10-29 | Matsushita Electric Ind Co Ltd | Hot water supplier equipped with additional burning function |
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