JPS58177968U - Solder deep carrier for printed circuit boards - Google Patents

Solder deep carrier for printed circuit boards

Info

Publication number
JPS58177968U
JPS58177968U JP7425382U JP7425382U JPS58177968U JP S58177968 U JPS58177968 U JP S58177968U JP 7425382 U JP7425382 U JP 7425382U JP 7425382 U JP7425382 U JP 7425382U JP S58177968 U JPS58177968 U JP S58177968U
Authority
JP
Japan
Prior art keywords
printed circuit
solder
circuit boards
deep carrier
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7425382U
Other languages
Japanese (ja)
Inventor
岩沢　淳一
表　秀昭
Original Assignee
ソニー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ソニー株式会社 filed Critical ソニー株式会社
Priority to JP7425382U priority Critical patent/JPS58177968U/en
Publication of JPS58177968U publication Critical patent/JPS58177968U/en
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は噴流式デツプ槽の説明図、第２図は溶融半田に
プリント基板が突入したときの説明図、第３図ａ、　　
ｂはこの考案の半田デツプキャリヤの側面図と平面図、
第４図はこの考案の他の実施例を示す斜視図である。 図中、１１は半田デツプキャリヤ、１２は開孔、１３は
折曲部を示す。Figure 1 is an explanatory diagram of a jet-flow type dip tank, Figure 2 is an explanatory diagram of a printed circuit board plunged into molten solder, and Figure 3 a.
b is a side view and a top view of the solder dip carrier of this invention;
FIG. 4 is a perspective view showing another embodiment of this invention. In the figure, 11 is a solder dip carrier, 12 is an opening, and 13 is a bent portion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板を電載する開孔を形成した半田デツプキャ
リヤにおいて、その移動方向の端部を上方に折曲げ、折
曲部を設けたことを特徴とするプリント基板用半田デツ
プキャリヤ。1. A solder dip carrier for a printed circuit board, characterized in that the solder dip carrier has an opening for electrically mounting a printed circuit board, and the end portion in the direction of movement thereof is bent upward to provide a bent portion.
JP7425382U 1982-05-22 1982-05-22 Solder deep carrier for printed circuit boards Pending JPS58177968U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7425382U JPS58177968U (en) 1982-05-22 1982-05-22 Solder deep carrier for printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7425382U JPS58177968U (en) 1982-05-22 1982-05-22 Solder deep carrier for printed circuit boards

Publications (1)

Publication Number Publication Date
JPS58177968U true JPS58177968U (en) 1983-11-28

Family

ID=30083700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7425382U Pending JPS58177968U (en) 1982-05-22 1982-05-22 Solder deep carrier for printed circuit boards

Country Status (1)

Country Link
JP (1) JPS58177968U (en)

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