JPS5853185U - automatic soldering equipment - Google Patents

automatic soldering equipment

Info

Publication number
JPS5853185U
JPS5853185U JP14811881U JP14811881U JPS5853185U JP S5853185 U JPS5853185 U JP S5853185U JP 14811881 U JP14811881 U JP 14811881U JP 14811881 U JP14811881 U JP 14811881U JP S5853185 U JPS5853185 U JP S5853185U
Authority
JP
Japan
Prior art keywords
automatic soldering
soldering equipment
wiring board
advancing
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14811881U
Other languages
Japanese (ja)
Inventor
政雄 林
村松　秀哲
白石　潔
稔 佐藤
Original Assignee
クラリオン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by クラリオン株式会社 filed Critical クラリオン株式会社
Priority to JP14811881U priority Critical patent/JPS5853185U/en
Publication of JPS5853185U publication Critical patent/JPS5853185U/en
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図は、本考案の一実施例の概念図である。 １・・・・・・はんだ槽、２・・用チイドレール、４・
・曲−・プリント配線板。The figure is a conceptual diagram of an embodiment of the present invention. 1. Solder bath, 2. Chiid rail, 4.
・Song-・Printed wiring board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] はんだ槽内のはんだ面とプリント配線板とが接触した状
態において、該プリント配線板を少なくとも前進、後退
及び前進させる手段を具備したことを特徴とする自動は
んだ付は装置。An automatic soldering device characterized by comprising means for at least advancing, retracting, and advancing a printed wiring board in a state where the solder surface in a solder bath and the printed wiring board are in contact with each other.
JP14811881U 1981-10-07 1981-10-07 automatic soldering equipment Pending JPS5853185U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14811881U JPS5853185U (en) 1981-10-07 1981-10-07 automatic soldering equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14811881U JPS5853185U (en) 1981-10-07 1981-10-07 automatic soldering equipment

Publications (1)

Publication Number Publication Date
JPS5853185U true JPS5853185U (en) 1983-04-11

Family

ID=29940942

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14811881U Pending JPS5853185U (en) 1981-10-07 1981-10-07 automatic soldering equipment

Country Status (1)

Country Link
JP (1) JPS5853185U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS583300A (en) * 1981-06-30 1983-01-10 株式会社タムラ製作所 Soldering method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS583300A (en) * 1981-06-30 1983-01-10 株式会社タムラ製作所 Soldering method

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